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Category Archives: News

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Research Showcase: Recent Advances on Reliability and Gate Driving of WBG Power Electronics – 11-12 January 2021 – Downloads

The IMAPS-UK Research Showcase – Recent Advances on Reliability and Gate Driving of WBG Power Electronics addressed several of the key issues critical to the increased adoption of Wide Bandgap (WBG) Semiconductors within the growing power electronics industry.

This event was supported by The Centre for Power Electronics and sponsored by Inseto Ltd.

Programme Literature

Download the Recent Advances on Reliability and Gate Driving of WBG Power Electronics (34 downloads)

Conference Presentations

If you require copies of the presentations, you can download here (click on presentation title):

Day One: Monday 11 January 2021

Day Two: Tuesday 12 January 2021

A recording of Day 1 is available. Please click on the link below.

Recent Advances on Reliability and Gate Driving of WBG Power Electronics Day 1 – 2 hours 19 mins (You Tube)

A recording of Day 2 is available. Please click on the link below.

Recent Advances on Reliability and Gate Driving of WBG Power Electronics Day 2 (27 downloads) – 2 hours 24 mins – 164MB

For further information, please contact IMAPS-UK Office

IMAPS-UK announce Call for Abstracts for Centre for Power Electronics Annual Conference

IMAPS-UK are pleased to announce a Call for Abstracts for Video and Poster Presentations from Early Career Researchers for the Centre for Power Electronics Annual Conference. The CPE Conference will be held Online on 13, 14 and 15 July 2021.

The Centre for Power Electronics (CPE) Annual Conference will bring together the Power Electronics, Machines and Drives Community to review the latest Research and Development that will impact the Electric Revolution.

The main conference topics are relevant to the Power Electronics, Machines and Drives Community covering the following topics:

  • Semiconductor and Passive Devices
  • Packaging and Interconnection
  • Converters, Machines, Drives and Applications
  • Control, Test and Reliability

For more information on the Centre for Power Electronics and its activities, please click on the following link Centre for Power Electronics

For further details please download Call for Abstracts for Video and Poster Presentations from Early Career Researchers (7 downloads)

Abstracts are due by Friday 26th February 2021.

Please submit your Abstract to office@imaps.org.uk

IMAPS-UK announce Call for Abstracts for MicroTech 2021 – Heterogeneous Integration – Packaging Future Microsystems

IMAPS-UK are pleased to announce a Call for Abstracts for MicroTech 2021 on the theme of Heterogeneous Integration – Packaging Future Microsystems. MicroTech 2021 will be held Online on Thursday 25 March 2021.

The main conference topics are based on the Heterogeneous Integration Roadmap produced by the IEEE-EPS, covering the following chapters:

  • High Performance Computing and Data Centres
  • Internet of Things (IoT)
  • Medical, Health and Wearables
  • Automotive
  • Aerospace and Defence
  • Mobile
  • Single-Chip and Multi-Chip Integration
  • Integrated Photonics
  • Integrated Power Electronics
  • MEMS and Sensor Integration
  • 5G Communication
  • Co-Design for Heterogeneous Integration
  • Modelling and Simulation
  • Materials and Emerging Research Materials
  • Emerging Research Devices
  • Test Technologies
  • Supply Chain
  • Security
  • Thermal
  • SiP and Module System Integration
  • Interconnects for 2D and 3D Architectures
  • Wafer Level Packaging

For more information, please click on the following link Heterogeneous Integration Roadmap

For further details please download MicroTech 2021 - Call for Abstracts (71 downloads)

Abstracts are due by Friday 18th December 2020.

Please submit your Abstract to office@imaps.org.uk

Fundamentals of Electronic Packaging Tutorial – A Survey of Failure Analysis Techniques for Packaging by Greg Johnson, Zeiss Microscopy – 23 October 2020

This Packaging Tutorial was supported by Zeiss Microscopy

In order to access a copy of the Audio Version of the presentation, please subscribe to Zeiss Microscopy News.

If you require a copy of the presentation, you can download here:

A Survey of Failure Analysis Techniques for Packaging by Greg Johnson, Zeiss Microscopy (82 downloads) – 21MB

RelQual 2020: Quality and Reliability for Electronic Assembly Workshop Event Report

This IMAPS-UK organised RelQual 2020: Quality and Reliability for Electronic Assembly Workshop and sponsored by Nordson Dage was held at TWI, Abington, Cambridge on 6 February 2020 explored many aspects of New Product Introduction and the challenges faced by the micro-electronics industry in satisfying more demanding customer needs.

Download a copy of the event report

RelQual 2020: Workshop Report (76 downloads)

For those interested in an in-depth course to drive failure rate reduction in electronic products, Martin Shaw of Reliability Solutions is organising a 2 day Seminar entitled “Set Up and Manage World Class Reliability Programme” in Manchester on 12-13th May 2020. Discounts are available for early-bird (before 15th March 2020) and multiple bookings.

Please click HERE for more details on the seminar or download the course brochure below.

Reliability Solutions – Manchester Seminar

Manchester Reliability Seminar (74 downloads)

MfHE 2019 Event report

This IMAPS-UK organised Micro-Electronics Packaging for Harsh Environments Conference held at the Satellite Applications Catapult in Harwell on 28 November 2019 provided guidance for designers and engineers to select suitable electronic packaging materials and processes for extreme environment applications.

Download a copy of the event report HERE.