Gain theoretical and practical understanding of the wire bonding process as a key microelectronic interconnection technique.

Cardiff University, in conjunction with IMAPS-UK, has launched an Online Introduction to Wire Bonding Course, to help users understand how the wire bonding process, materials and equipment work to interconnection semiconductor devices with the outside world.

The Introduction to Wire Bonding Online Course will cover:

• What wire bonding is and its function within the wider semiconductor supply chain (i.e. as a packaging process)
• The performance expected from a good wire bond
• The generic step-by-step processes involved in wire bonding and how the machinery works
• The similarities and differences between ball bonding, wedge bonding, and ribbon bonding techniques, including their pros and cons
• Which materials can be used in the wire bonding process and which materials to select according to the outcomes that you need
• The different parameters that affect the ‘recipe’ when wire bonding and how changing the parameters affects the outcome
• How to validate the quality of wire bonding through pull tests and shear tests
• The main safety issues to be aware of when wire bonding
• The professional standards used for wire bonding

If you are 18 years or older and either live or work in the UK, you may qualify for a fully funded place on this course

For more information and registration, please go to the Introduction to Wire Bonding Online Course

The Electronics for Extreme Environments Conference 2026 has made the following information available.

The Electronics for Extreme Environments Conference and Exhibition took place on Tuesday 30th June and Wednesday 1st July 2026 at Churchill College, Cambridge, UK focused on Electronics that Must Endure.

Download the Electronics for Extreme Environments Conference 2026 Report

For further information, please contact IMAPS-UK Office