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MicroTech 2018 – MOORE THAN PACKAGING: 50 Years Gone; 50 Years On!

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About MicroTech 2018:

IMAPS-UK Celebrates 50 Years

In 2018, IMAPS-UK celebrates 50 Years since the foundation of ISHM (The International Society for Hybrid Microelectronics), the forerunner to today’s IMAPS.

Join us at this special event, comprising a Pre-Conference Workshop followed by the Gala Awards & Networking Dinner on the evening of the 9th April and the Society’s Annual Conference on the 10th April, at the prestigious Royal Holloway Windsor Conference Centre in Egham Surrey.

The Gala Dinner will feature Company and Individual of the Year Awards, plus a keynote providing an insight into the future Technologies and Trends and a special presentation looking at the development of IMAPS-UK and the various microelectronics packaging technologies we see today.

Continuing the events theme “MOORE THAN PACKAGING: 50 Years Gone; 50 Years on”, the Annual Conference will bring together experts from across the microelectronics sector to discuss the latest technologies and developments, as well as providing a platform to highlight current commercial opportunities.

Sessions will cover: Process & Technologies, Materials, Applications and Trends, followed by a Panel Session looking at the future direction, challenges and technologies our industry faces.

Who Should Attend:

End-Users, Manufacturers, Production & Manufacturing Engineers, Researchers & Developers, Scientists, Supply Chain Companies, Process Engineers, Product Designers & Students etc.

Delegate bookings:

Bookings for MicroTech 2018 are now open to all, including non-members.  The reduced members’ rates are applicable to all paying IMAPS-UK Members, in addition to NMI Members (all bookings are checked to verify Membership status).

DateDelegate Ticket OverviewMember RateNon-Member Rate
9th AprilThe science of bond testing Workshop, delegate ticket.£90.00£120.00
9th AprilGala Dinner Ticket (additional - on its own)£62.50£62.50
10th AprilMicroTech Conference Only Ticket£100.00£150.00
9-10th AprilGala Dinner + Conference Ticket£150.00£200.00
9-10th AprilGala Dinner + Conference Ticket + Onsite B&B Accommodation (bookable only until 26 March)£215.00£280.00





9th April

11:30The Science of Bond Testing Workshop
(Optional workshop, by ticket only. Conference only ticket does not give access)
Bob Sykes (XYZtec).
17:00Workshop Finish
19:00Gala Dinner
(Optional event, by ticket only. Standard Conference only ticket does not give access)
- Welcome Reception & Networking
- Sit down 3 course meal (Smart Casual)
- Gala Dinner Keynote: “A Walk Through 50 Years of the Microelectronics Industry in the UK”Malcolm Penn, Future Horizons
- IMAPS-UK 50 Years Gone: The Good, The Bad & The Not So UglyDr Peter Barnwell, IMAPS-UK Treasurer & Trustee
10:30Gala Dinner Finish

10th April

08:00Registration, Exhibition & Networking
09:00Session One: Applications & Trends
Conference Keynote: Advanced Packaging - Where Have we Been and Where are we Going?E. Jan Vardaman, TechSearch International
09:40The Evolution of Photonics PackagingBob Musk, Entroptix Ltd
10:05A stroll Down Memory Lane of 50 years Wirebonding, with Some Peeks into Blind Alleys, and a View of the Road(s) AheadDr Josef Sedlmair, F&K Delvotec
10:30Mid-Morning Break: Coffee, Tea & Refreshments, Exhibition & Networking
11:00Session Two: Materials
Hermetic and Radiation Tolerant Glass Package for VCSELs using Additive Free Bonding techniqueHeidi Lunden, Primoceler Oy
11:25Die Attach Adhesive using Semi-Sintering Technology for improved thermal performance and good workabilityTony Winster, Henkel Ltd
11:50Exhibitor Briefings
12:05IMAPS-UK Annual General Meeting
12:30Lunch, Exhibition, Networking & Poster Session
13:50Session Three: Panel Session....Future Direction, Challenges and TechnologiesA debate led by iNEMI, including panelists from AMKOR, TechSearch, the KTN, Global SMT & Packaging.
14:50Session Four: Process & Technologies
Flip-chip Bonding: How to Meet High Accuracy requirements?Jean-Stephane Mottet, SET
15:15Mid-Afternoon Break: Coffee, Tea & Refreshments, Exhibition & Networking
15:45Equipment Enhancements for Transient Liquid Phase Bonding (TLPB) and SinteringDr Ventzeslav Rangelov, ATV
16:10X-ray Advances in Support of Advanced Packaging - Today and TomorrowDavid Bernard, DB Consultancy
16:35Surface Metrology for Wirebond InspectionDr. Bastian Lindl, Cyber Technologies
17:00Closing Remarks & End.

Exhibitors at MicroTech 2018:

Visit the tabletop exhibits of the following Companies/organisations at this years event:

Interested in attending MicroTech 2018 as an exhibitor? A number of table-tops are available on a first-come, first-served basis; book early to avoid disappointment.

Download Exhibition brochure  HERE

All exhibitors receive one Conference Ticket, one Gala Dinner Ticket, one nights B&B accommodation onsite (if booked before 26 March), plus hot listings on the IMAPS-UK website, entries in the event programme and the opportunity to provide a short introduction to the delegates during the exhibitor briefings in the Conference.

Five reasons to exhibit at MicroTech 2018:

    • It’s “Where the Industry Meets”
    • See multiple customers in one location
    • Showcase products or services
    • Enforce your brand & raise your profile
    • Discover new industry & business contacts

DateExhibitor Ticket OverviewMember RateNon-Member Rate
9-10th AprilGala Dinner + Conference Ticket + Onsite B&B Accommodation + Exhibitor Tabletop (Accommodation can only be guaranteed if booked before 26 March)£525.00
Must be an IMAPS-UK Corporate Member
9th AprilGala Dinner Ticket (additional - on its own)£62.50£62.50



Take advantage of the importance of this Prestigious Event and its’ exposure worldwide by sponsoring elements of the Gala Dinner and/or the Conference. To reserve a sponsorship opportunity, please contact the secretariat (details below).

Details of the sponsorship packages can be downloaded  HERE


The deadline for booking special rates for bed and breakfast accommodation onsite at Royal Holloway has now passed and so no ticket options including accommodation remain available. If you still require accommodation, some may be available at the Royal Holloway College “HUB” – please check on on

NOW SOLD OUT  the optional pre-conference WORKSHOP, “The Science Of Bond Testing” on Mon 9th April

This half day workshop will be led by Bob Sykes of XYZTec. Bob teaches the fundamental principles of the science and goes on to discuss its application in many typical examples. Questions on your existing and new applications are encouraged for an illustration on how to design the optimum bond test.  The work shop is relevant to anyone who relies on Bond Test data, including, Package Designers (design for test), Production Engineers, Quality Assurance Managers.

Workshop Brochure | Book main conference tickets

For further information, please contact:

IMAPS-UK Secretariat
Telephone: + 44 (0)131 202 9004

MicroTech 2018 Gold Sponsors:


Book Event Tickets

When booking the event, please ensure that the Delegate Name is included on the booking form, if you are not the person attending. Please note that the person booking the event will be the only person who will have access to event booking history and be able to download any event materials .

Bookings are now closed for this event. - Please contact the IMAPS-UK office for further details

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Date(s) - 09/04/2018 - 10/04/2018
All Day

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