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HITEN 2024 – International Conference and Exhibition on High Temperature Electronics Network

The HITEN Conference Series on High Temperature Electronics has run successfully for over 20 years and is co-chaired by Colin Johnston of Oxford University and Patrick McCluskey of the University of Maryland in the United States. It is organised through IMAPS–US, with support from IMAPS-UK and has a dedicated website event page: HITEN 2024. It will be held at the John McIntyre Conference Centre (JMCC), Edinburgh, UK from 15-17 July 2024.

The objective of the HiTEN Conference is to have a unique forum that brings together researchers and practitioners in academia and industry from all over the world. All styles of practical high temperature electronics design and implementation approaches are encouraged, along with a variety of high temperature application areas. Today the main semiconductor focus of HITEN is silicon and silicon on insulator (SOI), although, HITEN is not simply a semiconductor focused network. HITEN provides a conduit for the exchange and dissemination of information on all aspects of high temperature electronics. It is a global network with users, suppliers, developers and fundamental researchers dealing in all aspects of High Temperature Electronics.

  • Future Research for HT Instrumentation for Geothermal Applications—Andrew Wright , Sandia National Laboratories
  • An Emerging Silicon Carbide Ecosystem for Harsh Environment Electronics—Alan Mantooth, University of Arkansas
  • Diamond Electronics: Advanced n Devices and Packaging for High Temperature Systems—Aris Christou, University of Maryland
  • The Problems of Wireless Temperature Measurement at 325-500oC—Progress with NEM Switch Technology—Piers Tremlett, Microchip Technology Inc
  • Electronic Materials and Devices that not only Survive but Thrive in 500oC Environments—Katherine Burzynski, AFRL

For more information and registration, please visit the HITEN 2024 Conference Website.