Advanced Packaging Webinar
3rd July @ 14.30
This is a free to join event
This is the first in a series of webinars organised by IMAPS (International Microelectronics, Assembly and Packaging Society) to showcase presentations given at previous IMAPS events. The series will be started by Liam Mills and Steve Riches and the presentations were first given at the IMAPS/Innovate UK “Advanced Packaging for Compound Semiconductor Applications” workshop in Birmingham.
High Temperature Packaging for SiC Devices – Liam Mills, TT Semelab
Research has shown that Silicon Carbide operating at temperatures in excess of 400oC, opens up new areas in markets and products where solid state technology cannot be used. TT Electronics has been researching and developing techniques to overcome the challenges over the last 5 years, which first started with testing existing materials used in traditional Silicon device technology at these elevated temperatures. This presentation will focus on the research done to date for packaging wide bandgap semiconductors with results of testing up to 400oC.
Liam Mills is R&D Manager TT Electronics based at TT Semelab, Lutterworth. Semelab is a supplier of Hi-Rel packaged power modules.
Advanced Packaging for RF/Microwave Applications – Steve Riches, Tribus-D
The packaging of RF/Microwave devices has traditionally used assembly processes for high reliability applications. With the growth in RF/Microwave applications, the challenges of reduced form factor, pressure on costs and enhanced performance has meant that advanced packaging solutions need to be implemented.
Steve Riches is Director of Tribus-D Ltd., Cambridge, a micro SME based in Cambridge. He has worked on electronic packaging for over 30 years and is currently developing assembly processes for miniaturised electronics.