IMAPS-UK are pleased to announce a Call for Abstracts for MicroTech 2021 on the theme of Heterogeneous Integration – Packaging Future Microsystems. MicroTech 2021 will be held Online on Thursday 25 March 2021.

The main conference topics are based on the Heterogeneous Integration Roadmap produced by the IEEE-EPS, covering the following chapters:

• High Performance Computing and Data Centres
• Internet of Things (IoT)
• Medical, Health and Wearables
• Automotive
• Aerospace and Defence
• Mobile
• Single-Chip and Multi-Chip Integration
• Integrated Photonics
• Integrated Power Electronics
• MEMS and Sensor Integration
• 5G Communication
• Co-Design for Heterogeneous Integration
• Modelling and Simulation
• Materials and Emerging Research Materials
• Emerging Research Devices
• Test Technologies
• Supply Chain
• Security
• Thermal
• SiP and Module System Integration
• Interconnects for 2D and 3D Architectures
• Wafer Level Packaging

For more information, please click on the following link Heterogeneous Integration Roadmap

For further details please download MicroTech 2021 - Call for Abstracts (12 downloads)

Abstracts are due by Friday 18th December 2020.

Please submit your Abstract to office@imaps.org.uk

This Packaging Tutorial was supported by Zeiss Microscopy

In order to access a copy of the Audio Version of the presentation, please subscribe to Zeiss Microscopy News.

If you require a copy of the presentation, you can download here:

A Survey of Failure Analysis Techniques for Packaging by Greg Johnson, Zeiss Microscopy (70 downloads) – 21MB

Micro-Characterisation for Electronics - Stuart Robertson - Loughborough University (60 downloads) – 49MB

Click on the above heading to download to listen and view the presentation made on 4 September 2020.  It lasts approximately 30 minutes.

If you just require a copy of the presentation, you can download here:

Micro-Characterisation for Electronic Materials (94 downloads) – 8MB