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Micro-Electronics Packaging for Harsh Environments IMAPS-UK Webinar

The next  IMAPS-UK Webinar is … “Micro-Electronics Packaging for Harsh Environments”
Monday 20th January 2020 @ 14.30

This is a free to join event      –   Book your place here

This is the fifth in a series of webinars organised by IMAPS (International Microelectronics, Assembly and Packaging Society) to showcase presentations given at previous IMAPS-UK events. The series will be continued by Callum Middleton and Suzanne Costello, and the presentations were first given at the IMAPS-UK “Micro-Electronics Packaging for Harsh Environments” in the Satellite Applications Catapult, Harwell in November 2019.

What Works and What Doesn’t? – Advanced Materials Analysis for Microelectronics Reliability in Harsh Environments
Suzanne Costello – MCS Ltd

Microstructural analysis enables us to study the behaviour of the materials which we use to build electronics assemblies. Changes at a microstructural level lead to changes in macroscopic performance. Conventional methods for microstructural analysis (cut, grind and polish) are well established. These techniques have limitations however, not least, some level of deformation and damage induced in the sample by the preparation process itself. The recent availability of alternative processes represents an important opportunity to improve our understanding of material performance. The use of MCS Perfect Edge(tm) coupled with microanalysis techniques including electron backscatter diffraction (EBSD) offer profound changes in our ability to understand the microstructural mechanisms which lead to deterioration and failure. Furthermore, these techniques can be used successfully on the most challenging of samples which have traditionally been consider impractical or impossible to assess.

Suzanne Costello: Following completion of her Master’s degree in Physics and Engineering Doctorate in Microsystems Engineering at Heriot-Watt University (sponsored by MCS), Suzanne joined the MCS team in 2011 as a materials scientists specialising in electronics packaging. Over the course of the past 8 years, Suzanne has developed within the business through several technical roles and recently joined the leadership team whilst retaining a key scientific role as a packaging specialist. MCS is a consultancy business providing industrial forensic science services. We combine expert knowledge and state-of-the-art materials analysis tools to solve materials, manufacturing and reliability to problems for customers around the world within tight commercial timeframes. Suzanne’s technical interests lie reliability modelling supported by physical failure analysis and in understanding new interconnect materials and defining how they respond in harsh environments. She has a keen interest in supporting the microelectronics packaging community and was the first female Chair of IMAPS-UK.

Heat Spreading in High Power Density Electronics
Callum Middleton – Compound Semiconductor Applications Catapult

As microelectronics users demand higher and higher power usage in ever decreasing footprints, thermal extraction becomes an ever-increasing problem. This is particularly a problem in wide bandgap compound semiconductors such as gallium nitride and silicon carbide, which will be key enablers of future 5G, IoT and electric vehicle technologies. In these compound semiconductors the inherently higher breakdown fields (approximately one order of magnitude higher than of silicon) mean that devices can operate at significantly higher power densities. Ensuring that these devices can be utilised to their fullest will require a range of novel heat spreading materials and architectures in both the near junction and package regions.

Callum Middleton is a Materials Engineer at the CSA Catapult based in Newport and a key member of the CSAC Advanced Packaging Engineering team. Callum works to ensure that cutting edge materials are utilised in the microelectronics packages of the future to facilitate the very best in thermal management and reliability. He completed his PhD in the use of diamond for passive cooling of high-power density wide bandgap devices in 2018 and has since worked in the defence industry before joining the catapult. He is skilled in a variety of materials characterisation and temperature measurement techniques and specialises in using these measurements to inform Multiphysics simulations of microelectronic package designs for optimisation purposes.

Book your place here

In preparation for the event and to ensure you are equipped to get the maximum benefit from the event, please read our simple Webinar Guidelines.

Webinar will run for between 60-90min with a question and answer session. The webinars are limited to 100 delegates/companies