THE INTERNATIONAL MICROELECTRONICS AND PACKAGING SOCIETY

  Corporate Shop Window
search site:
jump to:
welcome   IMAPS   membership   news   events   directory   contact   
imaps-uk logo
link to the academia section of the members' directorylink to the services section of the members' directorylink to the materials section of the members' directorylink to the equipment section of the members' directorylink to the components section of the members' directorylink to contents page of the members' directory

Components

This page lists the IMAPS-UK members who produce or provide components for the microelectronics and packaging industries.  Please select from the categories below to go directly to that section.  For other, more general, categories please select from the tabs above.

lead framesmetal packages & lidssemiconductor die


Click on the name of an IMAPS-UK member to reveal their address.


Lead Frames

Batten & Allen Ltd
Miniature precision stampings for use in electronics applications including leadframes for Hybrid and Thick Film Industries, Telecommunications (mobile and exchange), tantalum chip capacitor leadframes, IDC terminals and sensors. Open tools for Hybrid and Thick Film leadframes. ISO9001. Tool design and manufacture. 7 reel to reel post plating lines


Precision Micro Ltd
Photo etching; manufacturer of leadframes heat sinks, EMC/RF shields/screens, terminal arrays springs,brackets, encoder discs, SMT stencils.

top of page


Metal Packages & Lids

Inseto (UK) Ltd
Hermetic packages suitable for all applications, with glass or ceramic feedthroughs; machined housings, fully plated and assembled. Matching lids.

Olin Aegis
Leading manufacturer for Hi-Rel hermetic packages; full range of creative designs to meet
your needs - from simple to complex.

SGA Technologies
Design and manufacture of hermetic packages, connectors and feedthrough's; custom designs and integrated ceramic substrates etc. Resistance welding/wire bonding, soldered assemblies and component assembly. High volume contract plating-particularly Aluminium for microwave applications. EDM, CNC and pressed component.

Tecan Components Ltd
Precision photo etched parts including leadframes, hybrid lids for packages, crystal masks, encoder discs, meshes and seives. Plus etched, laser cut and electroformed stencils including multi level Surface Mount stencils. Electroforming bespoke parts for ultra high tolerances.

TWM Technology Ltd
Machined aluminium housings for microwave and other applications; supplied plated and fully assembled with hermetic feedthroughs. Packages incorporating MMC materials for reduced weight and good thermal conductivity are offered alongside an extensive range of glass/metal sealed packages.


 

top of page


Semiconductor Die



Eltek
Eltek offers a comprehensive die processing and assembly service for all applications. Memories, micros,programmable devices, logic and linears offered at competitive prices.


Mintech Semiconductors Ltd
Mintech is an approved die assessor for unencapsulated semiconductor die. Offering die
processing, solutions to obsolescence, electrical testing and custom packaging.



top of page

 

 

  ©  IMAPS-UK 1997-2003pci web design