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Category Archives: News

News item.

IMAPS-UK has a new Linked-In Site – please follow it

IMAPS-UK has set up a new LINKED-IN “group”  ….. ……. in order to overcome problems of sharing information about events and other matters relating to the Society.

Our existing Linked-In group page has some 390 plus followers but unfortunately it is not set up in a manner to allow people to share.  Our new site does … so please look at it and “follow” what goes on … it should have lots of good news and industry related posts that will make it an asset to your work in the Microelectronics Community.


New Events for IMAPS-UK – AUG 2018

IMAPS-UK Future Events

The 2nd International Conference on Photonics and Opto Packaging “Linking Optoelectronics Designers & Manufacturers”
Tuesday 23 October 2018
The University Centre, South Devon College, Paignton, TQ4 7EJ

22 November 2018
A full day workshop is being planned for Thursday 22 November 2018 at the MTC Coventry
Full details are now listed on the event pages ….

DAW Gold Sponsors:




Future Events are being planned for 2019 :

•  IoTPackaging Workshop -Feb 2019 – at the CPI Sedgefield
•  Basic Packaging Workshop –June 2019  At The CSA Catapult
•  Thermal Design Workshop –September 2019
•  Space Packaging –October/November 2019

MicroTech 2019
The Annual Conference and Exhibition
Will be held in Cambridge(Granta Centre) –late March/early April 2018

POP2 – IQE to present the keynote presentation

The IMAPS-UK upcoming conference and exhibition on Photonics and Opto Packaging (POP 2) will have IQE as the opening keynote presentation.   The conference, organised by IMAPS-UK in conjunction with the Torbay High Tech Forum (THTF) will take place on 23 October at the South Devon College in Paignton.  Over 100 delegates are expected as the event is supported by EPIC, the European Photonics Industry Consortium, and IEEE.  The full programme will be released very shortly.

IMAPS-UK  working with   

supported by          and   

Advanced Packaging Webinar – update

IMAPS-UK Packaging Webinar held on 3rd July @ 14.30

This was the First of a series of Webinars …..53 people signed up for it.  But if you missed it and want to see it it is availbale (but only to members) via the link on our website –

….If you are an IMAPS-UK member …Click here 

Number one of a series of webinars organised by IMAPS-UK (International Microelectronics, Assembly and Packaging Society) to showcase presentations given at previous IMAPS events. – This webinar featured two presentations that were first given at the IMAPS/Innovate UK “Advanced Packaging for Compound Semiconductor Applications” workshop in Birmingham.

High Temperature Packaging for SiC Devices by Liam Mills, TT Semelab
Advanced Packaging for RF/Microwave Applications by Steve Riches, Tribus-D

Also you will be pleased to know that we will be running the next on on the 6th September – on next generation Packaging presented at MicroTech 2018

NOTE:  This one was Free of charge to join. It is our intention to charge non-members at some point.  So treat this as a member benefit.