The fifth IMAPS-UK Online Tutorial Session is “Semiconductor Package Selection” by Andy Longford of PandA Europe.
This tutorial is now fully booked.
Please e-mail email@example.com to be placed on a reserve list and be informed of when the presentation and audio will be available for download on the IMAPS-UK web-site.
This is the fifth in a series of Fundamentals of Electronics Packaging Tutorials organised by IMAPS-UK (International Microelectronics, Assembly and Packaging Society) to describe various aspects of the production of micro-electronic assemblies.
Semiconductor Assembly – Selecting the Package
Andy Longford C.Eng, FIET – Consultant at PandA Europe
Semiconductor Packaging and Assembly is often the last piece of the jigsaw in the overall assembly of semiconductor devices. In many cases it becomes an after thought in the design process and also in the manufacturing process. So it is important to understand what should be considered and, more importantly what can be offered for a device, a chip or as it is developing, a system …. In a package.
This presentation will cover the aspects what a package offers, what options can be considered and what are the requirements for packaging a range of different applications. It will also include an overview of the development of more advanced technologies being considered for new designs and inevitably the challenges for a system to be built into the package.
Andy Longford was formerly European Manager for Carsem, a Malaysian OSAT company. In 1998 he founded PandA Europe, a technical & market Consultancy Company, involved in Semiconductor chip Packaging and Electronics Interconnection. With this company, he has worked on chip package design, assembly technologies, interconnection analysis and market development projects. He is currently involved with SiCPower devices, and emerging chip package design analysis and technical support work.
Andy is a member of a number of technical committees, including SEMI Europe (APC) and ESiPAT(a SEMI SIG). He has been a member of IMAPS since 2003, was chair of IMAPS-UK during 2007–2009 and continues to provide support for IMAPS-UK organisation and events as a committee member. He is currently under contract to the CSA Catapult as Interim Head of Packaging, on a part time basis.
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Date(s) - 26/06/2020
1:00 pm - 1:45 pm
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