Custom Interconnect Ltd.
Hampshire, SP10 3JL
John has over 40 years’ experience working on the packaging of microelectronics. He started his career in 1978 at STC Defense Systems (Paignton) working firstly in their Thick Film Hybrid division and then transferred to their high reliability Laser based fiber-optic division. Over the next 8 years, he covered everything from die / wirebond, fiber-optic alignment, lid sealing, leak checking, life testing and failure analysis. After a 1-year stint at EEV (now E2V) involved in the packaging of CCD sensor die for high reliability applications including space he joined Custom Interconnect Ltd (CIL), where he remains after 32 years. The first 6 years were spent as a Design Engineer/Technical Manager on thick film hybrids / SMT PCB’s and in 1995 he became a Director of CIL and Managing Director in 2003.
Summary of IMAPS-UK Activities:
– 2020 Joined the IMAPS-UK committee