Category Archives: Uncategorised

National Advanced Semiconductor Packaging and Integration Centre – Market Demand Study

The National Advanced Semiconductor Packaging and Integration Centre (NASPIC) – Market Demand Study has made the following information available.

The National Advanced Semiconductor Packaging and Integration Centre (NASPIC) – Market Demand Study Webinar took place on Wednesday 16th September 2026

Download the National Advanced Semiconductor Packaging and Integration Centre (NASPIC) – Overview

Download the National Advanced Semiconductor Packaging and Integration Centre (NASPIC) – Market Demand Study Presentation by NMIS

Click on the Video link below to view the recording (20 mins)

Link to Online Questionnaire

Please find below the link to the online Questionnaire. Please complete this questionnaire by Friday 9th October 2026.

Click on the National Advanced Semiconductor Packaging and Integration Centre (NASPIC) – Market Demand Study Questionnaire

For further information, please contact IMAPS-UK Office

IMAPS-UK Academic Conference 2026 – Report

The IMAPS-UK Academic Conference 2026 has made the following information available.

The IMAPS-UK Academic Conference 2026 took place on Wednesday 2nd September 2026 at the University of Warwick, Coventry, UK focused on Advanced Packaging R&D in the UK.

Download the IMAPS-UK Academic Conference 2026 Report

For further information, please contact IMAPS-UK Office

Call for Abstracts for MicroTech 2027 – Thursday 8 April 2027

IMAPS-UK is pleased to announce a Call for Abstracts for the Annual MicroTech 2027 Conference with the theme of Perfecting the Process of Packaging.

The MicroTech 2027 Conference will be held at the Holywell Park Conference Centre, Loughborough on Thursday 8 April 2027.

Abstracts are invited on the following topics:

Applications
Advanced Packaging Technologies
Electronics Design, Materials and Manufacturing
Test and Reliability Assessment

For further details, please download MicroTech 2027 – Call for Abstracts

Abstracts are due by Friday 27th November 2026.

Please submit your Title and Abstract (200-300 words) to office@imaps.org.uk

REWIRE: Early Career Researchers: Open Call for Proposals for Power Semiconductor Innovation

REWIRE has announced the next funding opportunity round for groundbreaking projects on wide band gap (WBG) and ultra-wide band gap (UWBG) power semiconductors.

This call aims to support ground-breaking research and proof-of-concept projects led by early career researchers (ECRs) that advance understanding and capability in WBG/UWBG semiconductor devices and packaging.

The guidelines for the Open Call for Proposals can be downloaded HERE

The deadline for Proposal Submission is Tuesday 3rd November 2026.

For more information, please click on the following link REWIRE Open Call for Proposals for Power Semiconductor Innovation

Eamonn Redmond – Vice Chair

Eamonn Redmond
Inseto (UK) Limited
Hampshire
SP10 5NY

Role Description

Biography

After completing his B. Eng. in Electronics at the University of Limerick, Eamonn joined Analog Devices in 1986, starting as an In-Line Test Engineer before becoming a Process Engineer. Both roles gave him a valuable understanding of the Hybrid Thick-Film industry, especially the die attach and wirebond processes, as well as a detailed knowledge of the requirements of environmental testing such as burn-in, temperature cycling, and temperature shock. Transitioning to Analog’s Monolithic IC division, Eamonn finished his time at Analog as their IC Production Manager, which allowed him to gain experience in wafer-level test & probe, package-level test, and the demands of a modern production environment.
Moving to Dage Intersem in the mid-nineties was the beginning of Eamonn’s sales career. Primarily responsible for die attach products such as eutectic solder and adhesives, the various materials used in wire & ribbon bonding, and the packaging requirements that the Hi-Rel industry demands, Eamonn gained valuable experience with Dage before joining Inseto in 1996 in a similar role.
With Inseto his responsibilities have expanded to include substrate materials such as thick film inks & thin film substrates, as well as a comprehensive range of adhesives for various applications within the microelectronics industry, specifically die attach adhesive & IC encapsulation materials.
As his role within Inseto has grown, Eamonn joined the Board of Directors in 2010 to become a part of the strategic leadership team sustaining and guiding the company in the sometimes difficult environment of the UK’s electronics industry!

Summary of IMAPS-UK Activities:
– 2021 Joined the IMAPS-UK committee

Carolyn Short – Chair

Carolyn Short
KLA Corporation UK Ltd
Newport
NP10 8BE

Biography

Carolyn Short is a Marketing Communications Manager for KLA Corporation in Newport, South Wales. She joined Surface Technology Systems in 2001, which ultimately became SPTS Technologies in 2009, and was acquired by KLA in 2019. She works with within the Marketing Department, promoting KLA’s range of etch and deposition equipment within MEMS, RF, Power and Advanced Packaging markets. After assisting in the organisation of Microtech 2019 and 2020, she formally joined the IMAPS-UK committee in May 2020.

She holds a BEng in Metallurgy and Materials Science and a PhD in Magnetic Materials from University of Birmingham.

Call for Abstracts for RaMPoP Conference, Newport on 26 November 2026

Call for Abstracts for RF, Microwave and Photonics Packaging (RaMPoP) Conference to be held on Thursday 26th November 2026 at the Semiconductor Catapult, Newport, South Wales, NP10 8BE

Assembly and Packaging is necessary to make RF, microwave and photonics devices reliable and manufacturable products. As operating frequencies push into the mmWave band and beyond and signals cross between the electrical and optical domains, the package itself becomes a critical part of the circuit – setting the limits on electrical and optical performance, thermal management, reliability and cost. This makes assembly and packaging a natural unifying theme across RF, microwave and photonics applications.

IMAPS-UK invites abstracts covering the following topics:

Materials & substrates – low-loss laminates, LTCC/HTCC ceramics, glass and organic interposers
Interconnects & transitions – flip-chip vs. wire bond, low-loss RF/mmWave transitions and vertical interconnects
Thermal management – heat spreading and die-attach for high-power RF, Opto and Photonic devices and laser sources
Hermeticity & reliability – sealing, moisture control and environmental/space qualification
Photonic integration – fibre alignment and attach, electro-optic co-packaging and hybrid RF-photonic assembly
Modelling, test & EMC – multiphysics co-design, shielding, grounding and antenna-in-package

Please submit your Title and Abstract of up to 200 words to office@imaps.org.uk by Friday 28th August 2026

Call for Papers for REACT Conference, Glasgow on 17 -18 November 2026

The 2nd International Responsible Electronics and Circular Technologies (REACT) Conference will be held at the Technology and Innovation Centre, 99 George Street, Glasgow, G1 1RD on Tuesday 17 November and Wednesday 18 November 2026.

Abstracts are invited on the following topics for Oral and Poster Presentation:

Electronics Design for Circularity
New Materials in Electronics
Critical Raw Materials and Urban Mining
Sustainable Electronics Manufacturing and Industry Initiatives
Enabling Green Data Centres
Electronics Towards Digital Product Passports
Business and Policy
Value Retention for Electronics

For further details please visit REACT Conference 2026 – Call for Papers

Abstracts are due by Sunday 21st June 2026.

Please submit your Abstract to react@gla.ac.uk

Call for Speakers: CWTEC – Cambridge Wireless Technology and Engineering Conference

Call for Speakers

The call for speakers for the 2026 Cambridge Wireless Technology and Engineering Conference (CWTEC) on Wednesday 8 July 2026 is now open. Don’t miss the opportunity to speak to 200+ major industry players, including senior engineers, technologists, academics, and business leaders.

Building on last year’s focus on 6G, the 2026 conference will examine the critical enabling technologies behind next-generation innovation, with particular emphasis on semiconductors and photonics as the foundations for future connectivity, compute capability, and emerging technology applications. The programme will focus on practical insight, technical depth, and strategic discussion around the technologies most likely to define the UK’s next wave of innovation.

CWTEC Focuses on four sessions:

UK Strengths, Capabilities & Gaps
Power Electronics, Photonics and Quantum – Does the Past Dictate the Future?
Design & Future Compute Architectures
Sovereign Supply Chains

For more information and guidelines for submitting an abstract, please visit:

CWTEC: Call for Speakers

Applications can be submitted until: Friday 8th May 2026

World Micromachining Summit, University of Southampton – 14 -17 June 2026

Join Global Leaders at MMS2026: The 29th World Micromachining Summit

You are invited to attend the 29th World Micromachining Summit (MMS2026), hosted this year at the University of Southampton from 14-17 June 2026. As innovations in Semiconductors, AI, and Quantum Computing accelerate, the advanced packaging and heterogeneous integration of these micro- and nanotechnologies (MNT) are more crucial than ever for real-world application. This prestigious summit brings together prominent global experts from academia, industry, and government to discuss cutting-edge research, policy frameworks, and the current state of MNT integration. For microelectronics and packaging professionals, MMS2026 provides an invaluable collaborative forum to network with international leaders, explore world-wide technology snapshots, and help shape the next-generation assembly solutions that will bring complex micro-nano systems to life.

For more Information and Registration, please click on: World Micromachining Summit