This IMAPS-UK organised RelQual 2020: Quality and Reliability for Electronic Assembly Workshop and sponsored by Nordson Dage was held at TWI, Abington, Cambridge on 6 February 2020 explored many aspects of New Product Introduction and the challenges faced by the micro-electronics industry in satisfying more demanding customer needs.
Download a copy of the event report
For those interested in an in-depth course to drive failure rate reduction in electronic products, Martin Shaw of Reliability Solutions is organising a 2 day Seminar entitled “Set Up and Manage World Class Reliability Programme” in Manchester on 12-13th May 2020. Discounts are available for early-bird (before 15th March 2020) and multiple bookings.
Please click HERE for more details on the seminar or download the course brochure below.
Reliability Solutions – Manchester Seminar
Click on the above heading to download and view the video of the Micro-Electronics Packaging for Harsh Environments Webinar held on 20th January 2020. It lasts approximately 1 hour 20 minutes.
If you just require a copy of the slides, you can download here:
This IMAPS-UK organised Micro-Electronics Packaging for Harsh Environments Conference held at the Satellite Applications Catapult in Harwell on 28 November 2019 provided guidance for designers and engineers to select suitable electronic packaging materials and processes for extreme environment applications.
Download a copy of the event report HERE.
The theme of MicroTech 2019 was “Power in Packaging”, reviewing the materials, processes and equipment required to manufacture “state of the art” power modules for the transportation and energy industries.
Download a copy of the event report here .. MicroTech 2019 Event report (145 downloads)
The Interconnect of Things (IoT) workshop was held at the CPI Darlington Facility on 7 February 2019, supported by the CPI Newton Aycliffe.
A brief event report is now available …. It can also be downloaded here … or from the website area – Free downloadsIOT-Feb2019-Event-Report.pdf (114 downloads)
Role:Product Design Engineers – Packaging and/or Optics
IMAPS-UK corporate member,API Technologies is looking to recruit a number of Product Design Engineers in Packaging and Optics
They are looking for a talented Product Design Engineer to join their Engineering Team where you will provide technical design and layout expertise for both customer and internal released and development products.
Your main responsibilities and duties will include:
– To define, design and develop Opto electronic products for harsh environment applications
– Define and develop Opto electronics manufacturing processes
– Define and develop Opto electronics testing systems & methods
– Define and develop optical fibre interconnects
– Manufacture of prototype products
– Perform and report verification testing of prototype product
– Transfer products from NPI to Manufacture
– Undertake identified aspects of the design and development of new products
– Actively improve or optimise aspects of design, function or processing of existing key products
– Support other departments with urgent issues relating to existing designs or testing, and to formulate effective solutions
Interested candidates should forward their CV to:
Download the vacancy details HERE:
- Product Design Engineer (Packaging) JD
- Product Design Engineer (Packaging) Advert
- Product Design Engineer (Optics) JD
- Product Design Engineer (Optics) Advert
Strictly No Agencies
21 January 2019
Role:Sales Manager – Semiconductor Equipment & Materials
IMAPS-UK corporate member, Inseto is looking to recruit a specialist full time Sales Manager to develop and grow the Company’s Semiconductor manufacturing equipment and material sales throughout the UK, Ireland and Nordic regions.
The products include wafers, mask aligners, coaters, developers, wafer bonders, metrology systems, plasma systems, probe stations and furnaces etc. The successful candidate would ideally have previous sales experience of high precision equipment used in semiconductor manufacturing and research.
This role will involve extensive travel to customers throughout the UK, Ireland & Nordic region, plus visits to our global supply chain for customer demonstrations, training and other meetings etc.
The successful candidate should be a self-motivated, conscientious and professional individual, who will complement our team and further enhance the Company’s profile.
The position has a competitive salary and benefits package, plus the potential to develop within the Company.
Interested candidates should forward their CV to: email@example.com
Download the vacancy details HERE
Strictly No Agencies
IMAPS-UK has set up a new LINKED-IN “group” ….. https://www.linkedin.com/company/imaps-uk ……. in order to overcome problems of sharing information about events and other matters relating to the Society.
Our existing Linked-In group page has some 390 plus followers but unfortunately it is not set up in a manner to allow people to share. Our new site does … so please look at it and “follow” what goes on … it should have lots of good news and industry related posts that will make it an asset to your work in the Microelectronics Community.
IMAPS-UK corporate member, Custom Interconnect Limited(CIL) is looking to recruit up to 3 Graduate Engineers to work in their microelectronics manufacturing area. A job specification is available to download here. For further details, contact Mr John Boston (John.Boston@cil-uk.co.uk) or firstname.lastname@example.org
The Die Attach Workshop (DAW) was held at the MTC, Coventry on 22 November 2018, sponsored by Accelonix and Inseto
A brief event report is now available …. It can also be downloaded here … or from the website area – Free downloadsDAW_workshop_article_v4.pdf (126 downloads)