EMPC 2019 – will be in Pisa Italy on 16 – 19 September 2019
Call for Abstracts:
EMPC-2019-_-Call-for-Abstracts-_-Optimised.pdf (23 downloads)
Information for Exhibitors & Sponsors:
EMPC-2019-Broch-exhib-spons-_-Optimised.pdf (14 downloads)
IMAPS-UK Future Events
The 2nd International Conference on Photonics and Opto Packaging “Linking Optoelectronics Designers & Manufacturers”
Tuesday 23 October 2018
The University Centre, South Devon College, Paignton, TQ4 7EJ
DIE-ATTACH WORKSHOP (DAW)
22 November 2018
A full day workshop is being planned for Thursday 22 November 2018 at the MTC Coventry
Full details are now listed on the event pages ….
DAW Gold Sponsors:
TO BOOK FOR THESE – GO TO THE EVENTS PAGES ON THE WEBSITE
Future Events are being planned for 2019 :
• IoTPackaging Workshop -Feb 2019 – at the CPI Sedgefield
• Basic Packaging Workshop –June 2019 At The CSA Catapult
• Thermal Design Workshop –September 2019
• Space Packaging –October/November 2019
The Annual Conference and Exhibition
Will be held in Cambridge(Granta Centre) –late March/early April 2018
The IMAPS-UK upcoming conference and exhibition on Photonics and Opto Packaging (POP 2) will have IQE as the opening keynote presentation. The conference, organised by IMAPS-UK in conjunction with the Torbay High Tech Forum (THTF) will take place on 23 October at the South Devon College in Paignton. Over 100 delegates are expected as the event is supported by EPIC, the European Photonics Industry Consortium, and IEEE. The full programme will be released very shortly.
IMAPS-UK working with
supported by and
This workshop was held on June 27th 2018 supported by NPL. A brief event report is now available ….ACB-June-2018-Event-Report.pdf (39 downloads)
IMAPS-UK Packaging Webinar held on 3rd July @ 14.30
This was the First of a series of Webinars …..53 people signed up for it. But if you missed it and want to see it it is availbale (but only to members) via the link on our website –
….If you are an IMAPS-UK member …Click here
Number one of a series of webinars organised by IMAPS-UK (International Microelectronics, Assembly and Packaging Society) to showcase presentations given at previous IMAPS events. – This webinar featured two presentations that were first given at the IMAPS/Innovate UK “Advanced Packaging for Compound Semiconductor Applications” workshop in Birmingham.
High Temperature Packaging for SiC Devices by Liam Mills, TT Semelab
Advanced Packaging for RF/Microwave Applications by Steve Riches, Tribus-D
Also you will be pleased to know that we will be running the next on on the 6th September – on next generation Packaging presented at MicroTech 2018
NOTE: This one was Free of charge to join. It is our intention to charge non-members at some point. So treat this as a member benefit.
The programme for the IMAPS-UK 5oth Anniversary MicroTech Conference is now available – see the event pages. Added to this event is an Intensive half day workshop on Monday 9 April(the day before the conference), on The Science of Bond Testing, run by Bob Sykes of XYZTEC.
The number of places available is limited – Click here for details : Bond test workshop_V2
Did you know copies of recent Newsletters and Past Event reports can all be downloaded free from the IMAPS-UK website!
To beging downloading, simply select the following menu: Members > Downloads > Free Downloads
Or simply click on the following link: https://www.imaps.org.uk/2016/12/13/free-downloads/
Happy reading – IMAPS-UK
IMAPS-UK is pleased to announce a hugely successful “MicroTech” Annual Conference, which was held at Rutherford Appleton Laboratory on 16th March 2017. Comments received by the organisers included:
“I thought MicroTech this year was excellent, very well attended, and I ran out of time to do some of the things I intended”.
“We have developed new and existing customers from the event, it was superb!”
“Very enjoyable, well done IMAPS-UK”
Some numbers about the event:
- 125 delegates
- 18 table-top exhibitors
- 96% of delegates surveyed rated it excellent or very good
Click HERE to read a full review “A looking back at MicroTech 2017”