ZEISS invites you to attend an upcoming technical webinar on “Inspect Your Electronics Package Non-destructively and in 3D With X-rays” delivered by Dr Andrew Elliott of Carl ZEISS on Tuesday 31st March 2026 from 10:00 to 11:00 (UK Time).

Discover how high-resolution X-ray computed tomography (CT) enables non-destructive inspection of complex, miniaturized electronic components. This session will show how CT reveals internal structures, hidden defects, and manufacturing inconsistencies that traditional methods often miss. Learn how to leverage CT imaging to enhance reliability, quality assurance, and failure analysis in modern electronics.

You will gain insights on:

• How X-ray CT uncovers voids, cracks, and solder joint defects without destructive testing
• The practical applications of CT in electronics packaging, QA workflows, and failure analysis
• How to reduce risk, improve product reliability, and accelerate development cycles

For More Information and Registration, click on ZEISS Webinar on Tuesday 31 March 2026 from 10:00 to 11:00 (UK Time)

Inseto invites customers working in MEMS, semiconductor and advanced electronics manufacturing to attend an upcoming technical webinar delivered by our supplier Kurz Ersa Semicon, focusing on High Vacuum Packaging of MEMS Devices.

As MEMS sensor performance requirements continue to increase, achieving and maintaining reliable vacuum conditions within packaged devices is critical. This webinar provides a valuable opportunity to gain expert insight into the latest high vacuum sealing approaches used in modern MEMS production.

Why attend this Webinar

This session is highly relevant for engineers, process specialists and technical decision makers involved in MEMS design, packaging and production. Attendees will gain a clearer understanding of how vacuum packaging influences sensor accuracy, long term stability and device lifetime.

Key topics include:

• Requirements of modern high precision MEMS sensors
• Fundamentals and technical challenges of high vacuum sealing
• Getter materials, including properties and selection criteria
• Vacuum encapsulation using the SRO GETTER process

The webinar will be presented by Dr Veit Große, offering direct access to specialist knowledge from Kurz Ersa Semicon.

For More Information and Registration, click on Inseto Webinar on Wednesday 4 March 2026 from 15:00 to 16:00

Ensuring long-term reliability in high-voltage systems requires a deep understanding of how environmental stressors impact insulation and material performance. This webinar explores cutting-edge research and testing methodologies designed to address these challenges. Our experts will examine how low-pressure environments influence partial discharge (PD) inception and contribute to electrical fatigue, providing critical insights for aerospace and other harsh-condition applications. Attendees will learn about the capabilities of a new multi-channel system engineered for accelerated ageing tests, enabling faster and more comprehensive reliability assessments. Additionally, we will share findings on material and coating performance under extreme conditions and outline plans for advanced testing strategies and design improvements aimed at enhancing high-voltage system durability.

Join NPL to discover:

• How these innovations are shaping the future of electrical reliability in demanding environments
• How low-pressure environments affect PD inception and electrical fatigue
• The capability of a new multi-channel system for accelerated ageing test
• Insights into material and coating performance under harsh conditions|
• Plans for advanced testing methodologies and design improvements for high-voltage reliability

For More Information and Registration, click on NPL Webinar on Tuesday 10 March 2026 from 14:30 to 15:30