Members Newsletter - June 2021 - iMAPS-UK - UK Chapter of the International Microelectronics Assembly and Packaging Society

The June 2021 Issue of the IMAPS-UK Members Newsletter features the following articles: 23rd European Microelectronics Packaging Conference Online 13-16 September 2021 Press Release by Inseto and Filtronic on New Wire Bond Equipment IMAPS-UK AGM held on 13th May 2021 First Professional Development Course of Wafer and Package Dicing Technology Future Online Events Download the…

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