Cambridge CB21 6GP
John manages the interconnect activities within the Science and Technology Facilities Council. These activities include wire bonding, fine pitch flip-chip bonding and sensor module assembly and packaging. He is engaged in a range of new interconnect developments and has a personal interest in area array interconnects and their application to hybrid pixel sensors. Prior to the interconnect work, he was a project manager, delivering a range of radiation detectors to various science facilities in Europe.
Summary of IMAPS-UK Activities:
– 2014 joined the IMAPS-UK committee
– 2017 became Assistant Treasurer
– 2018 became Vice Chair
– 2020 became Chair