Date(s) - 22/11/2018
8:30 am - 5:00 pm
This educational Workshop, organised by IMAPS-UK is being held at the excellent MTC, Coventry. It is your opportunity to learn about and understand the technologies, materials and processes related to attaching bare semiconductor devices onto and into the various substrates and assemblies we see today.
The programme will consist of four workshop sessions covering all aspects of the die attach process, including:
• Die Bonding Processes
• Manufacturing, Tooling & Process Optimisation
• Die Attach Materials & New Process Developments
• Quality, Testing and Reliability
• Die Attach Surgery: Bring your issues & questions!
This is an educational event and has limited places, please book early to avoid disappointment.
|08:30||Registration & Coffee|
|08:50||Welcome & Introductions|
|Session 1 – Overview of Die Attach Processes|
|09:00||Tutorial from Eamonn Redmond, Inseto: "Die Attach Using Adhesives"|
|09:30||Tutorial from Steve Riches, Tribus-D: "Die Attach Using Solder"|
|10:00||Tutorial from, Thomas Oppert, PacTech: "Flip Chip Processes"|
|10:30||Morning Session Break: Tea & Coffee|
|Session 2 – Equipment, Tooling & Optimisation|
|11:00||Tutorial from Thomas Reith, Amadyne: "Equipment, Tooling and Process Considerations for Automated Die Attach"|
|11:30||Tutorial from Alex Tresky, Tresky AG: "Manual Die Attach and Flip Chip Processing"|
|12:00||Tutorial from Stephane Etienne, Nordson-ASYMTEK: "Dispensing Adhesives for Die Attach"|
|12:30||Lunch & Networking: Fork Buffet|
|Session 3 – New Process Developments/Materials and Die Attach Q&A Surgery|
|13:30||Case Study from Sergei Valev, C/O Boschman: "Sintering Solutions for Advanced Die Bonding"|
|14:00||Case Study from Ly May, Hereaus: "New Material Developments in Sintering"|
|14:30||Die Attach Q&A Surgery|
|15:00||Afternoon Session Break: Tea & Coffee|
|Session 4 – Quality Testing & Reliability|
|15:30||Tutorial from Gavin Yeo, Nordson-SONOSCAN: "Analysing Die Attach Using Sonoscan"|
|16:00||Tutorial from Stewart McCracken, MCS: "Die Attach Analysis & Root Cause Failures"|
|16:30||Tutorial from Bob Sykes, XYZTEC: "Bond Testing for Die Attach"|
|17:00||End of workshop|
Who Should Attend?
Research & Development Related Personnel, Scientists, Production, Manufacturing & Technical Engineers/Managers & Directors, Supply Chain Companies, Process Engineers, Product Designers & Students.
Please note: Attendees with Chinese or Russian passports must register at least 24 days in advance, due to rules at the event host site (The MTC).
DAW Gold Sponsors:
Book Event Tickets
Please do not attempt to book event tickets for anyone other than the signed-in user. Only the signed-in user will be able to attend, have access to event booking history and be able to download any event materials.
Paying by Credit/Debit Card / PayPal - Click the Pay by Credit Card / PayPal button.
Payment for tickets to IMAPS-UK events is completed via the PayPal gateway, either as a “Guest” using the “Debit/Credit Card” option, or using an existing PayPal account.
Paying by invoice - Click the Pay by invoice button.