Fundamentals of Electronics Packaging Tutorial – Metallurgical Considerations – Friday 15 May 2020 @ 13:00
The third IMAPS-UK Online Tutorial Session is “Metallurgical Considerations for Electronic Packaging” by Steve Riches of Tribus-D Ltd
This is a free to join event, please log in or register below to book a place.
This is the third in a series of Fundamentals of Electronics Packaging Tutorials organised by IMAPS-UK (International Microelectronics, Assembly and Packaging Society) to describe various aspects of assembly of micro-electronics.
Metallurgical Considerations for Electronic Packaging
Steve Riches, Tribus-D Ltd
Electronic packaging involves a wide range of materials, including base and precious metals often in unusual combinations. Whilst many of the limitations of certain combinations, for example, Au wire on Al bond pads on devices, which can lead to bond failures through “purple plague” are known, the desire to place electronics in ever harsher environments means that an understanding of metallurgical interactions becomes more important for product reliability.
This presentation will summarise some of the key areas where metallurgical interactions have a significant effect on product quality during manufacture and in-service and will highlight some of the procedures required to ensure reliability.
Steve Riches received a BA (Hons) in Natural Sciences from the University of Cambridge. He has over 30 years of experience in electronics assembly innovation, proposal generation and project management. Technical developments have included copper wire bonding, laser processes, high temperature electronics, MEMS assembly, ruggedised displays and LED lighting working at The Welding Institute and GE Aviation Systems in Newmarket. He has instigated and managed several Innovate UK/European projects, working collaboratively with a wide range of industrial and academic partners. He left GE Aviation in December 2015 and is now a director at a start-up business, Tribus-D Ltd, working on developing innovative electronic packaging and interconnection technologies.
The Tutorial will run for 30 minutes including a question and answer session. The Tutorials are limited to 100 delegates.
Once registered, you will receive Joining Instructions by e-mail 2-3 days before the event.
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Date/Time
Date(s) - 15/05/2020
1:00 pm - 1:30 pm
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