This Online Conference, organised by IMAPS-UK, focuses on the packaging challenges presented by the many varied applications driving the growing use of Sensors in our world.
Touching on Technologies & Assembly Processes common to all areas of the Microelectronics community, Making Sense of Sensors will provide insights into numerous packaging techniques. Highlighting packaging technologies, developments and opportunities, this technical conference will provide a forum for learning within this fascinating field. Topics presented will cover a wide range of industries and applications demonstrating the diverse nature of this sector and the wide array of packaging techniques that are applied.
Making Sense of Sensors provides an opportunity to learn from leading Industry Experts and Equipment Manufacturers as they share their experiences and developments in this rapidly growing industry.
Related industry sectors include:
- Civil Engineering & Infrastructure
- Oil, Gas & High Temp
The target audience are End-Users, Manufacturers, Production & Manufacturing Engineers, Researchers & Developers, Scientists, Supply Chain Companies, Process Engineers, Product Designers & Students
Presentation Topics include:
- Assembly Processes – vacuum, hermetic and non-hermetic packaging of MEMS and MOEMS devices
- Sensor Types – imaging, flow, pressure, LIDAR and tactile sensors
- Graphene – sensors applied in structural performance monitoring
- 3D Printing – how 3D printing technologies are making an impact in sensor manufacturing
The Provisional Agenda for the Conference is shown below (subject to change).
|10:00||Welcome and Introduction to IMAPS-UK|
|10:15||Session 1: Packaging Challenges: Vacuum, Hermetic and Non-Hermetic Solutions|
|1: Vacuum Packaging of MEMS Systems||Ashwin Seshia, University of Cambridge|
|2: Packaging of MOEMS LIDAR Sub-assembly||Jonathan Abdilla, BESI|
|3. Packaging of Sensors in Non-Hermetic Applications||John Boston, CIL UK|
|11:30||Session 2: Packaging Case Studies|
|4. Upgrade of Pressure Sensor Interface for High Temperature and CoB||Piers Tremlett, Microchip|
|5. High Resolution 3D Printing and Self Powered Tactile Sensors||Manish Tiwari, UCL|
|12:15||Lunch and Break|
|13:00||Session 3: Packaging Challenges - Flow, Optical and Graphene Sensors|
|6: Flow Sensor Package Design||Andrea de Luca, Flusso|
|7: Imaging Sensor Development: From the Visible and Beyond||Ross Wheeler, Teledyne E2V|
|8: Ultra-sensitive Graphene Sensors for Monitoring Performance and Structural Integrity in Power Electronics||Zlatka Stoeva, DZP Technologies|
|14:00||9: Q&A Session|
|14:30||Closing Remarks and End|
Bookings for Making Sense of Sensors are open and we welcome participants from Academia, Industry and Research, including non-members.
In a move to further the promote the benefits of membership, the “Making Sense of Sensors – Online” Conference is Free to Attend for the following categories of IMAPS-UK Members (Individual, Corporate, Academic, Student) and Members of IMAPS Worldwide.
Non-Members of IMAPS (including those only registered on IMAPS-UK website) will be charged a registration fee of £50 (exc VAT).
For further information, please contact the IMAPS-UK Secretariat, below:
Telephone: + 44 (0)131 202 9004
Book Event Tickets
When booking the event, please ensure that the Delegate Name is included on the booking form, if you are not the person attending. Please note that the person booking the event will be the only person who will have access to event booking history and be able to download any event materials .
Bookings are now closed for this event. - Please contact the IMAPS-UK office for further details
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Date(s) - 12/11/2020
10:00 am - 3:00 pm
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