Fundamentals of Electronics Packaging Tutorial – The Future for Substrates – Friday 1 May 2020 @ 13:00
The second IMAPS-UK Online Tutorial Session is “The Future for Substrates” by Piers Tremlett of Microchip
This is a free to join event, please log in or register below to book a place.
This is the second in a series of Fundamentals of Electronics Packaging Tutorials organised by IMAPS-UK (International Microelectronics, Assembly and Packaging Society) to describe various aspects of assembly of micro-electronics.
The Future for Substrates
Piers Tremlett, Packaging Specialist, Microchip Technology Inc
- Miniaturisation for mobile products
- Heat and power
- Printed electronics
- Substrate-less circuits
The future is being driven by our desires as users, for example: we want convenience, more videos, thin phones and a clean environment, all at low cost. In the end, this percolates down to our substrates. The presentation will look at future substrate technology for circuits that may address our desires. Every substrate technology aims to eliminate waste and improve performance, this is showing up in the great fluidity in the structure of circuits. In the drive for waste reduction and cost saving, what will disappear: the substrate, solder, SMT components? The following topics will be discussed: the constant fight between lower cost substrates and performance; the fluidity of future circuit structures; the potential rise of flexible substrates; the rise of substrates that can handle power and heat; from completely flat circuit assemblies to 3D shapes. It is important for us to try to guess the future to prevent our businesses dying and to understand how to improve our products.
Piers Tremlett has over 20 years’ experience working in the development of new packaging processes and designs within Microchip’s Advanced Packaging Business and previously with Lucas Automotive, Sensors and Controls. He holds a BSc in Metallurgy & Material Science and an MSc in Management, Manufacturing &Technology. He is Microchip’s senior specialist on the subject of microelectronics supporting the strategy around the next generation of miniaturisation including Microchips’s embedded die developments for System In a Package..
The Tutorial will run for 30 minutes including a question and answer session. The Tutorials are limited to 100 delegates.
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Date/Time
Date(s) - 01/05/2020
1:00 pm - 1:30 pm
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