EMPC 2025 – Grenoble, France -16 – 18 September 2025
The European Microelectronics and Packaging Conference (EMPC 2025) is the premier international conference for microelectronics packaging, owned and sponsored by IMAPS-Europe and co-sponsored by IEEE-EPS.
Held biennially, the 25th European Microelectronics & Packaging Conference (EMPC 2025) will again feature a high-quality technical program, a large exhibition, and exciting evening events. Professional development courses (PDCs) will be offered on Monday, September 15, 2025, before the conference. The conference focuses on the latest developments in electronic packaging, covering industry trends, integration, new materials, thermal management, and sustainable electronics.
EMPC 2025 welcome abstracts covering the following topics:
- Advanced Packaging and System-Integration
- Materials and Processes
- Design, Modelling and Reliability
- Markets and Developments
- Special Topics (Power Electronics/ Medical Electronics/ Green Electronics)
EMPC 2025 Abstract submission
If you would like to present a paper or poster at the conference, please submit an abstract of 400 – 800 words by Monday 10 February 2025. The content must be original (unpublished), non-confidential, and non-commercial.
Please visit the EMPC 2025 website to download the Call for Papers, the Abstract Template and Submission Guidelines and Sponsor and Exhibitor opportunities or contact the Conference Office at office@empc2025.org for further information.
IMAPS-France looks forward to welcoming you to the beautiful city of Grenoble in September 2025!
