Date(s) - 22/11/2018
8:30 am - 5:00 pm
This educational Workshop, organised by IMAPS-UK is being held at the excellent MTC, Coventry. It is your opportunity to learn about and understand the technologies, materials and processes related to attaching bare semiconductor devices onto and into the various substrates and assemblies we see today.
The programme will consist of five workshop sessions covering all aspects of the die attach process as highlighted above and will also include case studies covering a range of related applications and technologies.
The workshop sessions will cover the following topics:
• Die Bonding Processes
• Die Attach Materials
• Design & Process Optimisation
• Quality, Testing and Reliability
• Application Examples & Case Studies
This is an educational event and has limited places, please book early to avoid disappointment.
|08:30||Registration & Coffee|
|08:50||Welcome & Introductions|
|09:00||Session 1 –“Overview of Die Attach Processes"|
|10:50||Session 2 – “Design & Process Optimisation"|
|12:10||Networking Lunch and Facility tours|
|13:40||Session 3 – “Die Attach Materials"|
|15:30||Session 4 – "Quality Testing & Reliability"|
|16:50||Questions & Workshop Review|
|17:00||End of workshop|
Who Should Attend?
Research & Development Related Personnel, Scientists, Production, Manufacturing & Technical Engineers/Managers & Directors, Supply Chain Companies, Process Engineers, Product Designers & Students.
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