Heterogeneous Integration – Silicon and Glass Interposer Workshop: Wednesday 27 November 2024 British Motor Museum
A Workshop on Heterogeneous Integration – Silicon and Glass Interposers
IMAPS-UK is organising a Heterogeneous Integration – Silicon and Glass Interposer Workshop together with the INTERPOSE-UK project team to provide an understanding of how they can be applied in advanced electronics packaging as a key step between 2D and 3D assembly. This Afternoon Workshop on Wednesday 27 November 2024 precedes the iPower6 Conference on Thursday 28 November 2024. There will be an opportunity to visit the British Motor Museum in the morning before the Workshop.
Heterogeneous Integration – Silicon and Glass Interposer Workshop
Download the Heterogeneous Integration Silicon and Glass Interposer Workshop Flyer.
The traditional 2D mindset for device integration in packaging is rapidly changing and a 3D or vertical mindset is becoming a key driver for High Performance Computing, AI, Mobile Products and Power Electronics. This Workshop on the afternoon of Wednesday 27th November 2024 will explore the potential of glass and silicon based interposers used in advanced electronics packaging, which can provide the key step between 2D and 3D assembly, enabling heterogeneous integration. Information will be presented on the use of laser processing and micro-fabrication techniques to create interconnection features such as through substrate vias and redistribution wiring.
From a system perspective, the benefits of combining different technologies and the growing availability of chiplets is clear. However, to capitalize on these advancements, the UK urgently needs accessible, bespoke interposers and redistribution layers, along with the associated design and manufacturing capabilities. This is critical not just for competitiveness but also for ensuring the resilience and sovereignty of the UK’s technological infrastructure in sectors such as defence, automotive, aerospace and medical.
To drive this forward, this workshop is being organised to bring together UK suppliers, end-users, and experts. This event is a unique opportunity to hear directly from leading UK organisations, exchange ideas, and discuss your current and future challenges. You will gain insights into how the global and national roadmaps are being translated into actionable UK activities and learn about real, practical steps being taken to maintain and grow UK capabilities.
This Workshop will include presentations to be delivered by BAe Systems, Dynex Semiconductor, NCAB Group UK Ltd, PRP Optoelectronics and Inseto UK Ltd and will be run in a half-day session, starting at 13:00 (with lunch available from 12:00) and finishing by 17:00, with the opportunity to continue networking with some refreshments until 18:00.
The Heterogeneous Integration – Silicon and Glass Interposer Workshop will include presentations on the following topics:
- Introduction to Heterogeneous Integration – Silicon and Glass Interposers
- Current Packaging Technology Development – Challenges and Roadmap for High Power
- Electronics Manufacturing View on HDI and Moving to Smaller Nodes
- An Interposer Case Study
- Printed Interposers
The Workshop element will comprise a breakout session organised by the INTERPOSE-UK project team to identify the gaps in the UK electronics packaging supply chain and potential applications that will require the silicon and glass interposer capabilities in the future.
Who Should Attend?
- Engineers and Technicians involved in Electronics Design, Manufacture and Test
- Undergraduates and Post-graduates interested in Advanced Packaging Electronics Research and Development
- Supply Chain Personnel and Managers wanting to gain an appreciation of advanced microelectronics assembly processes
Please note: The Training Workshop is limited to 50 places on a first registered basis.
Registration
Registration for the Heterogeneous Integration Interposer Workshop is open below.
- IMAPS-UK Member: £70 – Ticket IP6WS-01
- Non-Member: £70 – Ticket IP6WS-02
- Students (Undergraduates and Postgraduates): £50 – Ticket IP6WS-03
Confirmed Attendees at the iPower6 Conference, on the following day, will receive a £30 discount on the Ticket Price for this Workshop, please select the tickets below:
- IMAPS-UK Member: £40 – Ticket IP6WS-04
- Non-Member: £40 – Ticket IP6WS-05
- Students (Undergraduates and Postgraduates): £20 – Ticket IP6WS-06
Prices shown are exclusive of VAT and inclusive of lunch and refreshments
Attendees can request a Certificate of Attendance that can be used as proof of Continuous Professional Development.
Travel to British Motor Museum
Details on travel options to reach the British Motor Museum is presented HERE.
Consent:
I confirm that my name and institution/organisation can be included in the attendee list in the delegate pack.
Please e-mail the IMAPS-UK Office if you have an objection to the above consent.
Cancellation Policy
Please click on Cancellation Policy for information on cancellations for bookings
.
For further information, please contact:
IMAPS-UK Secretariat
Telephone: + 44 (0)131 202 9004
Email: office@imaps.org.uk
Book Event Tickets
When booking the event, please ensure that the Delegate Name is included on the booking form, if you are not the person attending. Please note that the person booking the event will be the only person who will have access to event booking history and be able to download any event materials .
Bookings are now closed for this event. - Please contact the IMAPS-UK office for further details
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Date/Time
Date(s) - 27/11/2024
12:00 pm - 5:00 pm
British Motor Museum
