Coventry CV7 9JU
Liam received a BEng (Hons) in Aerospace Engineering from the University of Liverpool in 2005. Soon after graduating he joined TT Electronics where roles in Quality, Power Module design and R&D provided the foundation to a career in semiconductor packaging during his 13 years with the company. Technical developments were focused on materials and assembly processes for high temperature electronics and improving reliability of solder joints and wirebonds for Power Electronics for harsh environments, primarily focused on Aerospace applications. He has managed numerous UK/EU funded programs working collaboratively with a wide range of academic and industrial partners. He left TT Electronics in November 2018 and is now working across a broad range of electronics manufacturing research topics ranging from micro and power electronics assemblies to novel circuit board assembly processes for all market sectors at the MTC.
Summary of IMAPS-UK Activities:
– 2019 Joined the IMAPS-UK committee