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Monthly Archives: April 2022

Power Electronics Packaging – Training and Upskilling – PEPTUS Project Summary

Opportunities for Training in Power Electronics Packaging

IMAPS-UK is pleased to announce the completion of the PEPTUS project. The project is about Power Electronics Packaging — Training and Upskilling – providing up to date training modules to raise awareness of this topic in support of the Electric Revolution.

This project is funded by Driving the Electric Revolution – Building Talent for the Future, an ISCF Challenge
delivered by UK Research and Innovation.

The project has prepared and introduced a Power Electronics Packaging Training Course based on Basic, Intermediate and Advanced levels. The courses are available to be taken up by industry and Academia to assist in up-skilling and reskilling personnel for the manufacture and testing of power electronics modules.

The PEPTUS project has delivered the following items:

Power Electronics Packaging – Introduction Video

Power Electronics Packaging – Training Modules

Basic Level

  • Module 1 – Introduction to Power Electronics Packaging
  • Module 2 – Making of Power Electronics Packaging
  • Module 3 – Design for Power Electronics Packaging
  • Module 4 – Developing Power Electronics Packaging

Intermediate Level

  • Module 5 – Developing Power Electronics Packaging Options
  • Module 7 – Materials and Processes

Advanced Level

  • Module 12 – Testing, Modelling, Reliability and Lifetime Prediction for Power Electronics Packaging

PEPTUS Training Events

PEP-IT-UP Training Workshop – Monday 25th April 2022 – Rutherford Appleton Laboratory, Harwell Campus

An introductory Training Workshop on Microelectronic Packaging Techniques for Power Electronics was held on the afternoon of Monday 25 April 2022 at the Rutherford Appleton Laboratory to present Modules 1 and 2, which was attended by 25 people.

PEPTUS 1 Training Workshop – Thursday 16th June 2022 – CSA Catapult

A Training Workshop on the Design, Testing and Reliability Aspects of Power Electronics Manufacturing will be held at the CSA Catapult, Newport, South Wales on Thursday 16 June 2022 to present Modules 3 and 4

For further information and to express interest in the PEPTUS project, please contact IMAPS-UK Office, Andy Longford or Steve Riches.

IMAPS-UK MicroTech 2022 Conference Report

The IMAPS-UK organised MicroTech 2022 Conference on Next Generation of Electronics and People held on Tuesday 26th April 2022 at the Rutherford Appleton Laboratory, explored the current semiconductor market, reviewed many aspects of packaging developments for ICs, RF devices and power electronics packaging and included wider consideration of skills and training of people within the electronics industry.

Download the MicroTech 2022 Conference Report

If you need any further information, please contact

Call for Abstracts for 3rd International Conference on Photonics and Opto Packaging (pOp3) on 18 October 2022

IMAPS-UK, in partnership with the Torbay Hi-Tech Cluster and South Devon College is pleased to announce a Call for Abstracts for the 3rd International Conference on Photonics and Opto Packaging (pOp3) with the theme of Linking Optoelectronics Designers and Manufacturers. The pOp3 Conference is planned to be held at the South Devon College, Paignton on Tuesday 18 October 2022.

Abstracts are invited on the following topics:

  • Directions
  • Academic Research and Development
  • Developing Applications
  • Advanced Packaging Technologies


This theme covers future directions of the photonics and optoelectronics industry, and may include, but not limited to:

  • Over the horizon studies on next generation technologies
  • Photonics in connected vehicles
  • Virtual reality
  • Seeing beyond the visible
  • Photonics and optoelectronics in 3D printing technologies
  • Smarter communications
  • Future demands of photonics packaging
  • Improving translation between academia and industry
  • Impact of photonics on climate change

Academic Research and Development

This theme covers recent research and laboratory development that are ongoing at the lower technology readiness levels and may discuss unresolved questions. Topics include, but not limited to:

  • Detectors
  • Photonic integrated circuits (PICs)
  • optoelectronics
  • New materials and devices
  • Sensors
  • Novel photonics effects
  • Nonlinear materials
  • Quantum technologies
  • Device fabrication

Developing Applications

This theme will focus on development and innovations in photonics and optoelectronics components, devices and systems at a higher level of technology readiness than Academic R&D. These include, but not limited to:

  • Quantum Computing
  • Quantum Sensors
  • Greenhouse gas detection
  • Autonomous Vehicles
  • Internet of Things (IoT)
  • 5G
  • Free-Space Communications
  • Short-range Underwater Optical Communications
  • Photonics Technologies in Medicine
  • Satellite Remote Sensing and Monitoring
  • Advanced Imaging and Vision technologies
  • Application of PICs

Advanced Packaging Technologies

This theme aims to bring together highly skilled development engineers and end users to discuss advanced packaging technologies. These include advances in:

  • Sub-micron alignment
  • Heterogeneous Integration
  • Wafer Level Processes
  • Hybrid Packaging
  • Testing and Verification
  • Qualification
  • Lifecycle Management

For further details please download pOp3 Conference Call for Abstracts

Abstracts of up to 200 words are due by Friday 1st July 2022.

Please submit your Abstract to

ZEISS Advanced Packaging Analysis Solutions – Webinar – 17th May 2022 – 10:00 UK Time

ZEISS Microscopy are organising a webinar on “Advanced Packaging Analysis Solutions” by Cheryl Hartfield of ZEISS Microscopy on Tuesday 17th May 2022 at 10:00 (UK time)

With the slowing of Moore’s Law, there has never been more urgency to address challenges for integrated circuit (IC) package characterization and failure analysis (FA) in the More than Moore (MtM) era. Diverse IC package strategies exist to enable the highest system performance. As a result, package developers and failure analysts are faced with complex package architectures, shrinking package interconnect pitches on the order of a few microns, and system-on-chip (SOC) disintegration, which leads to larger package footprints approaching 100mm x 100mm or larger. These trends drive requirements for new capabilities across the entire FA workflow.

With this in mind, we invite you to join our webinar entitled “ZEISS Advanced Packaging Analysis Solutions”, where we will provide an insight on New ZEISS solutions addressing MtM IC package analysis challenges for 3D X-ray imaging and a “Packaging FIB”, the Crossbeam laser. These technologies represent significant advancements for the package FA workflow.

Date: Tuesday 17th May

Time: 10:00 – 11:00 am (BST)

Speaker: Cheryl Hartfield (ZEISS Microscopy)

This session is designed for those working in Electronics Materials Characterization, Electronics Failure Analysis & Electronics Packaging, with key learnings including:

  • An introduction to the “More-than-Moore” (MtM) packaging trend
  • How 3D X-ray microscopy is used to address the challenge of MtM package analysis
  • Technical highlights of the ZEISS “Packaging FIB” for improvement of FA workflow

Speaker Profile – Cheryl Hartfield

Cheryl Hartfield is Product Marketing Manager for ZEISS Microscopy, based in Dublin, California. She received her MA and BS in Microbiology from UT Southwestern Medical Center and Texas A&M respectively. She co-founded Omniprobe and was Senior Member of Technical Staff at Texas Instruments, working for 12 years in characterisation and package development. Cheryl is an ASM Fellow and Past President of EDFAS. She has 15 patents and authored >70 papers.

To register for the webinar, click HERE