IMAPS-UK Altogether, better connected!

Category Archives: Committee

Member of the committee.

Membership Secretary


Eamonn Redmond
Inseto (UK) Limited
Hampshire, SP10 5NY

Role Description

Biography

After completing his B. Eng. in Electronics at the University of Limerick, Eamonn joined Analog Devices in 1986, starting as an In-Line Test Engineer before becoming a Process Engineer. Both roles gave him a valuable understanding of the Hybrid Thick-Film industry, especially the die attach and wirebond processes, as well as a detailed knowledge of the requirements of environmental testing such as burn-in, temperature cycling, and temperature shock. Transitioning to Analog’s Monolithic IC division, Eamonn finished his time at Analog as their IC Production Manager, which allowed him to gain experience in wafer-level test & probe, package-level test, and the demands of a modern production environment.
Moving to Dage Intersem in the mid-nineties was the beginning of Eamonn’s sales career. Primarily responsible for die attach products such as eutectic solder and adhesives, the various materials used in wire & ribbon bonding, and the packaging requirements that the Hi-Rel industry demands, Eamonn gained valuable experience with Dage before joining Inseto in 1996 in a similar role.
With Inseto his responsibilities have expanded to include substrate materials such as thick film inks & thin film substrates, as well as a comprehensive range of adhesives for various applications within the microelectronics industry, specifically die attach adhesive & IC encapsulation materials.
As his role within Inseto has grown, Eamonn joined the Board of Directors in 2010 to become a part of the strategic leadership team sustaining and guiding the company in the sometimes difficult environment of the UK’s electronics industry!

Summary of IMAPS-UK Activities:
– 2021 Joined the IMAPS-UK committee

Committee Member


Jayakrishnan Chandrappen
CSA Catapult Innovation Centre
Newport, NP10 8BE

Role Description

Biography

Dr Jayakrishnan Chandrappan is the head of Advanced packaging group at CSA Catapult providing innovative packaging solutions through package design & modelling, micro-assembly and rapid prototyping for Power Electronics, RF and Photonics applications. Jay’s expertise ranges from Material engineering, Microelectronics, Photonics, Advanced packaging and reliability testing. Before joining the team at CSA Catapult, Jay’s career includes roles at companies such as Global Foundries Inc., A-Star Institute of Microelectronics, Singapore, and Scientist, Ministry of Electronics & Information Technology, India. He is a recipient of Europe’s most prestigious Marie-Skłodowska-Curie fellowship and won the Royal Society of Chemistry ‘Emerging Technology Showcase’ award in 2015.

Summary of IMAPS-UK Activities:
– 2021 Joined the IMAPS-UK committee

Committee Member


John Boston
Custom Interconnect Ltd.
Hampshire, SP10 3JL

Role Description

Biography

John has over 40 years’ experience working on the packaging of microelectronics. He started his career in 1978 at STC Defense Systems (Paignton) working firstly in their Thick Film Hybrid division and then transferred to their high reliability Laser based fiber-optic division. Over the next 8 years, he covered everything from die / wirebond, fiber-optic alignment, lid sealing, leak checking, life testing and failure analysis. After a 1-year stint at EEV (now E2V) involved in the packaging of CCD sensor die for high reliability applications including space he joined Custom Interconnect Ltd (CIL), where he remains after 32 years. The first 6 years were spent as a Design Engineer/Technical Manager on thick film hybrids / SMT PCB’s and in 1995 he became a Director of CIL and Managing Director in 2003.

Summary of IMAPS-UK Activities:
– 2020 Joined the IMAPS-UK committee

Committee Member


David  King
Alter Technology
Kirkton Campus
EH54 7DQ

Role Description

Biography

David King (Sales and marketing Director) joined Optocap in 2017 bringing a wealth of experience in high reliability microelectronics packaging technologies having worked in the industry for over 25 years. He began his career in engineering gaining 15 years’ technical experience in design and product development before moving into sales and business development. He has held roles with responsibilities for high-reliability microelectronics and optoelectronics projects in the UK, Europe and the USA for demanding applications such as aerospace & defence, space, medical, oil & gas & power. David holds a BSc in Electronics & Physics from the Open University.

Summary of IMAPS-UK Activities:
– 2019 Joined the IMAPS-UK committee

Committee Member


Piers Tremlett

Microchip Inc
Portskewett NP26 5YW

Role Description

Biography

Piers Tremlett has over 20 years experience working in the development of new packaging processes and designs within Microsemi’s Advanced Packaging Business and previously with Lucas Automotive, Sensors and Controls. He holds a BSc in Metallurgy & Material Science and an MSc in Management, Manufacturing and Technology. He is Microsemi’s senior Microelectronics Packaging Specialist with experience in System in a Package, PCB embedded die and high temperature electronics packaging.

Summary of IMAPS-UK Activities:
– 2014 joined the IMAPS-UK committee
– 2015 was the lead organiser for the Additive Manufacturing Workshop
– 2016 became the Society’s Secretary and was the lead organiser for the EDT Conference

Secretariat


Steve Riches
Tribus-D
Cambridge

Role Description

Biography

Steve Riches – Director Tribus-D Ltd: Steve Riches received a BA (Hons) in Natural Sciences from the University of Cambridge. He has over 30 years of experience in electronics assembly innovation, proposal generation and project management. Technical developments have included copper wire bonding, laser processes, high temperature electronics, MEMS assembly, ruggedised displays and LED lighting working at The Welding Institute and GE Aviation Systems in Newmarket. He has instigated and managed several Innovate UK/European projects, working collaboratively with a wide range of industrial and academic partners. He left GE Aviation in December 2015 and is now a director at a start-up business, Tribus-D Ltd, working on developing electronic packaging and interconnection technologies.

Summary of IMAPS-UK Activities:
– 2016 joined the IMAPS-UK committee and was the lead organiser for the “Is the Future of Electronics Packaging in 3D Printing?” event
– 2019 became IMAPS-UK Secretariat

Committee Member


John Lipp

Science and Technology Facilities Council
Didcot OX11 0QX

Role Description

Biography

John manages the interconnect activities within the Science and Technology Facilities Council. These activities include wire bonding, fine pitch flip-chip bonding and sensor module assembly and packaging. He is engaged in a range of new interconnect developments and has a personal interest in area array interconnects and their application to hybrid pixel sensors. Prior to the interconnect work, he was a project manager, delivering a range of radiation detectors to various science facilities in Europe.

Summary of IMAPS-UK Activities:
– 2014 joined the IMAPS-UK committee

Vice Chair


Carolyn Short
SPTS Technologies Ltd.
Newport,
NP18 2TA

Role Description

Biography

Summary of IMAPS-UK Activities:
– 2017 joined the IMAPS-UK committee
– 2018 Became Membership Secretary

Secretary


Andy Longford
PandA Europe
Teignmouth, TQ14 8SB

Role Description

Biography

Andy has been a member of IMAPS-UK since 2002 and a member of the IMAPS-UK Committee since 2004, taking on the role of Vice Chair in 2005 and becoming Chair in 2007. During the 6 years in office he was involved with overseeing a transition of the IMAPS organisation requested by USA and Europe, revising the office support and hosting the 40th Anniversary MicroTech. Andy also introduced a series of very successful 1 day workshops on Microelectronic Packaging, before taking on the role of secretariat for IMAPS-UK (2015 – 2019).
Andy’s business life revolves around being CEO of PandA Europe, a technical consultancy in Microelectronics interconnection, packaging and assembly technologies. He is a member of the SEMI Advanced Packaging Conference committee, a founder member of ESiPAT, the European packaging, assembly and test special interest group and a member of the EPSRC College.
Summary of IMAPS-UK Activities:
– 2004 Joined the IMAPS-UK committee
– 2007-09 Served as Chair
– 2009-11 Served as Past Chair
– 2015 Resigned from Committee and appointed the IMAPS-UK Secretariat
– 2020 Re-joined as Committee Member
– 2021 Took the post of Secretary