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IMAPS-UK announce Call for Abstracts for MicroTech 2021 – Heterogeneous Integration – Packaging Future Microsystems

IMAPS-UK are pleased to announce a Call for Abstracts for MicroTech 2021 on the theme of Heterogeneous Integration – Packaging Future Microsystems. MicroTech 2021 will be held Online on Thursday 25 March 2021.

The main conference topics are based on the Heterogeneous Integration Roadmap produced by the IEEE-EPS, covering the following chapters:

  • High Performance Computing and Data Centres
  • Internet of Things (IoT)
  • Medical, Health and Wearables
  • Automotive
  • Aerospace and Defence
  • Mobile
  • Single-Chip and Multi-Chip Integration
  • Integrated Photonics
  • Integrated Power Electronics
  • MEMS and Sensor Integration
  • 5G Communication
  • Co-Design for Heterogeneous Integration
  • Modelling and Simulation
  • Materials and Emerging Research Materials
  • Emerging Research Devices
  • Test Technologies
  • Supply Chain
  • Security
  • Thermal
  • SiP and Module System Integration
  • Interconnects for 2D and 3D Architectures
  • Wafer Level Packaging

For more information, please click on the following link Heterogeneous Integration Roadmap

For further details please download MicroTech 2021 - Call for Abstracts (862 downloads )

Abstracts are due by Friday 18th December 2020.

Please submit your Abstract to