IMAPS-UK Corporate Member Accelonix is organising a Technology Day on Wednesday 21st October 2026 to demonstrate how advanced inspection, test and analysis techniques can reveal issues that are often hidden from conventional inspection methods at their facility in Linton, Cambridge, CB21 4NW.

This complimentary event is focused on helping engineers and manufacturing specialists gain deeper insight into the defects, failure mechanisms and process variations that can impact product quality and long-term reliability.

Particularly relevant to those involved in microelectronics packaging, semiconductor assembly, die attach, wire bonding, power electronics, hybrid circuits, advanced substrates and high-reliability electronic products, the event will cover technologies used to investigate:

• Hidden defects and manufacturing anomalies
• Unseen interconnect failures
• Packaging and assembly quality issues
• Voiding, cracking and structural integrity concerns
• Process variation and reliability risks
• Failure analysis and root-cause investigation techniques

The day includes presentations and live demonstrations from leading technology providers including ViTrox, Takaya, Parmi, Comet Yxlon, Deben and Dragonfly, showcasing X-ray inspection, CT analysis, AOI, flying probe test and advanced image analysis solutions. The theme of the day, “What Are You Missing? – Making Better Manufacturing Decisions”, reflects the challenge facing many organisations today: understanding what lies beneath the surface of increasingly complex electronic assemblies, packages and interconnect structures before reliability issues appear in the field.

Download the Accelonix – Technology Day Flyer and Agenda.

Attendance is free of charge; however, places are limited and registration is required.

To reserve your place, please contact sales@accelonix.co.uk.

The National Advanced Semiconductor Packaging and Integration Centre (NASPIC) – Market Demand Study has made the following information available.

The National Advanced Semiconductor Packaging and Integration Centre (NASPIC) – Market Demand Study Webinar took place on Wednesday 16th September 2026

Download the National Advanced Semiconductor Packaging and Integration Centre (NASPIC) – Overview

Download the National Advanced Semiconductor Packaging and Integration Centre (NASPIC) – Market Demand Study Presentation by NMIS

Click on the Video link below to view the recording (20 mins)

Link to Online Questionnaire

Please find below the link to the online Questionnaire. Please complete this questionnaire by Friday 9th October 2026.

Click on the National Advanced Semiconductor Packaging and Integration Centre (NASPIC) – Market Demand Study Questionnaire

For further information, please contact IMAPS-UK Office

The IMAPS-UK Academic Conference 2026 has made the following information available.

The IMAPS-UK Academic Conference 2026 took place on Wednesday 2nd September 2026 at the University of Warwick, Coventry, UK focused on Advanced Packaging R&D in the UK.

Download the IMAPS-UK Academic Conference 2026 Report

For further information, please contact IMAPS-UK Office

IMAPS-UK is pleased to announce a Call for Abstracts for the Annual MicroTech 2027 Conference with the theme of Perfecting the Process of Packaging.

The MicroTech 2027 Conference will be held at the Holywell Park Conference Centre, Loughborough on Thursday 8 April 2027.

Abstracts are invited on the following topics:

• Applications
• Advanced Packaging Technologies
• Electronics Design, Materials and Manufacturing
• Test and Reliability Assessment

For further details, please download MicroTech 2027 – Call for Abstracts

Abstracts are due by Friday 27th November 2026.

Please submit your Title and Abstract (200-300 words) to office@imaps.org.uk

REWIRE has announced the next funding opportunity round for groundbreaking projects on wide band gap (WBG) and ultra-wide band gap (UWBG) power semiconductors.

This call aims to support ground-breaking research and proof-of-concept projects led by early career researchers (ECRs) that advance understanding and capability in WBG/UWBG semiconductor devices and packaging.

The guidelines for the Open Call for Proposals can be downloaded HERE

The deadline for Proposal Submission is Tuesday 3rd November 2026.

For more information, please click on the following link REWIRE Open Call for Proposals for Power Semiconductor Innovation

Call for Abstracts for RF, Microwave and Photonics Packaging (RaMPoP) Conference to be held on Thursday 26th November 2026 at the Semiconductor Catapult, Newport, South Wales, NP10 8BE

Assembly and Packaging is necessary to make RF, microwave and photonics devices reliable and manufacturable products. As operating frequencies push into the mmWave band and beyond and signals cross between the electrical and optical domains, the package itself becomes a critical part of the circuit – setting the limits on electrical and optical performance, thermal management, reliability and cost. This makes assembly and packaging a natural unifying theme across RF, microwave and photonics applications.

IMAPS-UK invites abstracts covering the following topics:

• Materials & substrates – low-loss laminates, LTCC/HTCC ceramics, glass and organic interposers
• Interconnects & transitions – flip-chip vs. wire bond, low-loss RF/mmWave transitions and vertical interconnects
• Thermal management – heat spreading and die-attach for high-power RF, Opto and Photonic devices and laser sources
• Hermeticity & reliability – sealing, moisture control and environmental/space qualification
• Photonic integration – fibre alignment and attach, electro-optic co-packaging and hybrid RF-photonic assembly
• Modelling, test & EMC – multiphysics co-design, shielding, grounding and antenna-in-package

Please submit your Title and Abstract of up to 200 words to office@imaps.org.uk by Friday 28th August 2026

The 2nd International Responsible Electronics and Circular Technologies (REACT) Conference will be held at the Technology and Innovation Centre, 99 George Street, Glasgow, G1 1RD on Tuesday 17 November and Wednesday 18 November 2026.

Abstracts are invited on the following topics for Oral and Poster Presentation:

• Electronics Design for Circularity
• New Materials in Electronics
• Critical Raw Materials and Urban Mining
• Sustainable Electronics Manufacturing and Industry Initiatives
• Enabling Green Data Centres
• Electronics Towards Digital Product Passports
• Business and Policy
• Value Retention for Electronics

For further details please visit REACT Conference 2026 – Call for Papers

Abstracts are due by Sunday 21st June 2026.

Please submit your Abstract to react@gla.ac.uk

Call for Speakers

The call for speakers for the 2026 Cambridge Wireless Technology and Engineering Conference (CWTEC) on Wednesday 8 July 2026 is now open. Don’t miss the opportunity to speak to 200+ major industry players, including senior engineers, technologists, academics, and business leaders.

Building on last year’s focus on 6G, the 2026 conference will examine the critical enabling technologies behind next-generation innovation, with particular emphasis on semiconductors and photonics as the foundations for future connectivity, compute capability, and emerging technology applications. The programme will focus on practical insight, technical depth, and strategic discussion around the technologies most likely to define the UK’s next wave of innovation.

CWTEC Focuses on four sessions:

• UK Strengths, Capabilities & Gaps
• Power Electronics, Photonics and Quantum – Does the Past Dictate the Future?
• Design & Future Compute Architectures
• Sovereign Supply Chains

For more information and guidelines for submitting an abstract, please visit:

CWTEC: Call for Speakers

Applications can be submitted until: Friday 8th May 2026