Category Archives: News
Power and High Temperature Conference – 28 May 2020
The Conference addressed many of the Electronics Manufacturing Challenges and Solutions for the Electric Revolution
This Free Online Conference was organised to Support to the Electronic Packaging Community in these unprecedented times.
Download the Power and High Temperature Conference Booklet (100 downloads)
If you require copies of the presentations, you can download here:
- M Cherrington - Innovate UK - Driving the Electric Revolution: Building UK Supply Chains for PEMD (76 downloads) – 1MB
- S Riches - Tribus-D - Can High Temperature Materials and Processes be applied to Power Electronics Packaging (80 downloads) – 2MB
- M Johnson - Nottingham University - Packaging and Integration Solutions for Wide Band-Gap Power Electronics (73 downloads) – 2MB
- A Syed-Khaja - Heraeus - High Temperature Interconnect Materials - Final (81 downloads) – 3MB
- R Dixon - Dycotec Materials - Introducing the All-Copper Interconnect Technology (73 downloads) – 3MB
- T Bissett - DK Daleba - PCB Substrates and Methods for High Temperature Applications (updated) (31 downloads) – 2MB
- J Boston - CIL Ltd - High Temperature and High Vibration Electronics Manufacturing (80 downloads) – 1MB
- M Wickham - NPL - Materials Testing at Elevated Temperatures/Power Cycling (70 downloads) – 4MB
- P Tremlett - Microchip Inc - Moving control systems to the “hot, sweaty heart of the action” (72 downloads) – 3MB
- S Sillars - Osprey Sandvik - Controlled Expansion Alloys for Thermal Management Applications (72 downloads) – 5MB
It is planned to upload the recording of the Conference in the near future.
For further information, please contact IMAPS-UK Office
Fundamentals of Electronic Packaging Tutorial – Metallurgical Considerations
Packaging Tutorial - Metallurgical Considerations (51 downloads) – 125MB
Click on the above heading to download to listen and view the presentation made on 15 May 2020. It lasts approximately 40 minutes.
If you just require a copy of the presentation, you can download here:
Fundamentals of Electronic Packaging Tutorial – The Future for Substrates
The Future for Substrates (79 downloads) – 58MB
Click on the above heading to download to listen and view the presentation made on 1 May 2020. It lasts approximately 40 minutes.
If you just require a copy of the presentation, you can download here:
Fundamentals of Electronic Packaging Tutorial – Die Attach and Interconnect
Die Attach and Interconnect Tutorial (105 downloads) – 93MB
Click on the above heading to download to listen and view the presentation made on 17th April 2020. It lasts approximately 40 minutes.
If you just require a copy of the presentation, you can download here:
Die Attach and Interconnect Tutorial Presentation (107 downloads) – 3MB
Design for Manufacturing – Webinar #6 – view it here
IMAPS-UK Webinar Design for Manufacturing
Click on the above heading to download and view the video of the Design for Manufacturing Webinar held on 11th March 2020. It lasts approximately 1 hour 15 minutes.
If you just require a copy of the slides, you can download here:
MicroTech 2020 has been postponed until 16th September 2020
Due to the exceptional circumstances we find ourselves in as a result of the global Covid-19 pandemic, we have decided to postpone the MicroTech Conference from 19th March 2020 to 16th September 2020 * for this year only, still to be held at RAL, Harwell Campus (* provisional date – subject to confirmation).
All details will remain unchanged with regards speaker agenda, venue, exhibitors and activities planned throughout the day.
Tickets pre-registered for the event are valid for the new date.
The event will revert back to its normal schedule in the first half of the year from 2021.
We shall look forward to seeing you in September. We will be in touch in due course with further details.
Please do not hesitate to contact the IMAPS-UK Office if you need any further information.
CSA Catapult Professional Development Course on Advanced Packaging Technologies and Methodologies
The Compound Semiconductor Applications (CSA) Catapult is organising an intensive two day Professional Development course on “Advanced Packaging Technologies and Methodologies for Compound Semiconductors” on 24th and 25th March 2020 at their facility in Newport, South Wales. The course, run by Andy Longford, will cover the details of electronic packaging requirements for RF, Photonics and Power applications, including demonstrations of state of the art die attach and interconnection processes.
Please click HERE to book your place on the Professional Development course or download the course outline below.
CSA Catapult - Professional Development Course (28 downloads)
RelQual 2020: Quality and Reliability for Electronic Assembly Workshop Event Report
This IMAPS-UK organised RelQual 2020: Quality and Reliability for Electronic Assembly Workshop and sponsored by Nordson Dage was held at TWI, Abington, Cambridge on 6 February 2020 explored many aspects of New Product Introduction and the challenges faced by the micro-electronics industry in satisfying more demanding customer needs.
Download a copy of the event report
RelQual 2020: Workshop Report (25 downloads)
For those interested in an in-depth course to drive failure rate reduction in electronic products, Martin Shaw of Reliability Solutions is organising a 2 day Seminar entitled “Set Up and Manage World Class Reliability Programme” in Manchester on 12-13th May 2020. Discounts are available for early-bird (before 15th March 2020) and multiple bookings.
Please click HERE for more details on the seminar or download the course brochure below.
Reliability Solutions – Manchester Seminar
Manchester Reliability Seminar (25 downloads)
Micro-Electronics Packaging for Harsh Environments – Webinar #5 – view it here
IMAPS-UK Webinar Micro-Electronics Packaging for Harsh Environments
Click on the above heading to download and view the video of the Micro-Electronics Packaging for Harsh Environments Webinar held on 20th January 2020. It lasts approximately 1 hour 20 minutes.
If you just require a copy of the slides, you can download here:
MfHE 2019 Event report
This IMAPS-UK organised Micro-Electronics Packaging for Harsh Environments Conference held at the Satellite Applications Catapult in Harwell on 28 November 2019 provided guidance for designers and engineers to select suitable electronic packaging materials and processes for extreme environment applications.
Download a copy of the event report HERE.
