Microelectronics Packaging Workshop: Thursday 30 October 2025 – Granta Centre, Granta Park, Cambridge
Microelectronics Packaging Workshop – From Theory to Practice
IMAPS-UK is organising a Microelectronics Packaging Workshop – From Theory to Practice which will be held on Thursday 30 October 2025 at the Granta Centre, Granta Park, Abington, Cambridge, CB21 6AL.

Download the Microelectronics Packaging Workshop Flyer.
Microelectronics packaging techniques are crucial for ensuring the functionality, reliability and longevity of electronic devices. Packaging provides protection, interconnection and thermal management of electronic devices. This workshop provides the opportunity to learn about microelectronics packaging techniques and their application illustrated by case studies in the real world.
Following the Workshop introduction, the morning talks will cover the main packaging processes and methods:
- Die Attach
- Wire Bond and Interconnection
- Package Options
- Inspection
In the afternoon, a series of case studies will be presented covering many aspects of applying packaging processes into real-life applications, highlighting the challenges faced and solutions found.
Workshop Agenda
| Time | Title | |
|---|---|---|
| 08:30 | Registration and Networking | |
| 09:15 | Welcome to Workshop and Introduction to IMAPS-UK | |
| 09:30 | Packaging Technologies Overview | |
| 09:30 | Die Attach for Microelectronics and Power Electronics Assembly | Steve Riches, Tribus-D Ltd |
| 10:15 | Wire Bonding in Semiconductor Manufacturing: Technologies and Trends | Tobias Hickmann, TPT Wire Bonder GmbH |
| 11:00 | Refreshment Break | |
| 11:15 | Packages for Electronic Devices | Eamonn Redmond, Inseto (UK) Ltd |
| 12:00 | Inspection Techniques for Electronic Assemblies | Ben Seviour, IPP Group Ltd |
| 12:45 | Lunch and Networking | |
| 13:45 | Case Studies | |
| 13:45 | Partial Discharge in Lightweight Dielectric Materials | Martin Wickham, NPL |
| 14:05 | High Pressure Silver Sintering for Silicon Carbide and the Future of Next Generation Packaging | Claudia Ferreira, CSA Catapult |
| 14:25 | Industrialising Embedded Die Packaging for Power Electronics | Peter Green, RAM Innovations |
| 14:45 | Refreshment Break | |
| 15:00 | Monitoring Humidity and Temperature inside Hermetic Packages for Active Implantable Medical Devices | Melissa Ng Tseung, King's College London |
| 15:20 | Challenges Accessing Advanced Packaging Technologies | Chris Lewins, Hybrid Integration Ltd |
| 15:40 | High Frequency Collaboration | Eamonn Redmond, Inseto (UK) Ltd |
| 16:00 | Q&A and Concluding Remarks | |
| 16:30 | Depart |
The workshop will address the training needs of students and researchers within Colleges and Universities and personnel within Industrial companies to assist in the upskilling and reskilling of people for the design, manufacture and testing of electronics modules. Attendees can request a Certificate of Attendance that can be used as proof of Continuous Professional Development.
Who Should Attend?
- Engineers and Technicians involved in Microelectronics Design, Manufacture and Test
- Undergraduates, Post-graduates and Early Career Professionals interested in Electronics Research, Development and Productions
- Quality Engineers, Supply Chain Personnel and Managers wanting to gain an appreciation of the processes used in microelectronics assembly
Registration
Registration for the Microelectronics Packaging Workshop is open below.
- IMAPS-UK Member: £80 – Ticket MPW25-01
- Non-Member: £140 – Ticket MPW25-02
- Non-Member Students (Undergraduates and Postgraduates): £40 – Ticket MPW25-03
Prices shown are exclusive of VAT and inclusive of lunch and refreshments.
Travel Fund for PhD and Undergraduate Students – Open for Application
IMAPS-UK is pleased to announce that some funds are available to support economy rail travel costs for UK-based Undergraduate and PhD students attending the Workshop, subject to an eligible case being submitted by PhD and Undergraduate Supervisors. The Supervisor will need to e-mail the IMAPS-UK Office to confirm that their student does not have access to institutional funds to cover travel costs. Applications will be responded to as soon as possible.
Consent:
I confirm that my name and institution/organisation can be included in the attendee list for the workshop.
Please e-mail the IMAPS-UK Office if you have an objection to the above consent.
Cancellation Policy
Please click on Cancellation Policy for information on cancellations for bookings
.
For further information, please contact:
IMAPS-UK Secretariat
Telephone: + 44 (0)131 202 9004
Email: office@imaps.org.uk
Book Event Tickets
When booking the event, please ensure that the Delegate Name is included on the booking form, if you are not the person attending. Please note that the person booking the event will be the only person who will have access to event booking history and be able to download any event materials .
Bookings are now closed for this event. - Please contact the IMAPS-UK office for further details
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Date/Time
Date(s) - 30/10/2025
8:30 am - 4:30 pm
TWI Cambridge
