| Equipment
This page lists the IMAPS-UK members
who produce or provide equipment for the microelectronics and packaging industries.
Please select from the categories below to go directly to that section.
For other, more general, categories please select from the tabs above.
Click on the name of an IMAPS-UK member to reveal their address.
Die Bonders, Wire Bonders, Bond Testers
Inseto
(UK) Ltd
A range of manual to automatic die bonders, wire bonders &
bond testers.
SITEST
Bond tools, wafer aligners, measuring equipment.
Furnaces, Ovens, Solder Reflow/Repair
BTU
Europe Limited
Inspection
Inseto
(UK) Ltd
A range of batch through inline X-Ray systems, for small to
large area inspection, from 10 to 225kV. X-TEK
Systems Ltd
Real time X-ray inspection up to 1800 times magnification
and 5 micron resolution of a variety of engineering samples and electronic components
to aid fault analysis and reveal voids, shorts and wire bond cracks.
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Lasers - Trimmers, Drilling, Probe Cards
Laser
SOS Ltd
Manufacture of high quality yag laser spares, probecards and
probes for over 100 different laser systems; ISO 9002 certified.
Low
Temperature Co-Fired Ceramics (LTCC)
Unichem
Industries (Europe) Ltd
Distributors for UHT Punching machines and
Meiko Hole Inpection Systems for LTCC and Flexible Circuits.
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Hermetic Sealing Metal Packages
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Screens/ Printing
G
Bopp & Co
Manufacturers of woven and wire screens.
Micro Metallic
Ltd
Photo etching; SMT stencils; manufactures of leadframes, heat sinks,
EMC/RF shields/screens, terminal arrays, gaskets, springs, brackets and encoders
discs.
Tecan
Components
Precision photo etched parts, including leadframes, microwave
conductors, etched electroformed and multi level electroformed Surface Mount stensils.
Electroforming for ultra tight tolerances.
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