Heterogeneous Integration – Explained! Workshop, University of Southampton – Wednesday 25 March 2026 – Fully Booked

IMAPS-UK and the CHIMES IKC project are organising an Heterogeneous Integration – Explained! Workshop to provide a comprehensive overview of how they are applied in microelectronics packaging. This Afternoon Workshop on Wednesday 25 March 2026 precedes the MicroTech 2026 Conference on Thursday 26 March 2026. There will be an opportunity to visit the Southampton Nanofabrication Centre during the Workshop.

Download the Heterogeneous Integration – Explained! Workshop Flyer.

Heterogenous Integration opens a broad spectrum of packaging solutions that include Flip Chip, Fan Out Wafer Level Packaging, Hybrid Packaging, System in Package, 2.5D/3D and many sub-categories with higher interconnection densities than traditional wire bonding. Challenges include power delivery signal integrity, multi-physics impacts, IP block interface standards, chiplet manufacturing considerations, warpage and many others. The traditional 2D mindset for device integration in packaging is rapidly changing and a 3D or vertical mindset is becoming a key driver for High Performance Computing, AI, Mobile Products, Power Electronics and Photonics.

This workshop will focus on the fundamental aspects of Heterogeneous Integration, explaining the design and assembly requirements, and exploring the opportunities for advanced packaging manufacturing solutions in microelectronics, power electronics and photonics. This workshop will be complemented with a tour of the facilities at the Southampton Nanofabrication Centre.

The Provisional Programme for the Workshop is outlined below:

The workshop will address the training needs of students and researchers within Colleges and Universities and personnel within Industrial companies to assist in the upskilling and reskilling of people for the design, manufacture and testing of electronics modules. Attendees can request a Certificate of Attendance that can be used as proof of Continuous Professional Development.

Registered Attendees at the MicroTech 2026 on Thursday 26th March 2026 at the King’s Conference Centre will receive a discount on the entry price to the Heterogeneous Integration – Explained! Workshop.

Who Should Attend?

• Designers, Engineers and Techniciaans seeking to implement advanced electronics design and Manufacturing
• Undergraduates, Post-graduates and Early Career Professionals interested in advanced Electronics Research, Development and Productions
• Quality Engineers, Supply Chain Personnel and Managers wanting to gain an appreciation of Heterogeneous Integration used in electronics assembly

Registration

Registration for the Heterogeneous Integration – Explained! Workshop is now closed, as the capacity of the venue has been reached.

Please e-mail the IMAPS-UK Office to be placed on a reserve list, in case of cancellations.

Travel to the Centenary Building, University of Southampton

Workshop Address