IMAPS-UK Academic Conference – 2 September 2026 – Downloads
The IMAPS-UK Academic 2026 Conference held on 2 September 2026 at the University of Warwick has made the following information available for download.
IMAPS-UK Academic Conference Presentations
If you require copies of the presentations, you can download here by clicking on Author/Affiliation for each Presentation:
- Keynote Presentation: The Second Wave of Panel Level Packaging (PLP) for HPC and AI Applications – Tanja Braun, Fraunhofer IZM
- REWIRE Project: Transforming Net Zero with Next Generation Power Semiconductors – Haiyong Wan, University of Warwick
- Heterogeneous Integration as the New Scaling Opportunity and Building the UK Capability – Ibrahim Sari, University of Southampton
- Accelerating UK Semiconductor Innovation through Advanced Packaging – Gladys Benghalia, NMIS
- Innovation and Knowledge Centre in Heterogeneous Integrated Microelectronic and Semiconductor Systems (CHIMES2) – Chee Tan, University of Sheffield
- REACT: Recovery, Reintegration and Reuse of Semiconductor Die for Circular Electronics – Aye Su Mon Kyaw, University of Glasgow
- UK Microsystems Network – Gerard Cummins, University of Birmingham
- Strategic Drivers and Opportunities in Semiconductors – Antony Chapman, EPSRC
- Fine-Fine Leak Test: High Sensitivity Tracer Gas Leak Testing for Hermetic Packaging – Melissa Ng Tseung, King’s College London
The Presentations from Zhaobo Zhang and Renze Yu of the University of Bristol are not available for download.
Download the IMAPS-UK Academic Conference 2026 – Attendees List
Download the IMAPS-UK Academic Conference 2026 – Report
