ZEISS/Forensic Eyes Electronic Packaging Failure Analysis Workshop – 30 April 2026

ZEISS/Forensic Eyes are organising a focused, hands on event dedicated to strengthening the knowledge of failure analysis (FA) capabilities within the electronics packaging community on Thursday 30 April 2026 at the ZEISS site in Lutterworth, Leicestershire.

This one day programme will bring together practitioners, researchers and engineers to explore the strengths, limitations and practical workflows of the commonly used structural characterisation methods: light microscopy, electron microscopy and X-ray computed tomography (X-ray CT). Through expert-led sessions, live demonstrations and real case studies, attendees will learn how these complementary techniques can be applied to diagnose defects, validate manufacturing processes and improve product reliability.

Why You Should Attend

• Gain understanding about the challenges in failure analysis of packaging samples
• Benefit from live demonstrations of keystone equipment, such as light microscopes
• The opportunity to get insights on your specific challenges from industry experts in FA

For more Information and Registration of Interest to Attend, please click on Packaging Failure Analysis Workshop