IMAPS-UK is pleased to announce a Call for Abstracts for the Annual MicroTech 2026 Conference with the theme of Driving Innovation in Semiconductor Packaging. The MicroTech 2026 Conference will be held at the King’s Conference Centre, Southampton on Thursday 26 March 2026.

Abstracts are invited on the following topics:

• Applications
• Advanced Packaging Technologies
• Electronics Design and Manufacturing Strategy
• Reliability Assessment

For further details please download MicroTech 2026 – Call for Abstracts

Abstracts are due by Friday 28th November 2025.

Please submit your Abstract to office@imaps.org.uk

IMAPS-UK is pleased to announce a Call for Abstracts for the Electronics for Extreme Environments Conference with the theme of Electronics that Must Endure. The Electronics for Extreme Environments Conference will be held at the Churchill College, Cambridge on Tuesday 30 June and Wednesday 1 July 2026.

The Electronics for Extreme Environments Conference focuses on “Electronics That Must Endure”. This in-person Conference combines invited Keynotes, Presentations and Posters from leading Industrial Companies, Academics and Research Institutions developing sensors, semiconductors, components, energy sources, packaging and assemblies that must perform reliably under extreme conditions, including high and low temperatures, high field strengths, severe mechanical and environmental conditions and ultra-long life electronics. This Conference follows on from and extends the High Temperature Electronics Network (HITEN).

Abstracts are invited on the following topics:

• High and Low Temperature Applications
• High Field Strength
• Severe Mechanical and Environmental Conditions
• Ultra Long-Life Electronics

For further details please download Electronics for Extreme Environments Conference 2026 – Call for Abstracts

Abstracts are due by Friday 30th January 2026.

Please submit your Abstract to office@imaps.org.uk

TechWorks, with it’s semiconductor packaging group, is assessing the strengths and needs of the semiconductor packaging sector.

A new survey is underway to assess the current state of the packaging supply chain, and we’re calling on OSATs, design/IP firms, equipment and materials suppliers, and RTOs/universities to take part.

This is your opportunity to:

• Highlight your capabilities
• Identify supply chain gaps
• Ensure your voice is reflected in a key paper to Government

The survey takes just as little as 15-25 minutes, and you can save your progress and return later (at the end of a page).

Every submission helps us build a clearer picture of the UK’s strengths and where support is needed.

This is about more than data, it’s about informing Government where strategic support may be needed to help the UK become a global leader in semiconductor packaging.

Complete the UK Semiconductor Packaging Survey Here