This IMAPS-UK organised Micro-Electronics Packaging for Harsh Environments Conference held at the Satellite Applications Catapult in Harwell on 28 November 2019 provided guidance for designers and engineers to select suitable electronic packaging materials and processes for extreme environment applications.
Download a copy of the event report HERE.
The theme of MicroTech 2019 was “Power in Packaging”, reviewing the materials, processes and equipment required to manufacture “state of the art” power modules for the transportation and energy industries.
Download a copy of the event report here .. MicroTech 2019 Event report (92 downloads)
“IOT 2019” – IOT Packaging Workshop – Presentation Downloads
IMAPS-UK & Event Information:
IOT-0-Workshop-Agenda.pdf (38 downloads)
All-about-IMAPS-UK-Presentation-Feb-2019.pdf (41 downloads)
Attendees (All attendees have approved the release of this information)
IOT-Attendee-List.pdf (40 downloads)
IOT-1-iMAPS-UK-–-introduction-Feb-2019.pdf (36 downloads)
IOT-2-IMAPS-Keynote-Feb-2019.pdf (38 downloads)
IOT-3-IMAPS-07feb2019-holmes-public.pdf (40 downloads)
IOT-4-MConnected-IoT-Presentation-Workshop-Feb-2019.pdf (37 downloads)
IOT-5-Printed-and-woven-electronics-integrated-with-textiles_IMAPS_7feb2019_rtorah.pdf (39 downloads)
The POP2 Conference and Exhibition was held at the South Devon College workshop on 23 October 2018 supported by The Torbay Hi-Tech Forum, EPIC and IEEE-EPS
A brief event report is now available …. It can also be downloaded here … or from the website area – Free downloadsPoP2_conference_review-report.pdf (110 downloads)
This workshop was held on June 27th 2018 supported by NPL. A brief event report is now available ….ACB-June-2018-Event-Report.pdf (132 downloads)
IMAPS-UK Packaging Webinar held on 3rd July @ 14.30
This was the First of a series of Webinars …..53 people signed up for it. But if you missed it and want to see it it is availbale (but only to members) via the link on our website –
….If you are an IMAPS-UK member …Click here
Number one of a series of webinars organised by IMAPS-UK (International Microelectronics, Assembly and Packaging Society) to showcase presentations given at previous IMAPS events. – This webinar featured two presentations that were first given at the IMAPS/Innovate UK “Advanced Packaging for Compound Semiconductor Applications” workshop in Birmingham.
High Temperature Packaging for SiC Devices by Liam Mills, TT Semelab
Advanced Packaging for RF/Microwave Applications by Steve Riches, Tribus-D