Category Archives: Academy
Die Attach for Microelectronics and Power Electronics Assembly
Die Attach is a key assembly process in the manufacture of microelectronics and power modules including adhesive and non-adhesive materials.
PEPTUS Module 4 – Testing, Reliability and Future Trends
This Module covers the testing, reliability and introduces future trends for power electronics packaging.
PEPTUS Module 3 – Design for Power Electronics Packaging
This Module covers the main design factors for power electronics packaging.
PEPTUS Module 2 – Making of Power Electronics Packages
This Module introduces a basic overview of Power Electronics packages and ways in which they are manufactured.
PEPTUS Module 1 – Introduction to Power Electronics Packaging
Our Online Training Modules
The IMAPS-UK Academy is set up to provide knowledge based information covering a wide range of Micro-electronic packaging topics. A range of related online presentations available to provide a greater understanding of the factors involved in the design, manufacture and test of microelectronics.
The content of this Academy site will be updated on a regular basis as more subjects and presentation topics become available.
The available topics are:
Power Electronics Packaging – Training & Upskilling (PEPTUS)
Power electronics is at the heart of modern technology, and our PEPTUS course provides a structured approach to mastering this critical area. Developed under the Innovate UK – Driving the Electric Revolution – Building Talent for the Future Scheme, the PEPTUS course consists of 12 modules, available at Basic, Intermediate, and Advanced levels.
View an Introductory Video below (3 minutes):
Some sections of this PEPTUS Course Content are also disseminated at regular in-person workshops organised at various locations in the UK.
Further details on the complete PEPTUS Course Content can be downloaded HERE and for information on future workshops please contact the IMAPS-UK Office.
Module 1 – Introduction to Power Electronics Packaging.
- Session 1A – About Power Electronics
- Session 1B – What is the Driver?
- Session 1C – The Basic Packaging Processes
Online Learning Modules:
Module 1: Introduction to Power Electronics Packaging
Session 1A – About Power Electronics: This session gives an overview of the need for Power Electronics, provides an introduction to microelectronics and the main processes involved in assembly and packaging of components and modules. Duration 18 minutes
Session 1B – What is the Driver?: This session covers the drivers for packaging and how they meet the application needs for power electronics, including factors such as thermal management and power density, as well the needs for miniaturisation, performance and minimum costs. Duration 22 minutes
Session 1C – The Basic Packaging Processes: This session provides a step-by-step guide to the processes involved in transforming a semiconductor devices into a component that can be connected to the outside world. Duration 21 minutes
