Members Newsletter - February 2021 - iMAPS-UK - UK Chapter of the International Microelectronics Assembly and Packaging Society

The February 2021 Issue of the IMAPS-UK Members Newsletter features the following articles: Semiconductor Packaging Workshop Online—Thursday 11 February 2021 Professional Development Course on Wafer and Package Dicing Technology for the Electronics Packaging Industry Online Events in March 2021 – MicroTech 2021 – Heterogeneous Integration Download the . If you would like to propose articles…

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