Category Archives: Members Downloads
Members Newsletter – May 2023
The May 2023 Issue of the IMAPS-UK Members Newsletter features the following articles: EMPC23 Conference and Exhibition – 11-14 September 2023 Centre for Power Electronics Annual Conference – 4-5th July 2023 Forthcoming Events – May/June 2023 Download the IMAPS-UK Members Newsletter – May 2023. If you would like to propose articles for inclusion in future…
Members Newsletter – April 2023
The April 2023 Issue of the IMAPS-UK Members Newsletter features the following articles: EMPC23 Conference and Exhibition – 11-14 September 2023 Electric Revolution Skills Hub Forthcoming Events – April 2023 Download the IMAPS-UK Members Newsletter – April 2023. If you would like to propose articles for inclusion in future issues of the Monthly Newsletter, please…
Members Newsletter – March 2023
The March 2023 Issue of the IMAPS-UK Members Newsletter features the following articles: MicroTech 2023 Conference – Advanced Packaging and Technology Trends PEPTUS Stakeholder Webinar – 14 March 2023 Forthcoming Events – March 2023 Download the IMAPS-UK Members Newsletter – March 2023. If you would like to propose articles for inclusion in future issues of…
Members Newsletter – February 2023
The February 2023 Issue of the IMAPS-UK Members Newsletter features the following articles: Government explores national initiatives to boost British Semiconductor industry MicroTech 2023 Conference – Advanced Packaging and Technology Trends Forthcoming Events – February 2023 Download the IMAPS-UK Members Newsletter – February 2023. If you would like to propose articles for inclusion in future…
Members Newsletter – January 2021
The January 2021 Issue of the IMAPS-UK Members Newsletter features the following articles: Opportunities for Corporate Members to Promote Capabilities to Online Audiences Research Showcase – Reliability and Health Management for Wide Band Gap Semiconductors – 11-12 January 2021 Online Events in 2021 Download the . If you would like to propose articles for inclusion…
Members Newsletter – December 2020
The December 2020 Issue of the IMAPS-UK Members Newsletter features the following articles: 2020—This Was the Year that Was……Face to Face Meetings Disappeared and Events went Online What Can IMAPS-UK Members Look Forward to in 2021 Online Events for January 2021 Download the . If you would like to propose articles for inclusion in future…
Thermal Management Online Conference – 25-26 November 2020 – Downloads
The Thermal Management Conference presented some of the latest developments in passive and active cooling, materials, measurement and modelling to address the challenges of enhancing thermal dissipation from advanced electronics systems. This Conference covered many aspects of designing, manufacturing and testing of high thermal performance electronics, where miniaturisation, costs and reliability are critical features that…
Making Sense of Sensors Online Conference – 12 November 2020 – Downloads
The Making Sense of Sensors Conference focused on the packaging challenges presented by the many varied applications driving the growing use of Sensors in our world. Topics presented covered a wide range of industries and applications demonstrating the diverse nature of this sector and the wide array of packaging techniques that are applied. Programme Literature…
Members Newsletter – October 2020
The October 2020 Issue of the IMAPS-UK Members Newsletter features the following articles: Online Conferences for Autumn 2020 The Cusp of a Revolution in NPI Design, Engineering and Manufacturing – Hexagon Manufacturing (MSC Software) Free Online Packaging Tutorial Download the . If you would like to propose articles for inclusion in future issues of the…
MicroTech 20 Online Conference – Advanced Packaging – 16 September 2020 – Downloads
MicroTech 2020 is the annual IMAPS-UK Conference which this year went online and focused on key emerging micro-electronics markets and their associated technological challenges in advanced electronics packaging. The MicroTech 2020 Online Conference featured presentations on System in Package, 3D and wafer level assembly, advanced thermal management materials and plastic packaging for electronics and photonics….
