Category Archives: News
IMAPS-UK announce Call for Abstracts for MicroTech 2021 – Heterogeneous Integration
IMAPS-UK are pleased to announce a Call for Abstracts for MicroTech 2021 on the theme of Heterogeneous Integration – Packaging Future Microsystems. MicroTech 2021 will be held Online on Thursday 25 March 2021.
The main conference topics are based on the Heterogeneous Integration Roadmap produced by the IEEE-EPS, covering the following chapters:
- High Performance Computing and Data Centres
- Internet of Things (IoT)
- Medical, Health and Wearables
- Automotive
- Aerospace and Defence
- Mobile
- Single-Chip and Multi-Chip Integration
- Integrated Photonics
- Integrated Power Electronics
- MEMS and Sensor Integration
- 5G Communication
- Co-Design for Heterogeneous Integration
- Modelling and Simulation
- Materials and Emerging Research Materials
- Emerging Research Devices
- Test Technologies
- Supply Chain
- Security
- Thermal
- SiP and Module System Integration
- Interconnects for 2D and 3D Architectures
- Wafer Level Packaging
For more information, please click on the following link Heterogeneous Integration Roadmap
For further details please download MicroTech 2021 - Call for Abstracts (12 downloads)
Abstracts are due by Friday 18th December 2020.
Please submit your Abstract to office@imaps.org.uk
Fundamentals of Electronic Packaging Tutorial – A Survey of Failure Analysis Techniques for Packaging by Greg Johnson, Zeiss Microscopy – 23 October 2020
This Packaging Tutorial was supported by Zeiss Microscopy
In order to access a copy of the Audio Version of the presentation, please subscribe to Zeiss Microscopy News.
If you require a copy of the presentation, you can download here:
Fundamentals of Electronic Packaging Tutorial – Circuit Nano-Surgery and Failure Analysis
Circuit Nano-Surgery and Failure Analysis - Lloyd Peto, Nanoscope Services (94 downloads) – 88MB
Click on the above heading to download to listen and view the presentation made on 18 September 2020. It lasts approximately 46 minutes.
If you just require a copy of the presentation, you can download here:
Fundamentals of Electronic Packaging Tutorial – Micro-Characterisation for Electronics
Micro-Characterisation for Electronics - Stuart Robertson - Loughborough University (60 downloads) – 49MB
Click on the above heading to download to listen and view the presentation made on 4 September 2020. It lasts approximately 30 minutes.
If you just require a copy of the presentation, you can download here:
Micro-Characterisation for Electronic Materials (94 downloads) – 8MB
Design for Manufacturing – Webinar #6 – view it here
IMAPS-UK Webinar Design for Manufacturing
Click on the above heading to download and view the video of the Design for Manufacturing Webinar held on 11th March 2020. It lasts approximately 1 hour 15 minutes.
If you just require a copy of the slides, you can download here:
RelQual 2020: Quality and Reliability for Electronic Assembly Workshop Event Report
This IMAPS-UK organised RelQual 2020: Quality and Reliability for Electronic Assembly Workshop and sponsored by Nordson Dage was held at TWI, Abington, Cambridge on 6 February 2020 explored many aspects of New Product Introduction and the challenges faced by the micro-electronics industry in satisfying more demanding customer needs.
Download a copy of the event report
RelQual 2020: Workshop Report (69 downloads)
For those interested in an in-depth course to drive failure rate reduction in electronic products, Martin Shaw of Reliability Solutions is organising a 2 day Seminar entitled “Set Up and Manage World Class Reliability Programme” in Manchester on 12-13th May 2020. Discounts are available for early-bird (before 15th March 2020) and multiple bookings.
Please click HERE for more details on the seminar or download the course brochure below.
Reliability Solutions – Manchester Seminar
Manchester Reliability Seminar (66 downloads)
Micro-Electronics Packaging for Harsh Environments – Webinar #5 – view it here
IMAPS-UK Webinar Micro-Electronics Packaging for Harsh Environments
Click on the above heading to download and view the video of the Micro-Electronics Packaging for Harsh Environments Webinar held on 20th January 2020. It lasts approximately 1 hour 20 minutes.
If you just require a copy of the slides, you can download here:
MfHE 2019 Event report
This IMAPS-UK organised Micro-Electronics Packaging for Harsh Environments Conference held at the Satellite Applications Catapult in Harwell on 28 November 2019 provided guidance for designers and engineers to select suitable electronic packaging materials and processes for extreme environment applications.
Download a copy of the event report HERE.
MicroTech 2019 Event report
The theme of MicroTech 2019 was “Power in Packaging”, reviewing the materials, processes and equipment required to manufacture “state of the art” power modules for the transportation and energy industries.
Download a copy of the event report here .. MicroTech 2019 Event report (219 downloads)
IOT Workshop – Event report
The Interconnect of Things (IoT) workshop was held at the CPI Darlington Facility on 7 February 2019, supported by the CPI Newton Aycliffe.
A brief event report is now available …. It can also be downloaded here … or from the website area – Free downloads
IOT-Feb2019-Event-Report.pdf (162 downloads)