Date(s) - 22/11/2018
8:30 am - 5:00 pm
Download the post event report here: DAW_workshop_article_v4.pdf (87 downloads)
This educational Workshop, organised by IMAPS-UK is being held at the excellent MTC, Coventry. It is your opportunity to learn about and understand the technologies, materials and processes related to attaching bare semiconductor devices onto and into the various substrates and assemblies we see today.
The programme will consist of four workshop sessions covering all aspects of the die attach process, including:
• Die Bonding Processes
• Manufacturing, Tooling & Process Optimisation
• Die Attach Materials & New Process Developments
• Quality, Testing and Reliability
• Die Attach Surgery: Bring your issues & questions!
This is an educational event and has limited places, please book early to avoid disappointment.
|08:30||Registration & Coffee|
|08:50||Welcome & Introductions|
|Session 1 – Overview of Die Attach Processes|
|09:00||Tutorial from Eamonn Redmond, Inseto: "Die Attach Using Adhesives"|
|09:30||Tutorial from Steve Riches, Tribus-D: "Die Attach Using Solder"|
|10:00||Tutorial from, Thomas Oppert, PacTech: "Flip Chip Processes"|
|10:30||Morning Session Break: Tea & Coffee|
|Session 2 – Equipment, Tooling & Optimisation|
|11:00||Tutorial from Thomas Reith, Amadyne: "Equipment, Tooling and Process Considerations for Automated Die Attach"|
|11:30||Tutorial from Alex Tresky, Tresky AG: "Manual Die Attach and Flip Chip Processing"|
|12:00||Tutorial from Stephane Etienne, Nordson-ASYMTEK: "Dispensing Adhesives for Die Attach"|
|12:30||Lunch & Networking: Fork Buffet|
|Session 3 – New Process Developments/Materials and Die Attach Q&A Surgery|
|13:30||Case Study from Sergei Valev, C/O Boschman: "Sintering Solutions for Advanced Die Bonding"|
|14:00||Case Study from Ly May, Hereaus: "New Material Developments in Sintering"|
|14:30||Die Attach Q&A Surgery|
|15:00||Afternoon Session Break: Tea & Coffee|
|Session 4 – Quality Testing & Reliability|
|15:30||Tutorial from Richard Carr, Nordson-SONOSCAN: "Analysing Die Attach Using Sonoscan"|
|16:00||Tutorial from Stewart McCracken, MCS: "Die Attach Analysis & Root Cause Failures"|
|16:30||Tutorial from Bob Sykes, XYZTEC: "Bond Testing for Die Attach"|
|17:00||End of workshop|
Who Should Attend?
Research & Development Related Personnel, Scientists, Production, Manufacturing & Technical Engineers/Managers & Directors, Supply Chain Companies, Process Engineers, Product Designers & Students.
Please note: Attendees with Chinese or Russian passports must register at least 24 days in advance, due to rules at the event host site (The MTC).
DAW Gold Sponsors:
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When booking the event, please ensure that the Delegate Name is included on the booking form, if you are not the person attending. Please note that the person booking the event will be the only person who will have access to event booking history and be able to download any event materials .
This event is fully booked.
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