The IMAPS-UK organised MicroTech 21 Online Conference on Heterogeneous Integration explored many aspects of Heterogeneous Integration covering packaging developments for ICs, power modules and photonics, materials, processes and including wider considerations of sustainability, equality, diversity and inclusivity within the electronics industry. Download the If you need any further information, please contact email@example.com
Research Showcase: Recent Advances on Reliability and Gate Driving of WBG Power Electronics – 11-12 January 2021 – Downloads
The IMAPS-UK Research Showcase – Recent Advances on Reliability and Gate Driving of WBG Power Electronics addressed several of the key issues critical to the increased adoption of Wide Bandgap (WBG) Semiconductors within the growing power electronics industry. This event was supported by The Centre for Power Electronics and sponsored by Inseto Ltd. Programme Literature […]
IMAPS-UK announce Call for Abstracts for MicroTech 2021 – Heterogeneous Integration – Packaging Future Microsystems
IMAPS-UK are pleased to announce a Call for Abstracts for MicroTech 2021 on the theme of Heterogeneous Integration – Packaging Future Microsystems. MicroTech 2021 will be held Online on Thursday 25 March 2021. The main conference topics are based on the Heterogeneous Integration Roadmap produced by the IEEE-EPS, covering the following chapters: High Performance Computing […]
Fundamentals of Electronic Packaging Tutorial – A Survey of Failure Analysis Techniques for Packaging by Greg Johnson, Zeiss Microscopy – 23 October 2020
This Packaging Tutorial was supported by Zeiss Microscopy In order to access a copy of the Audio Version of the presentation, please subscribe to Zeiss Microscopy News. If you require a copy of the presentation, you can download here: – 21MB
IMAPS-UK Webinar Design for Manufacturing Click on the above heading to download and view the video of the Design for Manufacturing Webinar held on 11th March 2020. It lasts approximately 1 hour 15 minutes. If you just require a copy of the slides, you can download here: IMAPS UK Webinar Design for Manufacturing
This IMAPS-UK organised RelQual 2020: Quality and Reliability for Electronic Assembly Workshop and sponsored by Nordson Dage was held at TWI, Abington, Cambridge on 6 February 2020 explored many aspects of New Product Introduction and the challenges faced by the micro-electronics industry in satisfying more demanding customer needs. Download a copy of the event report […]
IMAPS-UK Webinar Micro-Electronics Packaging for Harsh Environments Click on the above heading to download and view the video of the Micro-Electronics Packaging for Harsh Environments Webinar held on 20th January 2020. It lasts approximately 1 hour 20 minutes. If you just require a copy of the slides, you can download here: IMAPS UK Micro-Electronics […]
This IMAPS-UK organised Micro-Electronics Packaging for Harsh Environments Conference held at the Satellite Applications Catapult in Harwell on 28 November 2019 provided guidance for designers and engineers to select suitable electronic packaging materials and processes for extreme environment applications. Download a copy of the event report HERE.
The theme of MicroTech 2019 was “Power in Packaging”, reviewing the materials, processes and equipment required to manufacture “state of the art” power modules for the transportation and energy industries. Download a copy of the event report here ..
The Interconnect of Things (IoT) workshop was held at the CPI Darlington Facility on 7 February 2019, supported by the CPI Newton Aycliffe. A brief event report is now available …. It can also be downloaded here … or from the website area – Free downloads