Microelectronics Packaging Workshop – 30 October 2025 – Report

The Microelectronics Packaging Workshop has made the following information available.

The IMAPS-UK organised Microelectronics Packaging Workshop: From Theory to Practice took place on Thursday 30th October 2025 at the Granta Centre, Cambridge. The Workshop covered technical overviews of die attach, wire bonding and packaging in the morning, followed by several case studies showing the implementation of microelectronics packaging in real world applications. The event proved a success, bringing together almost 60 participants from across the microelectronics packaging industry. Representatives from academia, manufacturing organisations and equipment/materials suppliers shared the opportunity to learn from one another during a full day of presentations, Q&A’s and networking.

Download the Microelectronics Packaging Workshop Report

For further information, please contact IMAPS-UK Office