Advanced Packaging Webinar – update

IMAPS-UK Packaging Webinar held on 3rd July @ 14.30

This was the First of a series of Webinars …..53 people signed up for it.  But if you missed it and want to see it it is availbale (but only to members) via the link on our website –

….If you are an IMAPS-UK member …Click here 

Number one of a series of webinars organised by IMAPS-UK (International Microelectronics, Assembly and Packaging Society) to showcase presentations given at previous IMAPS events. – This webinar featured two presentations that were first given at the IMAPS/Innovate UK “Advanced Packaging for Compound Semiconductor Applications” workshop in Birmingham.

High Temperature Packaging for SiC Devices by Liam Mills, TT Semelab
And
Advanced Packaging for RF/Microwave Applications by Steve Riches, Tribus-D

Also you will be pleased to know that we will be running the next on on the 6th September – on next generation Packaging presented at MicroTech 2018

NOTE:  This one was Free of charge to join. It is our intention to charge non-members at some point.  So treat this as a member benefit.