Date(s) - 09/04/2018 - 10/04/2018
Book Tickets | Event programme | Event Trailer Presentation | Sponsorship Brochure | Exhibition Brochure | Workshop Brochure
About MicroTech 2018:
In 2018, IMAPS-UK celebrates 50 Years since the foundation of ISHM (The International Society for Hybrid Microelectronics), the forerunner to today’s IMAPS.
Join us at this special event, comprising a Pre-Conference Workshop followed by the Gala Awards & Networking Dinner on the evening of the 9th April and the Society’s Annual Conference on the 10th April, at the prestigious Royal Holloway Windsor Conference Centre in Egham Surrey.
The Gala Dinner will feature Company and Individual of the Year Awards, plus a keynote providing an insight into the future Technologies and Trends and a special presentation looking at the development of IMAPS-UK and the various microelectronics packaging technologies we see today.
Continuing the events theme “MOORE THAN PACKAGING: 50 Years Gone; 50 Years on”, the Annual Conference will bring together experts from across the microelectronics sector to discuss the latest technologies and developments, as well as providing a platform to highlight current commercial opportunities.
Sessions will cover: Process & Technologies, Materials, Applications and Trends, followed by a Panel Session looking at the future direction, challenges and technologies our industry faces.
Who Should Attend:
End-Users, Manufacturers, Production & Manufacturing Engineers, Researchers & Developers, Scientists, Supply Chain Companies, Process Engineers, Product Designers & Students etc.
Bookings for MicroTech 2018 are now open to all, including non-members. The reduced members’ rates are applicable to all paying IMAPS-UK Members, in addition to NMI Members (all bookings are checked to verify Membership status).
|Date||Delegate Ticket Overview||Member Rate||Non-Member Rate|
|9th April||The science of bond testing Workshop, delegate ticket.||£90.00||£120.00|
|9th April||Gala Dinner Ticket (additional - on its own)||£62.50||£62.50|
|10th April||MicroTech Conference Only Ticket||£100.00||£150.00|
|9-10th April||Gala Dinner + Conference Ticket||£150.00||£200.00|
|9-10th April||Gala Dinner + Conference Ticket + Onsite B&B Accommodation (bookable only until 26 March)||£215.00||£280.00|
PLEASE NOTE THAT THE DRESS CODE FOR THE DINNER IS – SMART CASUAL/BUSINESS
|11:30||The Science of Bond Testing Workshop|
(Optional workshop, by ticket only. Conference only ticket does not give access)
|Bob Sykes (XYZtec).|
(Optional event, by ticket only. Standard Conference only ticket does not give access)
|- Welcome Reception & Networking|
|- Sit down 3 course meal (Smart Casual)|
|- Gala Dinner Keynote: “A Walk Through 50 Years of the Microelectronics Industry in the UK”||Malcolm Penn, Future Horizons|
|- IMAPS-UK 50 Years Gone: The Good, The Bad & The Not So Ugly||Dr Peter Barnwell, IMAPS-UK Treasurer & Trustee|
|10:30||Gala Dinner Finish|
|08:00||Registration, Exhibition & Networking|
|09:00||Session One: Applications & Trends|
|Conference Keynote: Advanced Packaging - Where Have we Been and Where are we Going?||E. Jan Vardaman, TechSearch International|
|09:40||The Evolution of Photonics Packaging||Bob Musk, Entroptix Ltd|
|10:05||A stroll Down Memory Lane of 50 years Wirebonding, with Some Peeks into Blind Alleys, and a View of the Road(s) Ahead||Dr Josef Sedlmair, F&K Delvotec|
|10:30||Mid-Morning Break: Coffee, Tea & Refreshments, Exhibition & Networking|
|11:00||Session Two: Materials|
|Hermetic and Radiation Tolerant Glass Package for VCSELs using Additive Free Bonding technique||Heidi Lunden, Primoceler Oy
|11:25||Die Attach Adhesive using Semi-Sintering Technology for improved thermal performance and good workability||Tony Winster, Henkel Ltd|
|12:05||IMAPS-UK Annual General Meeting|
|12:30||Lunch, Exhibition, Networking & Poster Session|
|13:50||Session Three: Panel Session....Future Direction, Challenges and Technologies||A debate led by iNEMI, including panelists from AMKOR, TechSearch, the KTN, Global SMT & Packaging.|
|14:50||Session Four: Process & Technologies|
|Flip-chip Bonding: How to Meet High Accuracy requirements?||Jean-Stephane Mottet, SET|
|15:15||Mid-Afternoon Break: Coffee, Tea & Refreshments, Exhibition & Networking|
|15:45||Equipment Enhancements for Transient Liquid Phase Bonding (TLPB) and Sintering||Dr Ventzeslav Rangelov, ATV|
|16:10||X-ray Advances in Support of Advanced Packaging - Today and Tomorrow||David Bernard, DB Consultancy|
|16:35||Surface Metrology for Wirebond Inspection||Dr. Bastian Lindl, Cyber Technologies|
|17:00||Closing Remarks & End.|
Exhibitors at MicroTech 2018:
Visit the tabletop exhibits of the following Companies/organisations at this years event:
Interested in attending MicroTech 2018 as an exhibitor? A number of table-tops are available on a first-come, first-served basis; book early to avoid disappointment.
Download Exhibition brochure HERE
All exhibitors receive one Conference Ticket, one Gala Dinner Ticket, one nights B&B accommodation onsite (if booked before 26 March), plus hot listings on the IMAPS-UK website, entries in the event programme and the opportunity to provide a short introduction to the delegates during the exhibitor briefings in the Conference.
Five reasons to exhibit at MicroTech 2018:
- It’s “Where the Industry Meets”
- See multiple customers in one location
- Showcase products or services
- Enforce your brand & raise your profile
- Discover new industry & business contacts
|Date||Exhibitor Ticket Overview||Member Rate||Non-Member Rate|
|9-10th April||Gala Dinner + Conference Ticket + Onsite B&B Accommodation + Exhibitor Tabletop (Accommodation can only be guaranteed if booked before 26 March)||£525.00|
Must be an IMAPS-UK Corporate Member
|9th April||Gala Dinner Ticket (additional - on its own)||£62.50||£62.50|
Take advantage of the importance of this Prestigious Event and its’ exposure worldwide by sponsoring elements of the Gala Dinner and/or the Conference. To reserve a sponsorship opportunity, please contact the secretariat (details below).
Details of the sponsorship packages can be downloaded HERE
The deadline for booking special rates for bed and breakfast accommodation onsite at Royal Holloway has now passed and so no ticket options including accommodation remain available. If you still require accommodation, some may be available at the Royal Holloway College “HUB” – please check on on https://venue-booking.royalholloway.ac.uk/BnB/
NOW SOLD OUT the optional pre-conference WORKSHOP, “The Science Of Bond Testing” on Mon 9th April
This half day workshop will be led by Bob Sykes of XYZTec. Bob teaches the fundamental principles of the science and goes on to discuss its application in many typical examples. Questions on your existing and new applications are encouraged for an illustration on how to design the optimum bond test. The work shop is relevant to anyone who relies on Bond Test data, including, Package Designers (design for test), Production Engineers, Quality Assurance Managers.
Telephone: + 44 (0)131 202 9004
MicroTech 2018 Gold Sponsors:
Book Event Tickets
When booking the event, please ensure that the Delegate Name is included on the booking form, if you are not the person attending. Please note that the person booking the event will be the only person who will have access to event booking history and be able to download any event materials .
Bookings are closed for this event.
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