Inseto Webinar: High Vacuum Packaging of MEMS Devices – Wednesday 4 March 2026

Inseto invites customers working in MEMS, semiconductor and advanced electronics manufacturing to attend an upcoming technical webinar delivered by our supplier Kurz Ersa Semicon, focusing on High Vacuum Packaging of MEMS Devices.

As MEMS sensor performance requirements continue to increase, achieving and maintaining reliable vacuum conditions within packaged devices is critical. This webinar provides a valuable opportunity to gain expert insight into the latest high vacuum sealing approaches used in modern MEMS production.

Why attend this Webinar

This session is highly relevant for engineers, process specialists and technical decision makers involved in MEMS design, packaging and production. Attendees will gain a clearer understanding of how vacuum packaging influences sensor accuracy, long term stability and device lifetime.

Key topics include:

• Requirements of modern high precision MEMS sensors
• Fundamentals and technical challenges of high vacuum sealing
• Getter materials, including properties and selection criteria
• Vacuum encapsulation using the SRO GETTER process

The webinar will be presented by Dr Veit Große, offering direct access to specialist knowledge from Kurz Ersa Semicon.

For More Information and Registration, click on Inseto Webinar on Wednesday 4 March 2026 from 15:00 to 16:00