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Die Attach Workshop

Date/Time
Date(s) - 22/11/2018
8:30 am - 5:00 pm

Location
The Manufacturing Technology Centre (MTC)

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Categories

Book Tickets | Event programme | Workshop Brochure

Description
This educational Workshop, organised by IMAPS-UK is being held at the excellent MTC, Coventry.  It is your opportunity to learn about and understand the technologies, materials and processes related to attaching bare semiconductor devices onto and into the various substrates and assemblies we see today.

The programme will consist of four workshop sessions covering all aspects of the die attach process, including:

• Die Bonding Processes
• Manufacturing, Tooling & Process Optimisation
• Die Attach Materials & New Process Developments
• Quality, Testing and Reliability
• Die Attach Surgery: Bring your issues & questions!

This is an educational event and has limited places, please book early to avoid disappointment.

Agenda

StartDetails
08:30Registration & Coffee
08:50Welcome & Introductions
Session 1 – Overview of Die Attach Processes
09:00Tutorial from Eamonn Redmond, Inseto: "Die Attach Using Adhesives"
09:30Tutorial from Steve Riches, Tribus-D: "Die Attach Using Solder"
10:00Tutorial from, Thomas Oppert, PacTech: "Flip Chip Processes"
10:30Morning Session Break: Tea & Coffee
Session 2 – Equipment, Tooling & Optimisation
11:00Tutorial from Thomas Reith, Amadyne: "Equipment, Tooling and Process Considerations for Automated Die Attach"
11:30Tutorial from Alex Tresky, Tresky AG: "Manual Die Attach and Flip Chip Processing"
12:00Tutorial from Stephane Etienne, Nordson-ASYMTEK: "Dispensing Adhesives for Die Attach"
12:30Lunch & Networking: Fork Buffet
Session 3 – New Process Developments/Materials and Die Attach Q&A Surgery
13:30Case Study from Sergei Valev, C/O Boschman: "Sintering Solutions for Advanced Die Bonding"
14:00Case Study from Ly May, Hereaus: "New Material Developments in Sintering"
14:30Die Attach Q&A Surgery
15:00Afternoon Session Break: Tea & Coffee
Session 4 – Quality Testing & Reliability
15:30Tutorial from Richard Carr, Nordson-SONOSCAN: "Analysing Die Attach Using Sonoscan"
16:00Tutorial from Stewart McCracken, MCS: "Die Attach Analysis & Root Cause Failures"
16:30Tutorial from Bob Sykes, XYZTEC: "Bond Testing for Die Attach"
17:00End of workshop

Who Should Attend?
Research & Development Related Personnel, Scientists, Production, Manufacturing & Technical Engineers/Managers & Directors, Supply Chain Companies, Process Engineers, Product Designers & Students.

Please note: Attendees with Chinese or Russian passports must register at least 24 days in advance, due to rules at the event host site (The MTC).


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When booking the event, please ensure that the Delegate Name is included on the booking form, if you are not the person attending. Please note that the person booking the event will be the only person who will have access to event booking history and be able to download any event materials .

This event is fully booked.

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