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Fundamentals of Electronics Packaging Tutorial – Die Attach and Interconnect – Friday 17 April 2020 @ 13:00

The first IMAPS-UK Online Tutorial Session is “Die Attach and Interconnects” by Liam Mills of MTC

This tutorial is now fully booked.

Please e-mail to be placed on a reserve list and be informed of when the presentation will be available for download on the IMAPS-UK web-site.

IMAPS-UK will consider running the tutorial again at a later date, if there is sufficient demand.

The other planned free online tutorials on Friday 1 May on “The Future for Substrates” and on Friday 15 May on “Metallurgical Considerations” are open for registration.

A free online One Day Conference on “Power and High Temperature” is also being organised on Thursday 28 May 2020.

This is the first in a series of Fundamentals of Electronics Packaging Tutorials organised by IMAPS-UK (International Microelectronics, Assembly and Packaging Society) to describe various aspects of assembly of micro-electronics.

Die Attach and Interconnects
Liam Mills, Technical Specialist, The Manufacturing Technology Centre (MTC)

This presentation discusses the Die attach and Interconnects aspects which are two of the most critical processes for Semiconductor packaging and are therefore vital to get it right first time to ensure quality and reliability. As every application has different requirements, there is also a wide range of die attach and interconnect technologies available. This first half of the session will focus on Pb-free die attach options, their processes and associated failure modes, including a review of the latest sinter materials. The second half of the session will focus on interconnect technologies and their limitations, including a review of double sided bonding as an alternative for wirebonds.

Liam Mills received a BEng (Hons) in Aerospace Engineering from the University of Liverpool in 2005. Soon after graduating he joined TT Electronics where roles in Quality, Power Module design and R&D provided the foundation to a career in semiconductor packaging during his 13 years with the company. Technical developments were focused on materials and assembly processes for high temperature electronics and improving reliability of solder joints and wirebonds for Power Electronics for harsh environments, primarily focused on Aerospace applications. He has managed numerous UK/EU funded programmes working collaboratively with a wide range of academic and industrial partners. He left TT Electronics in November 2018 and is now working across a broad range of electronics manufacturing research topics ranging from micro and power electronics assemblies to novel circuit board assembly processes for all market sectors at MTC.

The Tutorial will run for 30 minutes including a question and answer session. The Tutorials are limited to 100 delegates.

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When booking the event, please ensure that the Delegate Name is included on the booking form, if you are not the person attending. Please note that the person booking the event will be the only person who will have access to event booking history and be able to download any event materials .

This event is fully booked.

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Date(s) - 17/04/2020
1:00 pm - 1:30 pm

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