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Research Showcase: Recent Advances on Reliability and Gate Driving of WBG Power Electronics – 11-12 January 2021 – Downloads
The IMAPS-UK Research Showcase – Recent Advances on Reliability and Gate Driving of WBG Power Electronics addressed several of the key issues critical to the increased adoption of Wide Bandgap (WBG) Semiconductors within the growing power electronics industry.
This event was supported by The Centre for Power Electronics and sponsored by Inseto Ltd.
Programme Literature
Download the Recent Advances on Reliability and Gate Driving of WBG Power Electronics (55 downloads)
Conference Presentations
If you require copies of the presentations, you can download here (click on presentation title):
Day One: Monday 11 January 2021
- Professor Layi Alatise and Dr Jose Ortiz Gonzalez, University of Warwick – Gate Interface Reliability in SiC/GaN Power Devices (68 downloads) – 5MB
- Dr Pearl Agyakwa & Prof Mark Johnson, University of Nottingham – Advances in Packaging Interconnects (63 downloads) – 4MB
- Professor Bernard Stark and Dr Mohammad Hedayati, Bristol University – High Speed Sensing and Monitoring around GaN devices (66 downloads) – 2MB
Day Two: Tuesday 12 January 2021
- Mr. Xiang Wang, Prof. Volker Pickert, Dr. Haimeng Wu, Newcastle University – Optimisation of Switching Transients for SiC MOSFETs (61 downloads) – 1MB
- Prof Stephen Binney, Dr Paul Judge and Ross Mathieson, University of Edinburgh – Exploiting SiC-MOSFET Modules in High Current Applications (75 downloads) – 5MB
- Prof. Francesco Iannuzzo and Assoc. Prof. Amir Sajjad Bahman, Aalborg University – Testing Silicon Carbide Power MOSFETs under Normal and Abnormal Operations (61 downloads) – 5MB
A recording of Day 1 is available. Please click on the link below.
A recording of Day 2 is available. Please click on the link below.
Recent Advances on Reliability and Gate Driving of WBG Power Electronics Day 2 (39 downloads) – 2 hours 24 mins – 164MB
For further information, please contact IMAPS-UK Office
IMAPS-UK announce Call for Abstracts for Centre for Power Electronics Annual Conference
IMAPS-UK are pleased to announce a Call for Abstracts for Video and Poster Presentations from Early Career Researchers for the Centre for Power Electronics Annual Conference. The CPE Conference will be held Online on 13, 14 and 15 July 2021.
The Centre for Power Electronics (CPE) Annual Conference will bring together the Power Electronics, Machines and Drives Community to review the latest Research and Development that will impact the Electric Revolution.
The main conference topics are relevant to the Power Electronics, Machines and Drives Community covering the following topics:
- Semiconductor and Passive Devices
- Packaging and Interconnection
- Converters, Machines, Drives and Applications
- Control, Test and Reliability
For more information on the Centre for Power Electronics and its activities, please click on the following link Centre for Power Electronics
For further details please download Call for Abstracts for Video and Poster Presentations from Early Career Researchers (17 downloads)
Abstracts are due by Friday 26th February 2021.
Please submit your Abstract to office@imaps.org.uk
IMAPS-UK announce Call for Abstracts for MicroTech 2021 – Heterogeneous Integration – Packaging Future Microsystems
IMAPS-UK are pleased to announce a Call for Abstracts for MicroTech 2021 on the theme of Heterogeneous Integration – Packaging Future Microsystems. MicroTech 2021 will be held Online on Thursday 25 March 2021.
The main conference topics are based on the Heterogeneous Integration Roadmap produced by the IEEE-EPS, covering the following chapters:
- High Performance Computing and Data Centres
- Internet of Things (IoT)
- Medical, Health and Wearables
- Automotive
- Aerospace and Defence
- Mobile
- Single-Chip and Multi-Chip Integration
- Integrated Photonics
- Integrated Power Electronics
- MEMS and Sensor Integration
- 5G Communication
- Co-Design for Heterogeneous Integration
- Modelling and Simulation
- Materials and Emerging Research Materials
- Emerging Research Devices
- Test Technologies
- Supply Chain
- Security
- Thermal
- SiP and Module System Integration
- Interconnects for 2D and 3D Architectures
- Wafer Level Packaging
For more information, please click on the following link Heterogeneous Integration Roadmap
For further details please download MicroTech 2021 - Call for Abstracts (118 downloads)
Abstracts are due by Friday 18th December 2020.
Please submit your Abstract to office@imaps.org.uk
Fundamentals of Electronic Packaging Tutorial – A Survey of Failure Analysis Techniques for Packaging by Greg Johnson, Zeiss Microscopy – 23 October 2020
This Packaging Tutorial was supported by Zeiss Microscopy
In order to access a copy of the Audio Version of the presentation, please subscribe to Zeiss Microscopy News.
If you require a copy of the presentation, you can download here:
IOT Packaging Workshop – Downloads
“IOT 2019” – IOT Packaging Workshop – Presentation Downloads
IMAPS-UK & Event Information:
IOT-0-Workshop-Agenda.pdf (93 downloads)
All-about-IMAPS-UK-Presentation-Feb-2019.pdf (101 downloads)
Attendees (All attendees have approved the release of this information)
IOT-Attendee-List.pdf (99 downloads)
Presentations
IOT-1-iMAPS-UK-–-introduction-Feb-2019.pdf (124 downloads)
IOT-2-IMAPS-Keynote-Feb-2019.pdf (100 downloads)
IOT-3-IMAPS-07feb2019-holmes-public.pdf (99 downloads)
IOT-4-MConnected-IoT-Presentation-Workshop-Feb-2019.pdf (95 downloads)
IOT-5-Printed-and-woven-electronics-integrated-with-textiles_IMAPS_7feb2019_rtorah.pdf (99 downloads)
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