MicroTech 2017 brings together experts from across the microelectronics sector to discuss the latest technologies and developments, as well as providing a platform to highlight current commercial opportunities.  The event features invited Keynote talks, technical presentations & table top exhibits on the latest developments, technologies and capabilities. It also incorporates a high-impact oral session and poster displays from UK research.

This year’s conference theme is: “Advanced Packaging & Technology Trends“.

The Academic keynote will be “Internet of Skills – Where 5G IoT Communications, Robotics and AI Meet” presented by Professor Mischa Dohler, Head of the Centre for Telecom Research, Chair Professor, King’s College London, Fellow, IEEE & Royal Society of Arts.

MicroTech 2017 provides opportunity for:

• updates on the latest developments, materials, devices & technologies in microelectronic & related packaging
• networking with end-users, researchers, supply chains and technology providers
• review of related research from leading Academic institutions
• discovering new products and business solutions

If you would like to present a poster for this year’s event, please see our call for posters: https://www.imaps.org.uk/wp-content/uploads/2016/12/IMAPS-UK_MT17_Call_for_Posters.pdf

For more information, including the full programme of the day, and to register: https://www.imaps.org.uk/events/microtech-2017-advanced-packaging-technology-trends/