Call for Abstracts for 3rd International Conference on Photonics and Opto Packaging (pOp3) on 18 October 2022
IMAPS-UK, in partnership with the Torbay Hi-Tech Cluster and South Devon College is pleased to announce a Call for Abstracts for the 3rd International Conference on Photonics and Opto Packaging (pOp3) with the theme of Linking Optoelectronics Designers and Manufacturers. The pOp3 Conference is planned to be held at the South Devon College, Paignton on Tuesday 18 October 2022.
Abstracts are invited on the following topics:
- Directions
- Academic Research and Development
- Developing Applications
- Advanced Packaging Technologies
Directions
This theme covers future directions of the photonics and optoelectronics industry, and may include, but not limited to:
- Over the horizon studies on next generation technologies
- Photonics in connected vehicles
- Virtual reality
- Seeing beyond the visible
- Photonics and optoelectronics in 3D printing technologies
- Smarter communications
- Future demands of photonics packaging
- Improving translation between academia and industry
- Impact of photonics on climate change
Academic Research and Development
This theme covers recent research and laboratory development that are ongoing at the lower technology readiness levels and may discuss unresolved questions. Topics include, but not limited to:
- Detectors
- Photonic integrated circuits (PICs)
- optoelectronics
- New materials and devices
- Sensors
- Novel photonics effects
- Nonlinear materials
- Quantum technologies
- Device fabrication
Developing Applications
This theme will focus on development and innovations in photonics and optoelectronics components, devices and systems at a higher level of technology readiness than Academic R&D. These include, but not limited to:
- Quantum Computing
- Quantum Sensors
- Greenhouse gas detection
- Autonomous Vehicles
- Internet of Things (IoT)
- 5G
- Free-Space Communications
- Short-range Underwater Optical Communications
- Photonics Technologies in Medicine
- Satellite Remote Sensing and Monitoring
- Advanced Imaging and Vision technologies
- Application of PICs
Advanced Packaging Technologies
This theme aims to bring together highly skilled development engineers and end users to discuss advanced packaging technologies. These include advances in:
- Sub-micron alignment
- Heterogeneous Integration
- Wafer Level Processes
- Hybrid Packaging
- Testing and Verification
- Qualification
- Lifecycle Management
For further details please download pOp3 Conference Call for Abstracts
Abstracts of up to 200 words are due by Friday 1st July 2022.
Please submit your Abstract to office@imaps.org.uk
