IMAPS-UK Altogether, better connected!

Category Archives: Committee

Member of the committee.

Committee Member


David  King

Kirkton Campus
EH54 7DQ

Role Description

Biography

David King (Sales and marketing Director) joined Optocap in 2017 bringing a wealth of experience in high reliability microelectronics packaging technologies having worked in the industry for over 25 years. He began his career in engineering gaining 15 years’ technical experience in design and product development before moving into sales and business development. He has held roles with responsibilities for high-reliability microelectronics and optoelectronics projects in the UK, Europe and the USA for demanding applications such as aerospace & defence, space, medical, oil & gas & power. David holds a BSc in Electronics & Physics from the Open University.

Summary of IMAPS-UK Activities:
– 2019 Joined the IMAPS-UK committee

Committee Member


Liam Mills

The MTC
Coventry CV7 9JU

Role Description

Biography

Liam received a BEng (Hons) in Aerospace Engineering from the University of Liverpool in 2005. Soon after graduating he joined TT Electronics where roles in Quality, Power Module design and R&D provided the foundation to a career in semiconductor packaging during his 13 years with the company. Technical developments were focused on materials and assembly processes for high temperature electronics and improving reliability of solder joints and wirebonds for Power Electronics for harsh environments, primarily focused on Aerospace applications. He has managed numerous UK/EU funded programs working collaboratively with a wide range of academic and industrial partners. He left TT Electronics in November 2018 and is now working across a broad range of electronics manufacturing research topics ranging from micro and power electronics assemblies to novel circuit board assembly processes for all market sectors at the MTC.

Summary of IMAPS-UK Activities:
– 2019 Joined the IMAPS-UK committee

Committee Member


Piers Tremlett

Microsemi
Portskewett NP26 5YW

Role Description

Biography

Piers Tremlett has over 20 years experience working in the development of new packaging processes and designs within Microsemi’s Advanced Packaging Business and previously with Lucas Automotive, Sensors and Controls. He holds a BSc in Metallurgy & Material Science and an MSc in Management, Manufacturing and Technology. He is Microsemi’s senior Microelectronics Packaging Specialist with experience in System in a Package, PCB embedded die and high temperature electronics packaging.

Summary of IMAPS-UK Activities:
– 2014 joined the IMAPS-UK committee
– 2015 was the lead organiser for the Additive Manufacturing Workshop
– 2016 became the Society’s Secretary and was the lead organiser for the EDT Conference

Secretariat


Andy Longford

C/O Panda Europe
Teignmouth, TQ14 8SB

Role Description

Biography

Andy has been a member of IMAPS-UK since 2002 and a member of the IMAPS-UK Committee since 2004, taking on the role of Vice Chair in 2005 and becoming Chair in 2007. During the 6 years in office he was involved with overseeing a transition of the IMAPS organisation requested by USA and Europe, revising the office support and hosting the 40th Anniversary MicroTech. Andy also represented IMAPS-UK as part of the UK Electronics Alliance UKEA (now known as ESCO) and introduced a series of very successful 1 day workshops on Microelectronic Packaging.

Andy’s business life revolves around being CEO of PandA Europe, a technical consultancy in Microelectronics interconnection, packaging and assembly technologies. He is also Co-Chair of the SEMI Advanced Packaging Conference committee, a founder member of ESiPAT, the European packaging, assembly and test special interest group and a member of the EPSRC College. PandA Europe provides secretariat services for IMAPS-UK.

Summary of IMAPS-UK Activities:
– 2004 Joined the IMAPS-UK committee
– 2007-09 Served as Chair
– 2009-11 Served as Past Chair
– 2015 Resigned from Committee and appointed the IMAPS-UK Secretariat

Committee Member


Scott Wood

Accelonix Limited
Cambridge CB21 6GP

Role Description

Biography

Scott Wood has over 20 years within the Microelectronics industry. After completing a PhD in Semiconductor Laser Physics, he started his career at Nortel Networks where he gained experience working in both Microelectronics Packaging and Wafer Fab environments. Moving from R&D to NPI within Nortel, Scott then joined Marconi Applied Technologies, e2v, where he developed roles in manufacturing and ultimately production management. Scott now holds the position of Managing Director of Accelonix UK, a distribution organisation specialising in the supply of equipment and services to the Microelectronics and Precision Machining industries.

Summary of IMAPS-UK Activities:
– 2017 joined the IMAPS-UK committee

Committee Member


Sergei Valev

Honeystone Limited
London

Role Description

Biography

Sergei Valev Graduated Moscow State Technical University with a master degree in Microelectronics and Solid State Physics in 1996. Qualified for the National management retraining program and joined a course in international business in Export-Akademie Baden Wurttemberg, (Germany) in 1998. Continued business education in MIRBIS business school in Moscow in 2000-2001.

Job experience: In 1996 – 2000 worked for an automotive electronics company Autoelectronika, where from 1998 was promoted to International project manager. In 2000 started an independent business by a collaboration with Mozaik Technology Ventures (UK) as their regional representative. By 2005 business developed into a group of trading companies. Group is an active supplier of turnkey projects for advanced packaging and thick film hybrids. To increase exposure of its service team SV took the directorship of Honeystone Ltd. based in London. Since 2015 the company is involved in several R&D consortiums and offers process equipment and staff training. SV co-authored a number of technical articles and participated in several R&D projects with EU-based companies.

IMAPS ties: Joined IMAPS Russia chapter in 2001 and became a member of ELC in 2003. Participated in IMAPS Europe events starting from EMPC in Strasbourg in 2001. Corporate member of IMAPS UK since 2016, participated in several chapter events as an exhibitor.

Summary of IMAPS-UK Activities:
– 2018 joined the IMAPS-UK committee

Committee Member


Chris Powley

The MTC
Coventry CV7 9JU

Role Description

Biography

Chris is a Senior Research Engineer and team leader within the Electronics Manufacturing Theme at The MTC. He is working across a broad range of electronics manufacturing research topics ranging from micro and power electronics manufacturing to novel circuit board assembly processing.
Prior to the MTC Chris was a designer of high performance optoelectronic, military and aerospace semiconductor products at TT Electronics – Semelab.

Summary of IMAPS-UK Activities:
– 2015 joined the IMAPS-UK committee

Committee Member


Steve Riches

Tribus-D
Cambridge

Role Description

Biography

Steve Riches – Director Tribus-D Ltd: Steve Riches received a BA (Hons) in Natural Sciences from the University of Cambridge. He has over 30 years of experience in electronics assembly innovation, proposal generation and project management. Technical developments have included copper wire bonding, laser processes, high temperature electronics, MEMS assembly, ruggedised displays and LED lighting working at The Welding Institute and GE Aviation Systems in Newmarket. He has instigated and managed several Innovate UK/European projects, working collaboratively with a wide range of industrial and academic partners. He left GE Aviation in December 2015 and is now a director at a start-up business, Tribus-D Ltd, working on developing electronic packaging and interconnection technologies.

Summary of IMAPS-UK Activities:
– 2016 joined the IMAPS-UK committee and was the lead organiser for the “Is the Future of Electronics Packaging in 3D Printing?” event

Committee Member


Bassem Mouawad

University of Nottingham
Nottingham NG7 2RD

Role Description

Biography

Bassem Mouawad is a Research Fellow within the Power Electronics, Machine and Control (PEMC) group at the University of Nottingham. He is working across a broad range of packaging strategies for Wide Band Gap power devices. He holds a BSc in Physics, MSc in Nanosciences and Functional Materials, and a PhD in Micro & Nanotechnology. Prior to the University of Nottingham, Bassem worked in a material science and engineering laboratory (MATEIS) developing nano-scale microstructure Stainless Steel for Nuclear Power plants.

Summary of IMAPS-UK Activities:
– 2017 Joined the IMAPS-UK committee

Committee Member


John Lipp

Science and Technology Facilities Council
Didcot OX11 0QX

Role Description

Biography

John manages the interconnect activities within the Science and Technology Facilities Council. These activities include wire bonding, fine pitch flip-chip bonding and sensor module assembly and packaging. He is engaged in a range of new interconnect developments and has a personal interest in area array interconnects and their application to hybrid pixel sensors. Prior to the interconnect work, he was a project manager, delivering a range of radiation detectors to various science facilities in Europe.

Summary of IMAPS-UK Activities:
– 2014 joined the IMAPS-UK committee