The sixth IMAPS-UK Online Tutorial Session is “Modelling for Reliability and Lifetime Prediction” by Professor Chris Bailey of the University of Greenwich.
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This is the sixth in a series of Fundamentals of Electronics Packaging Tutorials organised by IMAPS-UK (International Microelectronics, Assembly and Packaging Society) to describe various aspects of the production of micro-electronic assemblies.
Modelling for Reliability and Lifetime Prediction
Chris Bailey – University of Greenwich
Using modelling tools to predict reliability of electronic packages is now widespread throughout our community. This presentation will compare both the handbook (e.g. MIL-217) and the Physics of Failure (PoF) approach and provide some examples where the PoF approach has been used for real world applications.
The presentation will then discuss challenges for reliability modelling with new packaging technologies (e.g. 3d-IC, Wafer Level Packaging, etc) and discuss efforts related to co-design and reliability modelling in the new Heterogeneous Integration Roadmap.
Chris Bailey is Director of Computational Mechanics and Reliability Group at the University of Greenwich. He has published over 300 papers on design, modelling and simulation of electronics packaging technologies. He is a member of the Board of Governors for the IEEE Electronic Packaging Society (EPS), Vice President for Conferences and is UK Chapter Chair for the IEEE EPS and Reliability Societies. He is also a member of the technical working group on the new Heterogeneous Integration Roadmap focusing on co-design, modelling and simulation.
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Date(s) - 10/07/2020
1:00 pm - 1:45 pm
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