Global Business Innovation Programme: Semiconductors, Taiwan - iMAPS-UK - UK Chapter of the International Microelectronics Assembly and Packaging Society

Innovate UK is inviting ambitious companies in the Semiconductor Sector to participate in the Global Business Innovation Programme to Taiwan.

The Programme consists of a preparation phase followed by two trips to Taiwan, including connection with leading Taiwanese semiconductor companies and an opportunity to showcase their technologies and products on the UK Pavilion at SEMICON Taiwan. Innovate UK will fund and organise group flights, accommodation and in-market travel for successful applicants. One senior representative from each company will be funded

The Focus Themes are:

Electric Vehicles
Power Electronics
Future Telecommunications
Photonics

The Key Technologies are:

Semiconductor Design/IP
Compound Semiconductors
Advanced Packaging
Emerging Materials

Download the Global Business Innovation Programme: Semiconductors, Taiwan – Flyer

An applicant briefing will be held on 29 February 2024. The pre-visit workshop will be held on 24-25th April 2024, with visits to Taiwan to be held on 31st May to 8th June 2024 and 1st – 7th September 2024.

For further information and registration for the briefing webinar, please visit Global Business Innovation Programme: Semiconductors, Taiwan