IMAPS-UK Altogether, better connected!

MicroTech 2019: “Power in Packaging”

Date/Time
Date(s) - 04/04/2019
8:30 am - 5:00 pm

Location
Granta Centre

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Categories

Book Tickets | Event Programme | Call for Abstracts | Event Brochure | Workshop Brochure

About MicroTech 2019:

The MicroTech 2019 Conference & Exhibition, organised by IMAPS-UK, focuses on the rapidly developing UK Micro-electronics & Semiconductor Industry and applications for Power management components..

Touching on Technologies & Assembly Processes common to all areas of the Microelectronics community, MicroTech 2019 highlights many of the Emerging Technologies driven by this rapidly developing industry. Electric & Autonomous Vehicles developments hint at a future that has the potential to revolutionise the way we live our lives.

Demand for Renewable Energy Generation and the pressures on Power Distribution will only grow to support the demands of this increasingly electrified word. Advancements in Power Electronics and Semiconductor Packaging underpin many of these exciting changes.

MicroTech 2019 provides an opportunity to learn from leading Industry Experts and Equipment Manufactures as they share their experiences and developments in this rapidly changing industry. Topics to be covered include:

  • Power Electronics & Semiconductor Industry Trends
  • Related Packaging Technologies
  • Thermal Management & Materials
  • Design & Process Optimisation
  • Application Examples & Case Studies

EVENT SPONSORS:

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Provisional Programme:

Agenda:

Start Finish Duration Details
08:00     Registration, Exhibition & Networking
08:55     Welcome and Introduction Dr Anne Vanhoestenberghe, IMAPS-UK Chair

09:00           Session One: “Power Electronics and Semiconductor Industry Trends”
09:00     1 – Keynote – Power Packaging Trends and Challenges -Dr Alec Gunner, New Business Streams Manager, TWI
09:40     2 – High Power Modules: The development of semiconductor chips and modules for Electric Vehicle applications – Neil Sellars, Times Electric  Product Manager, Dynex Semiconductor
10:05     3 – Power electronics for future powertrains – Dr Will Drury ,Global Technical Expert, Power Electronics, Ricardo Automotive (EMEA)
10:30           Mid-Morning Break: Coffee, Tea & Refreshments, Exhibition & Networking

11:00           Session Two: “Packaging Technologies”
11:00      4 – 3D-Printable Electrical Interconnects – Dr Harry Cronin, R&D Manager, DZP Technologies Ltd.
11:25      5 – Additive Manufacture of Interconnects with Copper Filled Adhesives and Pastes – Dr David Hutt, Reader in Electronics, Wolfson School of Mechanical, Electrical and Manufacturing Engineering, Loughborough University

11:50           Exhibitor Briefings:

12:05           IMAPS-UK: Annual General Meeting
12:30           Lunch, Exhibition, Networking & Poster Session

13:45           Session Three: “Thermal Management and Materials”
13:45     6 – Thermal management with liquid thermal interface materials – Adam Cerek, Team Leader Sales, Scheugenpflug AG
14:20     7 – Silicone gel solution capable of high temperature resistance – Thomas Seldrum, Technical Support and Development Scientist, Dow Chemicals
14:45     8 – High Power LTCC Modules – Franz Bechtold, VIA electronic GmbH, Member of the KOA Group
15:10           Mid-Afternoon Break: Coffee, Tea & Refreshments, Exhibition & Networking

15:45          Session Four: “Design and Process Optimisation”
15:45     9 – Process Development of Al-alloy Wire Bonding for High Temperature Power Electronics –  Christian Kersting, TSM, Kulicke & Soffa
16:10     10 – A Flux-Free Low Void Process Using Vacuum-Pressure Reflow System to Attach Cu DBC to Ni-Plated Baseplate – Matt Vorona SST Vacuum Reflow Systems
16:35     11 – Ultrasonic Bonding for Automotive Semiconductor and Battery Applications – Dr.-Ing. Michael Brökelmann, Research & Development, Hesse GmbH

17:00         Closing Remarks
Close

Who Should Attend:

End-Users, Manufacturers, Production & Manufacturing Engineers, Researchers & Developers, Scientists, Supply Chain Companies, Process Engineers, Product Designers & Students etc.

 

Pre-Conference Workshop : “Understanding Plasma Processes in Microelectronics Applications”

This half day workshop will be led by John Maguire from Nordson-MARCH. John teaches the fundamental principles of the science and goes on to discuss its application in many typical examples.

Further details, agenda and booking information is on the event website:  CLICK HERE

This Workshop is not limited only to MicroTech and will therefore require an additional booking (see below); spaces are limited, book early to avoid disappointment.

To Book your Workshop place – Click Here    … and select the MT19-07 or -08 Ticket

Networking Dinner:

Why not join your fellow delegates at the events Networking Dinner being held at the The Red Lion” in Whittlesford Bridge, Cambridge on the evening of Wednesday 3rd April. Guests will have the opportunity to interact over welcome drinks before the sit-down meal. MicroTech delegates can register for the dinner as an additional option when registering for the event, however do note that there is a limit to the number of places available …..

To Book your Dinner place – Click Here    ….. and select the MT19-10 Ticket

CALL for Presentations (and/or Posters):

We invite submission of abstracts in the following areas:

  • Research Papers: These will describe high-impact academic research relating to the conference topic of “Power in Packaging”.
  • Technical Presentations: Technical presentations showcasing in-production or pre-production techniques relating to the conference topics.
  • Current/Future trends: Presentations demonstrating how markets related to the main conference topics are developing over time.

All abstracts received by the submission deadline will be evaluated by the organising committee. Abstracts covering a balanced range of the main conference topics will be selected and invited to provide an oral presentation (20mins + 5mins questions) or poster presentation (A0 size) during the conference.  Some poster presenters may also be invited to provide a brief oral presentation showcasing their poster content to the full audience.

Download a copy of the Call document – HERE

Delegate Registration:

The event is open to all including non members, the following delegate rates (inclusive of free parking, lunch & refreshments) apply:

IMAPS-UK Member: £85
IMAPS-UK Student Member: £30
IMAPS-UK Partners: £110 (IEEE-EPS & NMI/Techworks)
Non Member: £155

Pre- Conference Networking Dinner : £ 35.00

All prices shown are exclusive of VAT.

To Book your Conference place – Click Here

 

Sponsor MicroTech 2019: 

IMAPS-UK is pleased to be able to offer sponsorship opportunities for this , our Annual Conference and exhibition “MicroTech 2019.”  This is the only Microelectronics  Conference in the UK and it is  “Where the Industry Meets”.  

There are small number of Sponsorship Packages available offering each sponsor a full exhibitor package; 1 full A4 advert in the event programme handbook,  logo and links on all promotion and website; 1 banner display in the conference hall and 1 banner display in the registration area,  plus a complimentary place at the speaker dinner.

The Sponsorship Package is offered at £ 1600.  

To book a package, please register your interest with the IMAPS-UK secretariat office (address below).

Exhibit at MicroTech 2019:

Interested in attending MicroTech 2019 as an exhibitor? A number of table-tops are available on a first-come, first-served basis; book early to avoid disappointment.

The Exhibitor package offers a place for One person with full access to the Conference, a table top display with room behind for 2 small pop-up banners. Additionally exhibitors will get listings on the IMAPS-UK website, a free advert and entry in the event programme and the opportunity to provide a short introduction to the delegates during the exhibitor briefing session at the Conference.

Five reasons to exhibit at MicroTech 2019:

  • It’s “Where the Industry Meets”
  • See multiple customers in one location
  • Showcase products or services
  • Enforce your brand & raise your profile
  • Discover new industry & business contacts

Exhibitor Rates:

IMAPS-UK Member exhibitor: £350
Non Member Exhibitor: £550

Prices shown are exclusive of VAT.

To Book a tabletop – Click Here  …. and select the MT19-05 or -06 Ticket

 

Accommodation:

The following hotels are local to the venue at Granta Park, Abington:

  • Holiday Inn Express Cambridge Duxford M11 Jct 10 (Location of event dinner)
  • The Red Lion at Whittlesford Bridge (Location of event dinner)
  • Travelodge Cambridge Fourwentways (closest to venue)

Bookings should be made directly with the hotel chosen.

 

Partner Organisations:

IMAPS-UK continues to welcome the support of the following Organisations as Partners with this event:

 

For further information, please contact:

IMAPS-UK Secretariat
Telephone: + 44 (0)131 202 9004
Email: andy.longford@imaps.org.uk

Book Event Tickets

When booking the event, please ensure that the Delegate Name is included on the booking form, if you are not the person attending. Please note that the person booking the event will be the only person who will have access to event booking history and be able to download any event materials .

This event is fully booked.

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