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Fundamentals of Electronics Packaging Tutorial – Printed and Flexible Electronics – Friday 24 July 2020 @ 13:00

The seventh IMAPS-UK Online Tutorial Session is “Electronics Without PCBs: Novel Approaches to Building Your Electronic Systems” by Simon Johnson of the Centre for Process Innovation (CPI).

This is a free to join event, please log in or register below to book a place.

This is the seventh in a series of Fundamentals of Electronics Packaging Tutorials organised by IMAPS-UK (International Microelectronics, Assembly and Packaging Society) to describe various aspects of the production of micro-electronic assemblies.

Electronics Without PCBs: Novel Approaches to Building Your Electronic Systems
Simon Johnson – CPI

Flexible and Structural electronics are making inroads in a range of electronic devices, from smart paper labels, to flexible sensor systems and plastic panels which can sense, process and display. CPI has acquired years of experience in the fabrication of printable sensors that can measure parameters such as temperature, stress and strain, gases and even biological molecules. Electronic systems can be thin, lightweight, large area or embedded within devices where traditional electronics cannot fit and even incorporate energy harvesting devices. A number of new technologies for the encapsulation of electronic systems within plastic and composite components are also approaching maturity. Methods such as In-Mould Electronics (IME) and Composite Embedded Electronics (CEE) offer significant opportunity for protection of electronic systems. In this talk alternative approaches to packaging electronic systems including Flexible circuit, IME and CEE are discussed and techniques are demonstrated which can be used to provide mechanical and environmental protection of printed and flexible electronic systems.

Simon Johnson is Chief Technologist within Electronics at the Centre for Process Innovation. In his current role Simon acts as a knowledge expert in Printable Electronics, supporting strategic and development activities in the business. While at CPI Simon has developed the electronics design and integration team to provide product design capability in the field of flexible electronic systems. He has lead the development of processes for the assembly of hybrid flexible electronic systems including printed sensors, wireless sensor systems and roll to roll circuit design. In previous roles as an academic at the University of Durham and also in industry, Simon has worked in many aspects of electronics from electronic device design and development to electronic systems and software development.

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Date/Time
Date(s) - 24/07/2020
1:00 pm - 1:45 pm

Location
Map Unavailable

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