Membership Secretary
Eamonn Redmond
Inseto (UK) Limited
Hampshire, SP10 5NY
After completing his B. Eng. in Electronics at the University of Limerick, Eamonn joined Analog Devices in 1986, starting as an In-Line Test Engineer before becoming a Process Engineer. Both roles gave him a valuable understanding of the Hybrid Thick-Film industry, especially the die attach and wirebond processes, as well as a detailed knowledge of the requirements of environmental testing such as burn-in, temperature cycling, and temperature shock. Transitioning to Analog’s Monolithic IC division, Eamonn finished his time at Analog as their IC Production Manager, which allowed him to gain experience in wafer-level test & probe, package-level test, and the demands of a modern production environment.
Moving to Dage Intersem in the mid-nineties was the beginning of Eamonn’s sales career. Primarily responsible for die attach products such as eutectic solder and adhesives, the various materials used in wire & ribbon bonding, and the packaging requirements that the Hi-Rel industry demands, Eamonn gained valuable experience with Dage before joining Inseto in 1996 in a similar role.
With Inseto his responsibilities have expanded to include substrate materials such as thick film inks & thin film substrates, as well as a comprehensive range of adhesives for various applications within the microelectronics industry, specifically die attach adhesive & IC encapsulation materials.
As his role within Inseto has grown, Eamonn joined the Board of Directors in 2010 to become a part of the strategic leadership team sustaining and guiding the company in the sometimes difficult environment of the UK’s electronics industry!
Summary of IMAPS-UK Activities:
– 2021 Joined the IMAPS-UK committee
