Monthly Archives: September 2023
Members Newsletter – October 2023
The October 2023 Issue of the IMAPS-UK Members Newsletter features the following articles: Save the Date – iPower5 Conference – 29th November 2023 Training Day – Die Attach and Wirebonding – 9th November 2023 Forthcoming Events – October/November 2023 Download the IMAPS-UK Members Newsletter – October 2023. If you would like to propose articles for…
Members Newsletter – September 2023
The September 2023 Issue of the IMAPS-UK Members Newsletter features the following articles: EMPC23 Conference and Exhibition – 11-14 September 2023 PEPTUS 2 – Stakeholder Webinar Save the Date – iPower5 Conference – 29th November 2023 Forthcoming Events – September/October 2023 Download the IMAPS-UK Members Newsletter – September 2023. If you would like to propose…
24th European Microelectronics and Packaging Conference (EMPC 2023) – 11-14 September 2023 – Report
IMAPS-UK hosted the 24th European Microelectronics and Packaging Conference (EMPC 2023) at the Wellcome Genome Campus near Cambridge, with over 250 people attending over the four days of the in-person event. The Conference featured state of the art presentations from 5 keynote academic and industrial speakers, 70 oral and 18 poster presentations and 4 Professional Development Courses.
Download the EMPC 2023 Conference Report
For further information, please contact IMAPS-UK Office
ZEISS/MCS Webinar – From Virtual to Reality – How to Target and Investigate Condition within Advanced Electronic Packages – Tuesday 26th September 2023

ZEISS Microscopy in partnership with MCS Group are organising a webinar on “How to Target and Investigate Condition within Advanced Electronic Packages” by Stewart McCracken of MCS Group on Tuesday 26th September 2023 at 12:00 – 13:00 (UK (BST) time)
The complexity of current electronics-based systems, make identifying the source of a system malfunction a real challenge. A correlative workflow for physical analysis is particularly effective, find out why in our upcoming webinar. Our speakers will share their experience and tips for troubleshooting electronics packages.
Mr. Stewart McCraken (MCS Group) will discuss what it takes to identify and target specific features of components within its packaging. He will also share the details of a forensic analysis case study, highlighting how information contained in the material microstructure can be used for failure diagnosis.
Join us on 26th September 2023 for an informative session and Q&A. Register today to attend or to receive the webinar recording by email.
To register for the webinar, click HERE
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