Advanced Packaging International

Co-located with CS International, PIC International, and PE International, the 1st Advanced Packaging International builds on the momentum driving the next era of semiconductor innovation. Over two days, industry leaders and academic experts will deliver around 40 presentations across four key themes:

• Heterogeneous Integration
• Getting the Best Out of Incumbent Solutions
• Advancing Thermal Management
• Optimising Packaging Architectures
• Manufacturing & Pilot Lines
• Materials, Design and Reliability

Full details: https://ap-international.net/