IMAPS-UK announce Call for Abstracts for MicroTech 2021 – Heterogeneous Integration – Packaging Future Microsystems

IMAPS-UK are pleased to announce a Call for Abstracts for MicroTech 2021 on the theme of Heterogeneous Integration – Packaging Future Microsystems. MicroTech 2021 will be held Online on Thursday 25 March 2021.

The main conference topics are based on the Heterogeneous Integration Roadmap produced by the IEEE-EPS, covering the following chapters:

• High Performance Computing and Data Centres
• Internet of Things (IoT)
• Medical, Health and Wearables
• Automotive
• Aerospace and Defence
• Mobile
• Single-Chip and Multi-Chip Integration
• Integrated Photonics
• Integrated Power Electronics
• MEMS and Sensor Integration
• 5G Communication
• Co-Design for Heterogeneous Integration
• Modelling and Simulation
• Materials and Emerging Research Materials
• Emerging Research Devices
• Test Technologies
• Supply Chain
• Security
• Thermal
• SiP and Module System Integration
• Interconnects for 2D and 3D Architectures
• Wafer Level Packaging

For more information, please click on the following link Heterogeneous Integration Roadmap

For further details please download

Abstracts are due by Friday 18th December 2020.

Please submit your Abstract to office@imaps.org.uk