Addressing the Key Challenges of Adoption of Additive Manufacturing for Electronic Systems
This Technical Workshop organised by the Design for Additive Manufacturing Network and IMAPS-UK covers “Designing the Future of Additive Manufactured Electronics” including presentations by The University of Leeds, The Manufacturing Technology Centre (MTC), the University of Texas.
The revolution in additive manufacturing is creating new opportunities for the manufacture of electronics products instead of standard surface mount assembly on printed circuit boards. The potential benefits include miniaturisation and improved performance through integration of the electronics within the structure of the component and truly flexible manufacturing for customisable products.
However, the performance, density and reliability of high-density multilayer boards and advanced packaging techniques are significantly more advanced than what has been demonstrated to date with Additive Manufacturing technologies. This Workshop aims to generate a greater understanding of the drivers and motivation that will facilitate multidisciplinary discussions, cross-fertilisation of ideas and drive future innovation in designing for the future of additive manufacturing for electronic systems.
Download the event flyer Designing the Future of Additive Manufactured Electronics (535 downloads)
This is a free to join event, please register HERE to book a place.
You will be directed to the Design for Additive Manufacturing website for registration.
Registration details will be shared between the EPSRC Design for Additive Manufacturing Network and IMAPS-UK, please e-mail the IMAPS-UK Office, if you have any objections to this.
|Wednesday 21 April 2021||Day 1|
|13:00||Welcome, Introduction to D4AM Network and IMAPS-UK|
|13:15||Overview of Additive Manufacturing for Electronic Systems||Dr Robert Kay University of Leeds|
|14:00||Latest Advances in Additive Manufacturing for Electronic Systems||Naim Kapadia and Dr Farhan Khan, The Manufacturing Technology Centre|
|14:45||Brainstorming/Interactive Session: What is needed now and into the future?|
|16:00||End of Day 1|
|Thursday 22 April 2021||Day 2|
|13:00||Summary of Day 1 and Introduction to Day 2|
|Case Study: An Overview of Additive Manufacturing|
for RF Components in Space Applications
|Vittorio Tornielli and Maarten Van der Vorst, European Space Agency (ESTEC)|
|Robotic Wiring Harnesses Manufacture||Stephen Bennington, Q5D Technologies|
|Additive Manufacturing Activities at|
the CSA Catapult
|Dr Jayakrishnan Chandrappan, CSA Catapult|
|14:00||Additive Manufacturing of Elastomer, Ceramic and Metal |
|Professor Eric MacDonald, University of Texas|
|14:45||Brainstorming/Interactive Session: What are the main challenges and what areas need to be addressed through collaboration?|
|15:45||Outcomes and Summary|
|16:00||Close of event|
Once registered, you will receive Joining Instructions by e-mail 2-3 days before the event. Bookings can be accepted up to 1 hour prior to the event start.