IMAPS-UK Altogether, better connected!

Category Archives: Committee

Member of the committee.

Committee Member


John Boston
Custom Interconnect Ltd.
Hampshire, SP10 3JL

Role Description

Biography

John has over 40 years’ experience working on the packaging of microelectronics. He started his career in 1978 at STC Defense Systems (Paignton) working firstly in their Thick Film Hybrid division and then transferred to their high reliability Laser based fiber-optic division. Over the next 8 years, he covered everything from die / wirebond, fiber-optic alignment, lid sealing, leak checking, life testing and failure analysis. After a 1-year stint at EEV (now E2V) involved in the packaging of CCD sensor die for high reliability applications including space he joined Custom Interconnect Ltd (CIL), where he remains after 32 years. The first 6 years were spent as a Design Engineer/Technical Manager on thick film hybrids / SMT PCB’s and in 1995 he became a Director of CIL and Managing Director in 2003.

Summary of IMAPS-UK Activities:
– 2020 Joined the IMAPS-UK committee

Committee Member


Carolyn Short
SPTS Technologies Ltd.
Newport, NP18 2TA

Role Description

Biography

Carolyn Short is a Marketing Communications Manager for SPTS Technologies. She joined Surface Technology Systems in 2001, which ultimately became SPTS Technologies in 2009. She works with within the Marketing Department, promoting SPTS’s range of etch and deposition equipment within MEMS, RF, Power and Advanced Packaging markets. After assisting in the organisation of Microtech 2019 and 2020, she formally joined the IMAPS-UK committee in May 2020.

She holds a BEng in Metallurgy and Materials Science and a PhD in Magnetic Materials from University of Birmingham.

Committee Member


David  King
Kirkton Campus
EH54 7DQ

Role Description

Biography

David King (Sales and marketing Director) joined Optocap in 2017 bringing a wealth of experience in high reliability microelectronics packaging technologies having worked in the industry for over 25 years. He began his career in engineering gaining 15 years’ technical experience in design and product development before moving into sales and business development. He has held roles with responsibilities for high-reliability microelectronics and optoelectronics projects in the UK, Europe and the USA for demanding applications such as aerospace & defence, space, medical, oil & gas & power. David holds a BSc in Electronics & Physics from the Open University.

Summary of IMAPS-UK Activities:
– 2019 Joined the IMAPS-UK committee

Committee Member


Liam Mills
The MTC
Coventry CV7 9JU

Role Description

Biography

Liam received a BEng (Hons) in Aerospace Engineering from the University of Liverpool in 2005. Soon after graduating he joined TT Electronics where roles in Quality, Power Module design and R&D provided the foundation to a career in semiconductor packaging during his 13 years with the company. Technical developments were focused on materials and assembly processes for high temperature electronics and improving reliability of solder joints and wirebonds for Power Electronics for harsh environments, primarily focused on Aerospace applications. He has managed numerous UK/EU funded programs working collaboratively with a wide range of academic and industrial partners. He left TT Electronics in November 2018 and is now working across a broad range of electronics manufacturing research topics ranging from micro and power electronics assemblies to novel circuit board assembly processes for all market sectors at the MTC.

Summary of IMAPS-UK Activities:
– 2019 Joined the IMAPS-UK committee

Committee Member


Piers Tremlett

Microsemi
Portskewett NP26 5YW

Role Description

Biography

Piers Tremlett has over 20 years experience working in the development of new packaging processes and designs within Microsemi’s Advanced Packaging Business and previously with Lucas Automotive, Sensors and Controls. He holds a BSc in Metallurgy & Material Science and an MSc in Management, Manufacturing and Technology. He is Microsemi’s senior Microelectronics Packaging Specialist with experience in System in a Package, PCB embedded die and high temperature electronics packaging.

Summary of IMAPS-UK Activities:
– 2014 joined the IMAPS-UK committee
– 2015 was the lead organiser for the Additive Manufacturing Workshop
– 2016 became the Society’s Secretary and was the lead organiser for the EDT Conference

Secretariat


Steve Riches
Tribus-D
Cambridge

Role Description

Biography

Steve Riches – Director Tribus-D Ltd: Steve Riches received a BA (Hons) in Natural Sciences from the University of Cambridge. He has over 30 years of experience in electronics assembly innovation, proposal generation and project management. Technical developments have included copper wire bonding, laser processes, high temperature electronics, MEMS assembly, ruggedised displays and LED lighting working at The Welding Institute and GE Aviation Systems in Newmarket. He has instigated and managed several Innovate UK/European projects, working collaboratively with a wide range of industrial and academic partners. He left GE Aviation in December 2015 and is now a director at a start-up business, Tribus-D Ltd, working on developing electronic packaging and interconnection technologies.

Summary of IMAPS-UK Activities:
– 2016 joined the IMAPS-UK committee and was the lead organiser for the “Is the Future of Electronics Packaging in 3D Printing?” event
– 2019 became IMAPS-UK Secretariat

Committee Member


Chris Hunt
Ceitex
London

Role Description

Biography

Chris Hunt has over 20 years’ experience in the field of electronics interconnection at the National Physical Laboratory. There he led a team of 10 scientists, and has a PhD in material science. He is the chair of IEC TC91 dealing with a range of standards covering assembly and packaging issues. He has now formed his own company, Ceitex, and is consulting over a wide range of issues, from wearables to high temperature electronics.

Summary of IMAPS-UK Activities:
– 2007 joined the IMAPS-UK committee
– 2013 to 2015 IMAPS-UK committee membership secretary
– Joint organiser of several events
– 2015 became the Vice Chair
– 2017 became Chair
– 2018 became Past Chair

Committee Member


Andy Longford
PandA Europe
Teignmouth, TQ14 8SB

Role Description

Biography

Andy has been a member of IMAPS-UK since 2002 and a member of the IMAPS-UK Committee since 2004, taking on the role of Vice Chair in 2005 and becoming Chair in 2007. During the 6 years in office he was involved with overseeing a transition of the IMAPS organisation requested by USA and Europe, revising the office support and hosting the 40th Anniversary MicroTech. Andy also introduced a series of very successful 1 day workshops on Microelectronic Packaging, before taking on the role of secretariat for IMAPS-UK (2015 – 2019).

Andy’s business life revolves around being CEO of PandA Europe, a technical consultancy in Microelectronics interconnection, packaging and assembly technologies. He is a member of the SEMI Advanced Packaging Conference committee, a founder member of ESiPAT, the European packaging, assembly and test special interest group and a member of the EPSRC College.

Summary of IMAPS-UK Activities:
– 2004 Joined the IMAPS-UK committee
– 2007-09 Served as Chair
– 2009-11 Served as Past Chair
– 2015 Resigned from Committee and appointed the IMAPS-UK Secretariat
– 2020 Re-joined as Committee Member

Committee Member


John Lipp

Science and Technology Facilities Council
Didcot OX11 0QX

Role Description

Biography

John manages the interconnect activities within the Science and Technology Facilities Council. These activities include wire bonding, fine pitch flip-chip bonding and sensor module assembly and packaging. He is engaged in a range of new interconnect developments and has a personal interest in area array interconnects and their application to hybrid pixel sensors. Prior to the interconnect work, he was a project manager, delivering a range of radiation detectors to various science facilities in Europe.

Summary of IMAPS-UK Activities:
– 2014 joined the IMAPS-UK committee