iPower 4 – Powering The Future – Thursday 24 November 2022 at the University of Nottingham
IMAPS-UK’s iPower4 Conference on Powering the Future will take place on Thursday 24 November 2022 at the Jubilee Conference Centre at the University of Nottingham, in a face to face format. The Conference will be preceded by a Half-Day Workshop on Power Electronics Packaging – Training and Upskilling on the afternoon of Wednesday 23 November 2022.
Powering the Future will present some of the most significant challenges to be faced by a wide range of electrical and electronic based industries in the next decade. Getting reliable and fully functional products to market will require electronic and electrical packaging solutions that can operate at higher currents and voltages, faster frequencies and increased temperatures. This conference will hear from OEMs, material and equipment suppliers and academia about the current and future solutions to meet these demanding requirements. The Conference concludes with a tour of the adjacent Power Electronics and Machines Centre (PEMC) at the University of Nottingham, featuring state of the art laboratories for power electronics, high voltage and machine drives and converters.
Provisional Agenda:
| Time | Title | |
|---|---|---|
| 08:30 | Registration and Networking | |
| 09:15 | Welcome and Introduction to IMAPS-UK | |
| 09:25 | Session 1: Markets and Applications | |
| 09:25 | The market opportunity for SiC in the UK EV supply chain | Adam Dawson, Exawatt |
| 09:50 | Multiple SiC power module for a high frequency aircraft motor drive application | Jingru Dai, Dynex Semiconductor |
| 10:15 | Exhibitor Elevator Pitches | |
| 10:30 | Refreshments: Exhibition and Networking | |
| 11:00 | Session 2: Sintering | |
| 11:00 | Ag/Cu Pressure Sintering Technology for Power Semiconductors | Matt Houston, Inseto (UK) Ltd |
| 11:25 | Failure mechanisms and requirements for surfaces in Ag sintering process | Steven Collier, Zestron Europe |
| 11:50 | Driving the Electric Revolution - Industrialisation Centres | Dr Jayakrishnan Chandrappan, CSA Catapult and Paul Jarvie, DER-IC |
| 12:15 | Lunch: Exhibition and Networking | |
| 13:10 | Session 3: Interconnects | |
| 13:10 | Copper nanowired interconnection for embedding power dies in PCB | Caio Mendes, Mitsubishi Electric R&D Centre Europe (MERCE) |
| 13:35 | Laser Activated Reactive Multilayer Systems and Packaging Trends for Bonding Power System | Thomas Müller, Finetech GmbH |
| 14:00 | Refreshments: Exhibition and Networking | |
| 14:30 | Session 4: Quality, Performance and Reliability | |
| 14-30 | Investigations of silicone gel used for power modules in harsh environment operation | Mark Sherriff, University of Sheffield |
| 14:55 | A correlative study between shear testing and X-Ray CT as analytical tools for ultrasonic weld quality | Meghna De, Littelfuse and University of Nottingham |
| 15:20 | An improved SiC-MOSFET model with focus on internal stray inductance and body diode stored charge for switching transients | Constantin-Lucian Radu, Coventry University |
| 15:45 | Tour of PEMD Facility at University of Nottingham | |
| 16:30 | Depart | |
Download the iPower Conference Flyer
The iPower4 Conference is sponsored by Inseto UK Ltd
Inseto (UK) Ltd is a leading provider of wafer fabrication, assembly equipment and materials to the power electronic and related microelectronic technology sectors.
Our products include:
- Die bonders, including sinter die attach equipment
- Vacuum solder reflow equipment
- Aluminium wire & ribbon bonders
- Dicing and scribing equipment
- Bond & micro-materials testers
- Optical inspection equipment
- Plasma etching & cleaning systems
- Semiconductor wafers & substrates
- Hermetic power packages
- Aluminium wire & ribbon
- Solder wire, preforms & ribbon
- Wafer oxidation & annealing furnaces
- Wafer bonders
- Wafer Probing Systems for HF, HV & high current applications
Our accredited application and technical support team provides pre and post sales expertise, assisting in material selection, equipment setup, maintenance, calibration and user training.
Please visit our website: www.inseto.co.uk for further information.
Exhibitors at iPower4:
The following organisations will be exhibiting at the Conference:
- Accelonix – Specialist equipment sales and support for Microelectronics, Battery and PCB Assembly
- Carl Zeiss Ltd – Materials Characterisation and Failure Analysis Equipment
- Gen3 – Specialist British manufacturer and distributor of test and measurement Equipment
- Inseto – Manufacturing equipment, assembly materials and adhesives
- ipTEST Ltd – Production testers for Power Semiconductors
Exhibit at iPower4
Interested in attending iPower4 as an exhibitor?
- Place for one person with full access to the Conference
- A 200 word description in the Event Programme (PDF)
- A table top display with room behind for two pop-up banners
- Logo and Links to company on event promotion and website
- Short introduction to the delegates during the Conference
