Category Archives: News
IMAPS-UK has a new Linked-In Site – please follow it
IMAPS-UK has set up a new LINKED-IN “group” ….. https://www.linkedin.com/company/imaps-uk ……. in order to overcome problems of sharing information about events and other matters relating to the Society.
Our existing Linked-In group page has some 390 plus followers but unfortunately it is not set up in a manner to allow people to share. Our new site does … so please look at it and “follow” what goes on … it should have lots of good news and industry related posts that will make it an asset to your work in the Microelectronics Community.
https://www.linkedin.com/company/imaps-uk
DAW – Event report
The Die Attach Workshop (DAW) was held at the MTC, Coventry on 22 November 2018, sponsored by Accelonix and Inseto
A brief event report is now available …. It can also be downloaded here … or from the website area – Free downloads
DAW_workshop_article_v4.pdf (12 downloads)Advanced Circuit Board Technologies – Webinar #3 – view it here
2018-11-01 14.30 Advanced Circuit Boards – IMAPS Webinar
Click on the above heading to download and view the video of the Advanced Circuit Boards Webinar held on 1st November 2018. It lasts approximately 1 hour 15 minutes.
If you just require a copy of the slides, you can download here:
POP2 Conference – Event report
The POP2 Conference and Exhibition was held at the South Devon College workshop on 23 October 2018 supported by The Torbay Hi-Tech Forum, EPIC and IEEE-EPS
A brief event report is now available …. It can also be downloaded here … or from the website area – Free downloads
PoP2_conference_review-report.pdf (34 downloads)Directions in Advanced Packaging – Webinar #2 – view it here
2018-10-02 14.30 Directions in Advanced Packaging – IMAPS Webinar
Click on the above heading to download and view the video of the Directions for Packaging Webinar held on 2 October 2018. It lasts approximately 1 hour 30 minutes.
If you just require a copy of the slides, you can download here:
EMPC 2019 – Pisa Italy
EMPC 2019 – will be in Pisa Italy on 16 – 19 September 2019
………
Call for Abstracts:
EMPC-2019-_-Call-for-Abstracts-_-Optimised.pdf (73 downloads)
Information for Exhibitors & Sponsors:
EMPC-2019-Broch-exhib-spons-_-Optimised.pdf (57 downloads)
New Events for IMAPS-UK – AUG 2018
IMAPS-UK Future Events
The 2nd International Conference on Photonics and Opto Packaging “Linking Optoelectronics Designers & Manufacturers”
Tuesday 23 October 2018
The University Centre, South Devon College, Paignton, TQ4 7EJ
DIE-ATTACH WORKSHOP (DAW)
22 November 2018
A full day workshop is being planned for Thursday 22 November 2018 at the MTC Coventry
Full details are now listed on the event pages ….
DAW Gold Sponsors:
TO BOOK FOR THESE – GO TO THE EVENTS PAGES ON THE WEBSITE
Future Events are being planned for 2019 :
————————————————–
• IoTPackaging Workshop -Feb 2019 – at the CPI Sedgefield
• Basic Packaging Workshop –June 2019 At The CSA Catapult
• Thermal Design Workshop –September 2019
• Space Packaging –October/November 2019
MicroTech 2019
The Annual Conference and Exhibition
Will be held in Cambridge(Granta Centre) –late March/early April 2018
POP2 – IQE to present the keynote presentation
The IMAPS-UK upcoming conference and exhibition on Photonics and Opto Packaging (POP 2) will have IQE as the opening keynote presentation. The conference, organised by IMAPS-UK in conjunction with the Torbay High Tech Forum (THTF) will take place on 23 October at the South Devon College in Paignton. Over 100 delegates are expected as the event is supported by EPIC, the European Photonics Industry Consortium, and IEEE. The full programme will be released very shortly.
IMAPS-UK working with 
supported by 
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ACB Workshop – Event report
This workshop was held on June 27th 2018 supported by NPL. A brief event report is now available ….
ACB-June-2018-Event-Report.pdf (69 downloads)Advanced Packaging Webinar – update
IMAPS-UK Packaging Webinar held on 3rd July @ 14.30
This was the First of a series of Webinars …..53 people signed up for it. But if you missed it and want to see it it is availbale (but only to members) via the link on our website –
….If you are an IMAPS-UK member …Click here
Number one of a series of webinars organised by IMAPS-UK (International Microelectronics, Assembly and Packaging Society) to showcase presentations given at previous IMAPS events. – This webinar featured two presentations that were first given at the IMAPS/Innovate UK “Advanced Packaging for Compound Semiconductor Applications” workshop in Birmingham.
High Temperature Packaging for SiC Devices by Liam Mills, TT Semelab
And
Advanced Packaging for RF/Microwave Applications by Steve Riches, Tribus-D
