Category Archives: Downloads
iPower5 Conference – 29 November 2023 – Downloads
The IPower5 Conference held on Wednesday 29 November 2023 has made the following information available for download.
IPower5 Conference Downloads
Programme Literature Click on Title to download.
Download the iPower5 Conference Booklet
Download the IPower5 Conference Report
Download the IPower5 Conference Attendee List
Sponsor Presentation. Click on Company Name to download.
- Carl Zeiss Ltd – 2MB
Conference Presentations
If you require copies of the presentations, you can download here by clicking on Author/Affiliation for each Presentation:
iPower5 Conference: Wednesday 29 November 2023
- Keynote Presentation: Latest Advances in Devices and Modules for Electric Vehicles – Phil Mawby – University of Warwick – 4MB
- Embedded PCB Power Modules – Stylianos Syrigos – Microchip Technology Inc – 2MB
- Modelling the Impact of Cosmic Rays on the Reliability of Power Semiconductor Devices – Gabriel Parkinson – University of Nottingham – 1MB
- (Hybrid) Sintering Materials for High Power, High Temperature Applications – Jochen Schuermans – Roartis – 2MB
- Novel Interconnect and Packaging Technologies for Power Modules – Huub Claassen – Boschman Technologies– 3MB
- Scanning Acoustic Microscopy of Sintered Joints – Heaklig Ayala – University of Warwick – 2MB
- UK National Semiconductor Strategy Discussion – Andy Longford – PandA Europe – 3MB
- Plasma Dicing of SiC Semiconductors – Richard Barnett – KLA Corporation – 2MB
- Perfecting the Package: Innovative Final Assembly Steps for Power Module Manufacturing – Steven Derksen – TFA Trim and Form – 1MB
For further information, please contact IMAPS-UK Office
Designing the Future of Additive Manufactured Electronics – Online Workshop Report
The EPSRC supported Design for Additive Manufacturing Network and IMAPS-UK organised Designing the Future of Additive Manufactured Electronics Workshop held on 21st and 22nd April 2021 featured state of the art presentations and interactive sessions to identify the main challenges faced in introducing additive manufacturing within the electronics sector.
Download the Designing the Future of Additive Manufactured Electronics Workshop Event Report (417 downloads) .
Please click on the links in the Report to access the presentation videos on You Tube.
If you need any further information, please contact Design for AM Network or IMAPS-UK Office
Research Showcase: Recent Advances on Reliability and Gate Driving of WBG Power Electronics – 11-12 January 2021 – Downloads
The IMAPS-UK Research Showcase – Recent Advances on Reliability and Gate Driving of WBG Power Electronics addressed several of the key issues critical to the increased adoption of Wide Bandgap (WBG) Semiconductors within the growing power electronics industry.
This event was supported by The Centre for Power Electronics and sponsored by Inseto Ltd.
Programme Literature
Download the Recent Advances on Reliability and Gate Driving of WBG Power Electronics (495 downloads)
Conference Presentations
If you require copies of the presentations, you can download here (click on presentation title):
Day One: Monday 11 January 2021
- Professor Layi Alatise and Dr Jose Ortiz Gonzalez, University of Warwick – Gate Interface Reliability in SiC/GaN Power Devices (420 downloads) – 5MB
- Dr Pearl Agyakwa & Prof Mark Johnson, University of Nottingham – Advances in Packaging Interconnects (416 downloads) – 4MB
- Professor Bernard Stark and Dr Mohammad Hedayati, Bristol University – High Speed Sensing and Monitoring around GaN devices (432 downloads) – 2MB
Day Two: Tuesday 12 January 2021
- Mr. Xiang Wang, Prof. Volker Pickert, Dr. Haimeng Wu, Newcastle University – Optimisation of Switching Transients for SiC MOSFETs (419 downloads) – 1MB
- Prof Stephen Binney, Dr Paul Judge and Ross Mathieson, University of Edinburgh – Exploiting SiC-MOSFET Modules in High Current Applications (508 downloads) – 5MB
- Prof. Francesco Iannuzzo and Assoc. Prof. Amir Sajjad Bahman, Aalborg University – Testing Silicon Carbide Power MOSFETs under Normal and Abnormal Operations (397 downloads) – 5MB
A recording of Day 1 is available. Please click on the link below.
A recording of Day 2 is available. Please click on the link below.
For further information, please contact IMAPS-UK Office
Committee Member
David King
Alter Technology
Kirkton Campus
EH54 7DQ
David King (Sales and marketing Director) joined Optocap in 2017 bringing a wealth of experience in high reliability microelectronics packaging technologies having worked in the industry for over 25 years. He began his career in engineering gaining 15 years’ technical experience in design and product development before moving into sales and business development. He has held roles with responsibilities for high-reliability microelectronics and optoelectronics projects in the UK, Europe and the USA for demanding applications such as aerospace & defence, space, medical, oil & gas & power. David holds a BSc in Electronics & Physics from the Open University.
Summary of IMAPS-UK Activities:
– 2019 Joined the IMAPS-UK committee
Committee Member
Hassan Akhtar
The MTC
Coventry CV7 9JU
Liam received a BEng (Hons) in Aerospace Engineering from the University of Liverpool in 2005. Soon after graduating he joined TT Electronics where roles in Quality, Power Module design and R&D provided the foundation to a career in semiconductor packaging during his 13 years with the company. Technical developments were focused on materials and assembly processes for high temperature electronics and improving reliability of solder joints and wirebonds for Power Electronics for harsh environments, primarily focused on Aerospace applications. He has managed numerous UK/EU funded programs working collaboratively with a wide range of academic and industrial partners. He left TT Electronics in November 2018 and is now working across a broad range of electronics manufacturing research topics ranging from micro and power electronics assemblies to novel circuit board assembly processes for all market sectors at the MTC.
Summary of IMAPS-UK Activities:
– 2019 Joined the IMAPS-UK committee
MT19 Plasma Workshop – downloads
MicroTech 2019 – Downloads
“MT19″ – MicroTech 2019 Annual Conference”Power in Packaging” – Presentation Downloads
IMAPS-UK Information:
0-IMAPS-UK-–-introduction-Apr-2019.pdf (3 downloads)
6-IMAPS-UK-AGM-2019-presentations_v2.pdf (6 downloads)
Presentations
1-Trends-Challenges-TWI.pdf (8 downloads)
2-High-Power-Modules-Dynex-Neil-Sellars.pdf (8 downloads)
3-Powertrains-WDDrury-Ricardo.pdf (6 downloads)
4-3D-Printable-Electrical-Interconnects-DZP.pdf (4 downloads)
5-Additive-Manufacturing-Lboro-Uni.pdf (6 downloads)
7-Liquid-Thermal-Interface-Scheugenpflug.pdf (9 downloads)
8-Dow-silicones.pdf (4 downloads)
9-LTCC-Via.pdf (6 downloads)
10-Wirebonding-KS.pdf (6 downloads)
11-Vacuum-pressure-reflow-SST.pdf (4 downloads)
12-Battery-Bond-applications-Hesse.pdf (6 downloads)
Attendees List
MicroTech-2019-Attendee-list.pdf (10 downloads)
IOT Workshop – Event report
The Interconnect of Things (IoT) workshop was held at the CPI Darlington Facility on 7 February 2019, supported by the CPI Newton Aycliffe.
A brief event report is now available …. It can also be downloaded here … or from the website area – Free downloads
IOT-Feb2019-Event-Report.pdf (738 downloads)Job Vacancies at API Technologies
Role:Product Design Engineers – Packaging and/or Optics
IMAPS-UK corporate member,API Technologies is looking to recruit a number of Product Design Engineers in Packaging and Optics
They are looking for a talented Product Design Engineer to join their Engineering Team where you will provide technical design and layout expertise for both customer and internal released and development products.
Your main responsibilities and duties will include:
– To define, design and develop Opto electronic products for harsh environment applications
– Define and develop Opto electronics manufacturing processes
– Define and develop Opto electronics testing systems & methods
– Define and develop optical fibre interconnects
– Manufacture of prototype products
– Perform and report verification testing of prototype product
– Transfer products from NPI to Manufacture
– Undertake identified aspects of the design and development of new products
– Actively improve or optimise aspects of design, function or processing of existing key products
– Support other departments with urgent issues relating to existing designs or testing, and to formulate effective solutions
Interested candidates should forward their CV to:
Michael Larkins, HR Officer, API Technologies Corp. Michael.Larkins@apitech.com
http://micro.apitech.com/
Download the vacancy details HERE:
- Product Design Engineer (Packaging) JD
- Product Design Engineer (Packaging) Advert
- Product Design Engineer (Optics) JD
- Product Design Engineer (Optics) Advert
Strictly No Agencies
Date:
21 January 2019
Job Vacancy for a Sales Manager – Semiconductor Equipment & Materials
Role:Sales Manager – Semiconductor Equipment & Materials
IMAPS-UK corporate member, Inseto is looking to recruit a specialist full time Sales Manager to develop and grow the Company’s Semiconductor manufacturing equipment and material sales throughout the UK, Ireland and Nordic regions.
The products include wafers, mask aligners, coaters, developers, wafer bonders, metrology systems, plasma systems, probe stations and furnaces etc. The successful candidate would ideally have previous sales experience of high precision equipment used in semiconductor manufacturing and research.
This role will involve extensive travel to customers throughout the UK, Ireland & Nordic region, plus visits to our global supply chain for customer demonstrations, training and other meetings etc.
The successful candidate should be a self-motivated, conscientious and professional individual, who will complement our team and further enhance the Company’s profile.
The position has a competitive salary and benefits package, plus the potential to develop within the Company.
Interested candidates should forward their CV to: enquiries@inseto.co.uk
Download the vacancy details HERE
Strictly No Agencies
Date:
December 2018
