ZEISS Webinar: Inspect Your Electronics Package Non-Destructively and in 3D with X-Rays – Tuesday 31 March 2026

ZEISS invites you to attend an upcoming technical webinar on “Inspect Your Electronics Package Non-destructively and in 3D With X-rays” delivered by Dr Andrew Elliott of Carl ZEISS on Tuesday 31st March 2026 from 10:00 to 11:00 (UK Time).

Discover how high-resolution X-ray computed tomography (CT) enables non-destructive inspection of complex, miniaturized electronic components. This session will show how CT reveals internal structures, hidden defects, and manufacturing inconsistencies that traditional methods often miss. Learn how to leverage CT imaging to enhance reliability, quality assurance, and failure analysis in modern electronics.

You will gain insights on:

• How X-ray CT uncovers voids, cracks, and solder joint defects without destructive testing
• The practical applications of CT in electronics packaging, QA workflows, and failure analysis
• How to reduce risk, improve product reliability, and accelerate development cycles

For More Information and Registration, click on ZEISS Webinar on Tuesday 31 March 2026 from 10:00 to 11:00 (UK Time)